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Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad
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作者 Fuquan LI Chunqing WANG Yanhong TIAN 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第3期392-396,共5页
Sn-Pb 的界面的现象在 Au/Ni/Cu 上焊接微滴填 reinvestigated。连续 AuSn_2 和像针的 AuSn_4 在液态反应以后在接口被形成(焊接) 。在 solder 和 Au 层之间的界面的反应在稳固的州的老化期间继续, AuSn_4 从接口和 felling 折断进 th... Sn-Pb 的界面的现象在 Au/Ni/Cu 上焊接微滴填 reinvestigated。连续 AuSn_2 和像针的 AuSn_4 在液态反应以后在接口被形成(焊接) 。在 solder 和 Au 层之间的界面的反应在稳固的州的老化期间继续, AuSn_4 从接口和 felling 折断进 thes 更旧。进 solder 的 Au 层溶解和散开的动力学在焊接并且变老期间被分析阐明在 solder/Au 垫接口的金属间化合的形成机制。焊接 / 填接口附近的 Au 的 Theconcentration 被识别在液态反应的时期期间增加并且到达溶解度限制。在稳固的州的反应期间, Au-Sn 化合物变厚被元素散开主要控制。 展开更多
关键词 锡-铅焊剂 交互作用动力学 金属间化合 老化 金/镍/铜底垫
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Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate
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作者 Yingzong Liu Yuanxing Li +1 位作者 Hui Chen Zongtao Zhu 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2024年第2期726-741,共16页
Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi... Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals. 展开更多
关键词 Ultrasonic-assisted soldering Mg_(2)Sn Ni coating layer Shear strength
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A Study on Plastic Deformation Resistance of Sn-Pb-RE Solder 被引量:1
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作者 朱颖 康慧 +2 位作者 曲平 方洪渊 钱乙余 《Journal of Rare Earths》 SCIE EI CAS CSCD 1999年第4期289-292,共4页
The plastic deformation of solder joint depends on the plastic deformation resistance of solder. The studyon plastic deformation resistance of Sn-Pb-RE solder at room temperature shows that with the increase 0f RE con... The plastic deformation of solder joint depends on the plastic deformation resistance of solder. The studyon plastic deformation resistance of Sn-Pb-RE solder at room temperature shows that with the increase 0f RE content, theplastic deformation resistance of Sn-Pb-RE solder enhances. The microstructure investigation reveals'that the addition ofRE makes the microstructure of solder fine and homogeneous, which enhances hwher hardening and multi-sliding hardening. Moreover, RE on grain boundaries hinders the grain boundary sliding. Therefore, the deformation resistance ofsolder enhances. However, since it is very hard, the intermetallic compounds of RE near fracture surface will cause intergranular cracks around it. 展开更多
关键词 Rare earths Plastic deformation resistance sn-pb-RE solder
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Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders 被引量:1
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作者 陈茂爱 蒋元宁 +1 位作者 D.P.Sekulic 赵慧 《China Welding》 EI CAS 2010年第3期16-20,共5页
SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualizatio... SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner' s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pustes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases. 展开更多
关键词 wetting kinetics composite solder NANOPARTICLE SPREADABILITY
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High temperature rupture of Sn-Pb-0.05RE solder alloy
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作者 王莉 方洪渊 钱乙余 《中国有色金属学会会刊:英文版》 EI CSCD 1999年第4期822-825,共4页
Specimens of Sn-Pb-0.05RE solder alloy were tested to failure under two different stress states,uniaxial tension using smooth bar specimens and triaxial tension using notched bar specimens. The tests were conducted at... Specimens of Sn-Pb-0.05RE solder alloy were tested to failure under two different stress states,uniaxial tension using smooth bar specimens and triaxial tension using notched bar specimens. The tests were conducted at a temperature of 125℃, far above 0. 5 melting temperature of Sn-Pb-0.05RE solder alloy,which leads to a distinctive creep deformation. Rupture times were compared for uniaxial and triaxial stress states with respect to multiaxial stress parameters that are directly related to physical fracture mechanisms.The success of the parameters was judged according to how well the stress parameters correlate with the time to rupture. The results show that the Mises effective stress is the stress factor which dominates the creep rupture of Sn-Pb-0. 05RE solder alloy. It further suggests that the cavity nucleation on a grain boundary plays an important role in the creep rupture process of Sn-Pb-0.05RE solder alloy. 展开更多
关键词 sn-pb-0.05RE soder alloy CREEP RUPTURE STRESS factor MULTIAXIAL STRESS
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Microstructure and properties of AgCu/2 wt%Ag-added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering
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作者 Wei Liu Rong An +3 位作者 Ying Ding Chun-Qing Wang Yan-Hong Tian Kun Shen 《Rare Metals》 SCIE EI CAS CSCD 2022年第6期1983-1988,共6页
The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb an... The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb and 62Sn36Pb2Ag solder pastes were used to join Cu(1.7 wt%-2.5 wt%)Be and Ag(2 wt%-5 wt%)Cu alloys.Two fracture modes are observed in 62Sn36Pb2Ag and 63Sn37Pb joints after lateral shear tests at room temperature or 120℃,and shear forces of 62Sn36Pb2Ag joints are far higher than those of 63Sn37Pb joints.No obvious difference is observed in morphology and thickness of intermetallic compounds(IMCs)at interfaces of the 63Sn37Pb and 62Sn36Pb2Ag joints.Within the two kinds of joints,for-mation of big blocky or plate-like Ag_(3)Sn is restrained.However,many Ag_(3)Sn IMCs particles(1-3 μm in width)in isolated and dispersed distribution are observed within 