Sn-Zn合金包覆PAN基碳纤维/聚六氟丙烯有机光纤材料的制备

采用Sn-Zn合金包覆聚丙烯腈(PAN)基碳纤维,以聚六氟丙烯为载体制备塑料光纤(POF)皮层材料,并将POF皮层材料与聚苯乙烯光纤芯材进行匹配,研究了材料在力学性能、传输损耗性、光场强度方面的变化。结果表明:Sn-Zn合金表面包覆PAN基碳纤维与聚六氟丙烯结合紧密,作为POF皮层材料的效果良好,在最常见的650 nm波长、100 m内,传输低于100 Mb/s速率数据信息的能力符合要求,光信号基本环绕着光纤芯材传播,没有过多的光信号因为皮层材质的缘故而散失,表明该皮层材料与聚苯乙烯光纤芯材的匹配性较高。

Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ CusZn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon

In this study,SEM,EDS,XRD and other test methods were used to study the effects of different Ga contents(0~2 wt.%)on microstructure,electrical conductivity,spreading area and mechanical properties of Sn-9Zn-3Bi solder.The results revealed that the microstructure of Sn-Zn-Bi-Ga solder alloy was mainly composed ofβ-Sn,Zn-rich,Bi-rich phase and Sn-Zn eutectic structure.The Ga can significantly improve the wettability of Sn-Zn-Bi on the pure copper,the maximum wetting area was 105.3 mm^2.With the increase of the Ga content the melting point of the solders decreased from 195℃to 177℃.In addition,the Ga element can increase the oxidation resistance of solder.Its conductivity showed a decreasing trend with the gradual increase of the Ga content.With the increased of the Ga content the IMC(Intermetallic Compound)of Sn-Zn-Bi-xGa/Cu is only Cu5Zn8 and its thickness decreased remarkably.

新型Sn-Zn系焊铝锡膏的制备

研制了一种新型Sn-Zn系焊铝锡膏.根据焊铝锡膏成分组成特点,以Sn-Zn系无铅锡粉为基础,对助焊膏中活性剂、活性盐、表面活性剂和溶剂等添加剂进行筛选,通过正交试验对其组分进行优化并制备出焊铝锡膏.结果表明:活性剂部分,有机胺A质量的增加会降低钎料在240℃和260℃下的润湿性;活性盐部分,锌盐和亚锡盐有利于扩大钎料铺展面积,但添加铵盐会降低钎料的润湿性;表面活性剂部分,添加OP-10的实验效果要优于添加油酸酰胺的实验效果.基于以上研究结果自制出的焊铝锡膏可用于低温钎焊1060铝,焊接质量良好,界面处未见明显焊接缺陷,且焊铝锡膏具有良好的存储稳定性.研究结果可为铝合金钎焊用焊铝锡膏的应用和开发提供理论和技术支持.

Wettability of Sn-Zn-Bi Based Lead-Free Solder with Rare Earths

Effect of different contents of La and Ga on the wettability and the mierostrueture of interface of Sn-8.9Zn- 2.7Bi trinary alloys was studied. The results show that different contents of La and Ga have significant effect on the wettability of Sn-Zn-Bi based lead-free solder under the condition of both atmosphere and nitrogen. By adding suitable amount of Ga, Cu and La to Sn-Zn-Bi solder, a new lead-free solder Sn-8.9Zn-2.7Bi- 1.0Ga-0.5Cu-0.2La with better wettability was prepared, which has a wetting angle of 25.1° to Cu.

Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

The microstructure and melting behavior of Sn-9Zn-2Cu （SZC） lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape （Cu, Ni）5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder. In addition, the interracial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-INi alloy.

Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.

Sn-Zn-Bi-Ga掺杂Ti纳米颗粒钎料制备及钎焊性能

为解决Sn-Zn系无铅钎料性能难以满足电子封装实际应用的问题,采用Ti纳米颗粒掺杂的方法制备了Sn-5Zn-10Bi-0.5Ga+x Ti无铅钎料(x为质量分数,分别取0.05%、0.1%、0.3%、0.5%),研究了Ti纳米颗粒对钎料的润湿性能、抗氧化性能的影响,对钎焊的钎焊接头界面处的组织结构、金属间化合物扩散层厚度特征,以及力学性能等影响。研究结果表明:Ti纳米颗粒的添加能提高钎料的润湿性能和抗氧化性能,还能改善界面处的组织结构和力学性能。当添加Ti纳米颗粒质量分数为0.3%时,钎料抗氧化性能最好,其氧化增重质量比最先趋于稳定且增长率最低,其焊件的剪切强度为32.10 MPa,达到最大值。

A comprehensive review of radiation effects on solder alloys and solder joints

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms

Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys

Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb);{x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10−3 s−1 to 208.5 10−3 s−1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.

