This research investigated the combined effects of addition of Bi and Sb elements on the microstructure,thermal properties,ultimate tensile strength,ductility,and hardness of Sn−0.7Ag−0.5Cu(SAC0705)solder alloys.The r...This research investigated the combined effects of addition of Bi and Sb elements on the microstructure,thermal properties,ultimate tensile strength,ductility,and hardness of Sn−0.7Ag−0.5Cu(SAC0705)solder alloys.The results indicated that the addition of Bi and Sb significantly reduced the undercooling of solders,refined theβ-Sn phase and extended the eutectic areas of the solders.Moreover,the formation of SbSn and Bi phases in the solder matrix affected the mechanical properties of the solder.With the addition of 3 wt.%Bi and 3 wt.%Sb,the ultimate tensile strength and hardness of the SAC0705 base alloy increased from 31.26 MPa and 15.07 HV to 63.15 MPa and 23.68 HV,respectively.Ductility decreased due to grain boundary strengthening,solid solution strengthening,and precipitation strengthening effects,and the change in the fracture mechanism of the solder alloys.展开更多
The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could inc...The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.展开更多
基金supported by the Division of Physical Science,Faculty of Science,Prince of Songkla University (PSU),Thailand
文摘This research investigated the combined effects of addition of Bi and Sb elements on the microstructure,thermal properties,ultimate tensile strength,ductility,and hardness of Sn−0.7Ag−0.5Cu(SAC0705)solder alloys.The results indicated that the addition of Bi and Sb significantly reduced the undercooling of solders,refined theβ-Sn phase and extended the eutectic areas of the solders.Moreover,the formation of SbSn and Bi phases in the solder matrix affected the mechanical properties of the solder.With the addition of 3 wt.%Bi and 3 wt.%Sb,the ultimate tensile strength and hardness of the SAC0705 base alloy increased from 31.26 MPa and 15.07 HV to 63.15 MPa and 23.68 HV,respectively.Ductility decreased due to grain boundary strengthening,solid solution strengthening,and precipitation strengthening effects,and the change in the fracture mechanism of the solder alloys.
基金supported by the National Natural Science Foundation of China(Nos.52105369,61974070)Natural Science Foundation of the Jiangsu Higher Education Institutions of China(No.20KJB460008)+1 种基金Natural Science Foundation of Jiangsu Province,China(No.BK20200746)NUPTSF(No.NY220077).
文摘The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.