62Sn36Pb2Ag joints.The Ag3Sn particles are responsible for the better mechanical properties of 62Sn36Pb2 Ag joints than those of 63Sn37Pb joints.The results present in this paper may provide a guide for restraining formation of big blocky or plate-like Ag_(3) Sn in joints with Ag pads or thick Ag surface finish on pads by utilizing vapor phase soldering process,and improving mechanical properties of Cu/SnPb/Ag joints by adding Ag in SnPb eutectic solder. 展开更多
关键词 Microstructure Mechanical property 62Sn36Pb2Ag solder Ag Sn Vapor phase soldering
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A review of soldering by localized heating
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作者 崔鹏 杨婉春 +3 位作者 彭飞 祝温博 杨帆 李明雨 《China Welding》 CAS 2023年第2期1-15,共15页
In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm... In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research. 展开更多
关键词 localized soldering high heat dissipation small size induction soldering focused heating
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Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature
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作者 宋立志 肖勇 +2 位作者 奚邦富 李佳琪 张建 《China Welding》 CAS 2023年第2期23-31,共9页
Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ... Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder. 展开更多
关键词 5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties
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Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
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作者 Qilong Guan Chunjin Hang +4 位作者 Shengli Li Dan Yu Ying Ding Xiuli Wang Yanhong Tian 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2023年第2期16-28,共13页
The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned ab... The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments. 展开更多
关键词 Deep space exploration Extreme environments solder joints MICROSTRUCTURE ELECTRONICS RELIABILITY
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Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys
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作者 Shihab Uddin Md. Abdul Gafur Mohammad Obaidur Rahman 《Materials Sciences and Applications》 CAS 2023年第4期273-283,共11页
The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carrie... The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10<sup>-3</sup> s<sup>-1</sup>, 20.85 × 10<sup>-3</sup> s<sup>-1</sup>, and 208.5 × 10<sup>-3</sup> s<sup>-1</sup>. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements. 展开更多
关键词 Lead-Free solder Strain Rate Strain Sensitivity DUCTILITY Tensile Properties
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大尺寸AlN活性金属焊接覆铜基板的界面结合机理
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作者 许海仙 曾祥勇 +3 位作者 朱家旭 周泽安 张振文 汤文明 《电子元件与材料》 CAS 北大核心 2024年第5期573-577,584,共6页
