Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.

Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.8Cu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %.

Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.

Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys

To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.

Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder

Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.

Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy for Surface Mount Technology

A new type of lead-free solder alloy Sn2.0Ag0.7CuRE was fabricated under vacuum condition. The microstructure and properties of the material, such as tensile strength, elongation, melting range, conductance and spreading area were all investigated. Result shows that when the content of RE ≤ 0.1% （mass fraction）, RE distribute uniformly in the solder alloy, and the tensile strength and conductance of Sn2.0Ag0.7CuRE solder alloy are better than those of traditional Sn37Pb solder. Its elongation and spreading area are almost equal to those of Sn37Pb solder. When the content of RE reaches 0.5%, RE compounds can be easily found around the boundaries of grains and phases, and the tensile strength and elongation and spreading area of Sn2.0Ag0.7CuRE solder alloy all decrease sharply. Therefore, RE amount added to the Sn2.0Ag0.7CuRE solder alloy under 0.1% is proper.

Microstructures and properties of Sn-Ag-Cu lead-free solder alloys containing La

Trace amounts of La were utilized to improve the melting behaviors,microstructures,tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis(DTA) tests. The X-ray diffraction(XRD) patterns show that β-Sn,Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy,and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy(OM) and scanning electron microscopy(SEM) when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy(EDS). There are considerable improvements in mechanical properties with 0.05% and 0.1% addition,but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area.

Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130°C. The stress exponent increases as the temperature drops from 100°C to 50°C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50°C, 100°C and 130°C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.

Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment

The Sn-9Zn lead-free solder alloy was prepared by conventional casting technique then cold-rolled into long sheets of 1 mm thickness and 3 mm width. It was annealed at 80, 120 and 160°C for 60 min to investigate the effect of isochronal heat treatment on structure and mechanical properties of the cold rolled Sn-9Zn alloy. The results showed that, the crystallite size and lattice strain have opposite behavior with increasing annealing temperature due to recovery and recrystalization processes associated with the heat treatment process. Vickers micro-hardness number increases continuously from 155 to 180 MPa with increasing annealing temperature. Ultimate tensile strength (UTS) was also calculated. It was found that, it is equal to 61.4 MPa for the non annealed sample and slightly decreases to 60.5 and 58.2 MPa for samples annealed at 80 and 120°C, respectively. While, increases to 65.4 MPa for the sample annealed at 160°C. Also, ductility increases with increasing annealing temperature in opposite manor with the UTS. The new method for Micro-creep behavior as well as the creep rate calculated by this method has been characterized at room temperature.

High temperature rupture of Sn-Pb-0.05RE solder alloy

Specimens of Sn-Pb-0.05RE solder alloy were tested to failure under two different stress states,uniaxial tension using smooth bar specimens and triaxial tension using notched bar specimens. The tests were conducted at a temperature of 125℃, far above 0. 5 melting temperature of Sn-Pb-0.05RE solder alloy,which leads to a distinctive creep deformation. Rupture times were compared for uniaxial and triaxial stress states with respect to multiaxial stress parameters that are directly related to physical fracture mechanisms.The success of the parameters was judged according to how well the stress parameters correlate with the time to rupture. The results show that the Mises effective stress is the stress factor which dominates the creep rupture of Sn-Pb-0. 05RE solder alloy. It further suggests that the cavity nucleation on a grain boundary plays an important role in the creep rupture process of Sn-Pb-0.05RE solder alloy.

钎料合金蠕变行为及非耦合型本构理论研究进展

在严苛的服役环境与小型化结构设计需求的双重作用下,航天仪器设备所承受的载荷不断增加并愈加复杂,而焊点、引线等封装结构作为仪器设备的薄弱环节,一旦破坏往往会导致器件甚至设备功能丧失,为了提升仪器设备的环境适应性与可靠性,需要准确把握封装结构材料蠕变行为与损伤机理,完善钎料合金本构理论并提升材料蠕变性能预测精度,发展封装结构精细化仿真分析方法。本文梳理了钎料合金蠕变性能及其影响因素,回顾了非耦合型本构理论的发展历程与研究热点,分析了相关模型的预测能力,为深入理解钎料合金蠕变行为与性能预测奠定基础。