Bi、Ag对Sn-Zn无铅钎料性能与组织的影响

研究了Bi、Ag对Sn-9Zn无铅钎料系统润湿性、接头力学性能及微观组织的影响。结果表明:Sn-9Zn无铅钎料的润湿性较差,添加适量的Bi有助于提高钎料的润湿性和接头剪切强度,但同时也使接头的塑性降低;添加适量的Ag能明显改善钎料的润湿性和接头塑性,但Ag的质量分数超过1.5%时会降低钎料润湿性和接头剪切强度。Sn-9Zn-Bi系无铅钎料组织由富Sn相、富Zn相及Bi的析出物组成;Sn-9Zn-Ag系无铅钎料组织由富Sn相、富Zn相及AgZn3化合物组成。

稀土元素Nd对Sn-Zn-Ga无铅钎料组织及性能的影响

研究了添加合金元素Ga及稀土元素Nd对Sn-Zn钎料润湿性能、显微组织和焊点力学性能的影响.结果表明,在钎料中适当添加Nd元素,可以提高钎料的润湿性能,当Nd元素的质量分数为0.1%时,钎料的润湿力最大,润湿时间最短,润湿性能达到最佳.同时适当升高温度时润湿性能得到改善.随着Nd元素的加入,钎料中大块的黑色针状富锌相逐渐变少,钎料基体组织得到细化,在Nd元素的添加量达到0.1%时,钎料的组织最为均匀、细小.同时Nd元素的加入可以改善焊点的力学性能,在Nd元素含量为0.1%时抗剪强度增至最大.因此Nd元素在Sn-9Zn-0.5Ga钎料中的最佳添加量为0.1%左右.

不同钎剂对Sn-Zn系无铅钎料润湿特性的影响

采用润湿平衡法研究了在ZnCl2-NH4Cl、中等活性松香(RMA)和免清洗三种不同钎剂作用下,Sn-Zn无铅钎料在Cu基板上的润湿特点.结果表明,使用ZnCl2-NH4Cl钎剂时,Sn-Zn钎料具有良好的润湿性能;研究了不同钎剂下,Sn-9Zn钎料在Cu基板上的铺展情况,并分析比较了焊点界面金属间化合物层的特征.Sn-Zn钎料与Cu基板界面形成的金属间化合物在靠近Cu基板一侧较为平坦,而在钎料一侧呈扇贝状,而且,不同钎剂能影响钎料在Cu基板上的润湿、铺展性能,界面金属间化合物特征及焊点外观;Sn-Zn钎料表面存在大量ZnO,去除钎料表面ZnO是开发针对Sn-Zn系无铅钎料专用钎剂的关键.

Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能

研究了(Sn 9Zn) xCu无铅钎料的微观组织、润湿性能和力学性能。Cu的加入使得Sn 9Zn钎料中针状富Zn相逐渐转变为Cu Zn化合物,当Cu含量为8%时,Cu6Sn5相生成。Sn Zn Cu合金熔点随着Cu含量增加而升高,同时润湿性随Cu的加入得到显著改善。使用中性活性松香钎剂,钎料与Cu箔钎焊时的润湿角显著减小。Sn 9Zn的润湿角为120°,而(Sn 9Zn) 10Cu的润湿角为54°。这是由于Cu的加入降低了Zn的活性,减少了Zn在钎料表面氧化,降低了液态钎料表面张力,使得钎料能获得较好的润湿性。合金在2%Cu时获得较高的强度,随着Cu含量的增加,Cu Zn化合物相对增多,抗拉强度有所下降;而合金的塑性随着Cu的加入迅速下降。

合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响

研究了不同微量合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响。钎料在液态下的表面颜色变化以及热重分析表明,Al、Cr能明显改善Sn-Zn基钎料的抗氧化性能。通过俄歇能谱深度剖析和X射线衍射分析探讨了合金元素的抗氧化机理:Al和Cr在钎料表面或亚表面富集,形成阻挡层,抑制了钎料的氧化。比较了合金元素对Sn-Zn基钎料润湿性能的影响,结果表明Al的加入不利于钎料的铺展。通过实验得出结论:Cr是一种比Al更具有吸引力的Sn-Zn基钎料的高温抗氧化合金元素。

Sn-Zn系钎料专用助焊剂

采用铺展试验法研究了Sn-9Zn钎料配合自制Sn-Zn系钎料专用助焊剂、NH4Cl-ZnCl2助焊剂、树脂型助焊剂以及水溶性助焊剂在铜板上的铺展能力.结果表明,使用自制助焊剂A4匹配Sn-9Zn钎料铺展性能相比其它助焊剂铺展面积明显增大.自制助焊剂不含卤素,钎料的铺展面积最大为65.7 mm2,相比NH4Cl-ZnCl2助焊剂、树脂型助焊剂、水溶性助焊剂分别提高了16.1%,116.1%,85.1%.此外,复配助焊剂能进一步促进钎料在铜板上的铺展,最大铺展面积分别达到76.5,72.5 mm2,控制磺酸亚锡的含量为20%(质量分数),二乙醇胺,丁二酸的最佳添加量依次为8%,10%(质量分数).

新型无铅焊料合金Sn-Zn-Ga的研究

以 Sn-Zn 合金为母合金,添加 Ga 元素,得到了新型的无铅焊料合金。测量了其熔点、硬度、剪切强度和可焊性等性能。研究发现,Ga 元素的添加使焊料的熔点降低,熔程增大。焊料的硬度和剪切强度有所降低。焊料的铺展率增大,浸润角减小,提高了焊料的可焊性。通过实验研究确定了具有较好综合性能的焊料的成分范围。