基于190 mm×139 mm×0.635 mm的大尺寸AlN表面活性金属钎焊(AMB)覆铜板工艺制程,开展其界面显微组织、物相组成等的研究,确定钎焊界面结合机理,为制备大尺寸、低气孔、高剥离强度AlN-AMB覆铜板提供支持。结果表明,在大尺寸AlN-... 基于190 mm×139 mm×0.635 mm的大尺寸AlN表面活性金属钎焊(AMB)覆铜板工艺制程,开展其界面显微组织、物相组成等的研究,确定钎焊界面结合机理,为制备大尺寸、低气孔、高剥离强度AlN-AMB覆铜板提供支持。结果表明,在大尺寸AlN-AMB覆铜板钎焊过程中,Ag-Cu-Ti合金钎料中的Ag-Cu合金与Cu箔扩散溶合,形成强的冶金结合界面。同时,钎料中的活性Ti原子向AlN基板表面扩散,并与其反应,生成厚度为0.5~1μm的TiN反应层,形成强的反应结合界面。此外,钎料熔体难以填充基板的AlN晶界和凹坑,其中的Ti原子也不与Y-Al-O第二相颗粒反应,导致AlN基板表面TiN反应层不连续分布,形成气孔,降低大尺寸AlN-AMB覆铜板的界面结合强度及可靠性。 展开更多
关键词 氮化铝基板 活性金属钎焊 显微结构 相组成 AG-CU-TI钎料
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SnAgCu/SnBi混装焊点的热循环可靠性研究
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作者 王凤江 董传淇 《江苏科技大学学报(自然科学版)》 CAS 2024年第2期31-35,共5页
Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示... Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示了混装焊点热循环可靠性的应变演变行为.热循环试验发现混装焊点的寿命要优于SAC305无铅焊点.有限元计算表明,结构混装焊点内SnBi钎料层的添加能够减小最大非弹性应变范围,从而提升混装焊点的热循环可靠性. 展开更多
关键词 混装焊点 无铅钎料 可靠性 热循环 有限元
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PCB中耐高温有机可焊保护剂成膜机理及性能研究
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作者 王跃峰 姜其畅 +3 位作者 马紫微 贾明理 苏振 孙慧霞 《电子科技大学学报》 EI CAS CSCD 北大核心 2024年第4期487-494,共8页
印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比... 印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比实验,研究C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子反应生成HT-OSP膜机理。基于量子化学密度泛函理论,模拟C_(14)H_(10)Cl_(2)N_(2)分子与Cu^(+)之间的络合反应;利用红外光谱对HT-OSP膜中的特征官能团进行表征;借助X射线光电子能谱测试HT-OSP膜中Cu元素的化合价;设计对比实验分析Cu^(2+)对生成HT-OSP膜的影响。结果表明:HT-OSP膜生成机理是C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子发生反应生成HT-OSP膜并沉积在铜层表面,Cu^(2+)通过络合反应促进HT-OSP膜生长。另外,HT-OSP膜的分解温度高达531℃,HT-OSP膜保护的铜层放置在自然环境中180天没有被氧化,证明HT-OSP膜具有优异的耐热性和抗氧化性。 展开更多
关键词 表面处理技术 耐高温有机可焊保护剂 成膜机理 密度泛函理论 印制电路板
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基于度量学习的电路焊点缺陷检测方法
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作者 刘少丽 戚慧志 +1 位作者 杜浩浩 邓超 《北京理工大学学报》 EI CAS CSCD 北大核心 2024年第6期625-634,共10页
针对目前电路焊点缺陷检测方法效率低、准确度差、焊点图像样本量小的问题,提出了一种基于度量学习的快速识别焊点缺陷的方法.首先利用工业相机搭配远心镜头获取焊点图像.通过挖掘焊点图像特征,设计交点检测法来分割焊接单元图像,制作... 针对目前电路焊点缺陷检测方法效率低、准确度差、焊点图像样本量小的问题,提出了一种基于度量学习的快速识别焊点缺陷的方法.首先利用工业相机搭配远心镜头获取焊点图像.通过挖掘焊点图像特征,设计交点检测法来分割焊接单元图像,制作焊点缺陷数据集.在此基础上,设计焊点图像全局特征与局部表征提取方法来对焊点的两类特征进行融合,并对注意力机制进行改进,加入到全局特征提取模块中.对焊点缺陷的检测实验结果表明该方法最终实现了准确率达到98.4%,满足焊点缺陷检测的实际生产要求. 展开更多
关键词 焊点检测 图像分割 深度学习 度量学习 特征融合
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基于双目结构光的三维立体电路板焊点定位
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作者 刘少丽 黄嘉淳 +1 位作者 杜浩浩 邓超 《北京理工大学学报》 EI CAS CSCD 北大核心 2024年第6期615-624,共10页
三维立体电路将传统二维集成电路拓展至三维,在提高了电路板形状设计柔性的同时,也提升了电路板上元器件焊点定位的复杂度.为了降低三维立体电路加工过程中的人力成本,提高加工效率,设计了一种用于焊接机床对三维立体电路板焊点定位的... 三维立体电路将传统二维集成电路拓展至三维,在提高了电路板形状设计柔性的同时,也提升了电路板上元器件焊点定位的复杂度.为了降低三维立体电路加工过程中的人力成本,提高加工效率,设计了一种用于焊接机床对三维立体电路板焊点定位的双目结构光系统,并针对双目结构光系统在与焊接机床结合应用过程中存在的坐标转换、焊点识别困难等问题,从硬件与算法层面提出了解决方案.在软硬件的配合下,可以简单快速地完成双目结构光系统与焊接机床之间的坐标转换,并对电路板焊点完成定位与坐标计算,代替了人工对三维立体电路板焊点测量定位的复杂流程.实验表明,提出的方案具有较高的精度,能够满足机床焊接元器件过程中对焊点的定位需求. 展开更多