单一稀土Ce和混合稀土RE对Sn-Zn-Cu系无铅焊锡合金性能的影响

主要研究了单一稀土Ce和混合稀土RE对Sn-Zn-Cu系无铅焊锡合金性能的影响。试验结果表明:混合稀土RE比单一稀土Ce对钎料合金的熔点影响要小;混合稀土RE比单一稀土Ce更有利于改善钎料合金的润湿性能;混合稀土添加量为0.05%时,Sn-8Zn-2Cu-0.05RE试样合金的剪切应力最大,塑性变形最好。总之,从改善钎料合金的综合性能来看,混合稀土对钎料合金的性能有很大的提高,且添加混合稀土含量不超过0.05%。

新型Sn-Zn系焊铝锡膏的制备

研制了一种新型Sn-Zn系焊铝锡膏.根据焊铝锡膏成分组成特点,以Sn-Zn系无铅锡粉为基础,对助焊膏中活性剂、活性盐、表面活性剂和溶剂等添加剂进行筛选,通过正交试验对其组分进行优化并制备出焊铝锡膏.结果表明:活性剂部分,有机胺A质量的增加会降低钎料在240℃和260℃下的润湿性;活性盐部分,锌盐和亚锡盐有利于扩大钎料铺展面积,但添加铵盐会降低钎料的润湿性;表面活性剂部分,添加OP-10的实验效果要优于添加油酸酰胺的实验效果.基于以上研究结果自制出的焊铝锡膏可用于低温钎焊1060铝,焊接质量良好,界面处未见明显焊接缺陷,且焊铝锡膏具有良好的存储稳定性.研究结果可为铝合金钎焊用焊铝锡膏的应用和开发提供理论和技术支持.

添加不同含量Ga对新型SnInAg无铅焊料合金耐酸碱性的影响研究

为改进Sn-11In-1.5Ag无铅焊料合金焊料的耐蚀性,采用失重法和电化学实验研究了Sn-11In-1.5Ag-xGa(x=0,0.1,0.3,0.5,0.7,质量分数,%)焊料合金在腐蚀环境中的腐蚀行为。利用扫描电镜(SEM)观察Sn-11In-1.5Ag-xGa焊料合金的表面形貌,利用X射线衍射仪(XRD)对焊料表面的腐蚀产物进行表征。结果表明:无论是在酸性还是碱性溶液中,添加的Ga均能提高Sn-11In-1.5Ag焊料合金的耐蚀性。随Ga含量的增加,焊料的耐蚀性也随之增强。对于相同成分的焊料合金,其耐蚀性在碱性溶液中优于酸性溶液。SEM观察表明,在Sn-11In-1.5Ag合金中加入Ga可以明显减轻焊料的腐蚀程度。XRD分析表明,焊料合金在酸性和碱性溶液中的腐蚀产物均为In_(2)O_(3)。

Ge对Sn⁃58Bi焊料合金微观组织和性能的影响

Sn‐Bi焊料是一种低温无铅焊料,在低温焊接领域应用较为广泛,但其存在脆性大和延展性差的缺点。为此,制备不同Ge含量的Sn‐58Bi焊料合金,研究不同Ge添加量对Sn‐58Bi焊料合金的显微组织、熔化特性、润湿性和力学性能的影响。结果表明:添加Ge元素可以显著细化Sn‐58Bi焊料合金的共晶组织。当添加的Ge元素质量分数为0.005%~0.01%时,焊料合金的湿润性有明显提升;Ge的添加量从0增大到0.01%时,Sn‐58Bi合金的拉伸强度和断后伸长率均提升显著,但继续增加Ge的含量,合金拉伸强度和断后伸长率提升缓慢。Ge元素的添加对Sn‐58Bi焊料合金的熔点基本没有影响。

Effects of rare earth La on the microstructure and melting property of(Ag-Cu_(28))-30Sn alloys prepared by mechanical alloying

To obtain novel intermediate temperature alloy solders with a melting temperature of 400-600°C,nominal（Ag-Cu28）-30Sn alloys without or with a trace addition（0.5 or 1.0 wt.%） of rare earth（RE） element La were prepared by mechanical alloying.The aim of this research is to investigate the effects of the addition of La on the microstructures,alloying process and melting properties of（Ag-Cu28）-30Sn alloys.The results show that the addition of La produces no new phase.A trace amount of La addition can effectively refine the grain size,but the excessive addition of 1.0 wt.% La inhibits the alloying process.The influence of La on the melting temperatures of solder alloys is negligible.However,the trace addition of 0.5 wt.% La can distinctly reduce the fusion zone and improve the melting property of（Ag-Cu28）-30Sn alloys.

Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ CusZn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.