关键词 三维立体电路 双目结构光 焊接机床 坐标转换 焊点定位
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基于波峰焊桥连改善的设计优化研究
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作者 贺光辉 何日吉 +3 位作者 何骁 邹雅冰 周舟 李伟明 《印制电路信息》 2024年第6期52-55,共4页
波峰焊是一种常见的电装工艺焊接方式,而桥连是波峰焊工艺最为常见的焊接缺陷之一。介绍了波峰焊接桥连产生的机理,并分析了焊盘间距过近、引脚出脚长度过长,以及器件布局方向不当三种典型可制造性设计引起桥连的原因,并探讨了有助于波... 波峰焊是一种常见的电装工艺焊接方式,而桥连是波峰焊工艺最为常见的焊接缺陷之一。介绍了波峰焊接桥连产生的机理,并分析了焊盘间距过近、引脚出脚长度过长,以及器件布局方向不当三种典型可制造性设计引起桥连的原因,并探讨了有助于波峰焊接桥连改善的可制造性设计优化方案。 展开更多
关键词 波峰焊 桥连 可制造性设计 设计优化
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回流焊工艺对SMT器件热翘曲的影响
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作者 吕贤亮 杨迪 +1 位作者 毕明浩 时慧 《电子与封装》 2024年第5期37-41,共5页
集成电路正在向小型化、高集成度的方向发展,回流焊工艺已成为其组装过程中的关键技术。在回流焊过程中集成电路容易发生热翘曲现象。采用阴影云纹法对PBGA1296、PBGA1024器件在不同回流焊温度、升降温速率的回流焊工艺下的热翘曲进行测... 集成电路正在向小型化、高集成度的方向发展,回流焊工艺已成为其组装过程中的关键技术。在回流焊过程中集成电路容易发生热翘曲现象。采用阴影云纹法对PBGA1296、PBGA1024器件在不同回流焊温度、升降温速率的回流焊工艺下的热翘曲进行测量,在此基础上通过建模仿真对实验结果进行分析。结果表明,采用表面贴装技术(SMT)的BGA器件的热翘曲会随着回流焊温度的升高而增大,回流焊升降温速率较快同样会导致严重的热翘曲。实验结果与仿真结果高度一致,进而验证了仿真模型的准确性和有效性。采用实验结合有限元分析的方法为改善集成电路热翘曲提供了参考。 展开更多
关键词 封装技术 回流焊 SMT器件 热翘曲
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温度循环和随机振动载荷下堆叠封装焊点可靠性模拟研究
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作者 潘碑 王宏光 +2 位作者 李宇轩 葛振霆 陈鹏鹏 《固体电子学研究与进展》 CAS 2024年第2期161-166,共6页
采用有限元模拟研究了堆叠封装(Package on package, PoP)在温度循环和随机振动载荷下的焊点可靠性,包括封装内部的基板堆叠焊点和封装外部的板级互连焊点。通过应力分析定位危险焊点并计算焊点在温度循环下的疲劳寿命。模拟结果表明:... 采用有限元模拟研究了堆叠封装(Package on package, PoP)在温度循环和随机振动载荷下的焊点可靠性,包括封装内部的基板堆叠焊点和封装外部的板级互连焊点。通过应力分析定位危险焊点并计算焊点在温度循环下的疲劳寿命。模拟结果表明:在温度循环载荷下,应力主要集中于基板边角处焊点,基板堆叠焊点的疲劳寿命为3 002周次,板级互连焊点的疲劳寿命为1 552周次;在随机振动载荷下,两层焊点的应力值均较低,在50~2 000 Hz的随机振动频率范围内具有较高的可靠性。 展开更多
关键词 焊点可靠性 温度循环 随机振动 疲劳寿命预测 有限元模拟
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不同温度下Sn-Pb-RE钎料的力学性能实验研究 被引量:3
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作者 朱颖 康慧 +2 位作者 曲平 方洪渊 钱乙余 《稀土》 EI CAS CSCD 北大核心 1999年第2期54-56,共3页
本文分别在-55℃、25℃及125℃下对稀土含量为0~1.5%的Sn-Pb-RE系列钎料的拉伸性能进行了研究,结果表明,不同温度下,稀土的加入均可使钎料的拉伸强度提高,且稀土含量增加,提高程度增加。同时,本文还对稀土... 本文分别在-55℃、25℃及125℃下对稀土含量为0~1.5%的Sn-Pb-RE系列钎料的拉伸性能进行了研究,结果表明,不同温度下,稀土的加入均可使钎料的拉伸强度提高,且稀土含量增加,提高程度增加。同时,本文还对稀土的作用行为进行了初步讨论。 展开更多
关键词 稀土 钎粒 拉伸强度 力学性能
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基于Anand模型的BGA封装热冲击循环分析及焊点疲劳寿命预测
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作者 张惟斌 申坤 +1 位作者 姚颂禹 江启峰 《电子与封装》 2024年第3期45-49,共5页
BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置... BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置焊点的最大应力与主要失效位置进行了对比,并运用Darveaux模型计算出焊点最危险单元的裂纹萌生、裂纹扩展速率和疲劳寿命。结果表明,在热冲击极限载荷下,封装元件的温度呈现对称分布,表面温度与内部温度差较大,约为15℃;最大变形为0.038 mm,最大变形位置为外侧镀膜处;最大应力为222.18 MPa,内部其余部分的应力值为20 MPa左右。对于内部焊点,最大应力为19.02 MPa (250 s),应力最大位置在锡球下方边缘,预估其疲劳寿命为6.29天。 展开更多
关键词 BGA封装 Anand模型 焊点 热冲击 疲劳寿命
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