The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au fi...The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound （IMC） layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and （Au, Ni, Cu）Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin （Ni, Cu, Au）3Sn4 IMC layer and a Pb-rich layer formed below and above the （Au, Ni）Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling.展开更多
Sn3.5Ag （mass fraction, %） nanoparticles were synthesized by an improved chemical reduction method at room temperature. 1,10-phenanthroline and sodium borohydride were selected as the surfactant and reducing agent, ...Sn3.5Ag （mass fraction, %） nanoparticles were synthesized by an improved chemical reduction method at room temperature. 1,10-phenanthroline and sodium borohydride were selected as the surfactant and reducing agent, respectively. It was found that no obvious oxidation of the synthesized nanoparticles was traced by X-ray diffraction. In addition, the results show that the density of primary particles decreases with decreasing the addition rate of the reducing agent. Moreover, the slight particle agglomeration and slow secondary particle growth can result in small-sized nanoparticles. Meanwhile, the effect of surfactant concentration on the particle size can effectively be controlled when the reducing agent is added into the precursor at an appropriate rate. In summary, the capping effect caused by the surfactant molecules coordinating with the nanoclusters will restrict the growth of the nanoparticles. The larger the mass ratio of the surfactant to the precursor is, the smaller the particle size is.展开更多
Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti ac...Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.展开更多
The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity,calling for Pb-free substitute materials.Sn–Ag alloy is a potential candidate in terms of good mechanical property.The major problema...The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity,calling for Pb-free substitute materials.Sn–Ag alloy is a potential candidate in terms of good mechanical property.The major problematic issue of using Sn–Ag is their high melting temperature,consequently this study is dedicated to lowering the melting temperature of Sn3.5Ag(wt%)alloy by developing nanomaterials using a chemical reduction approach.The resultant nanocrystalline Sn3.5Ag is characterized by field emission scanning electron microscope.The size dependence of the melting temperature is discussed based on differential scanning calorimetry results.We have reduced the melting temperature to 209.8°C in the nanocrystalline Sn3.5Ag of(32.4±8.0)nm,compared to*221°C of the bulk alloy.The results are consistent with the prediction made by a relevant theoretical model,and it is possible to further lower the melting temperature using the chemical reduction approach developed by this study.展开更多
文摘The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound （IMC） layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and （Au, Ni, Cu）Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin （Ni, Cu, Au）3Sn4 IMC layer and a Pb-rich layer formed below and above the （Au, Ni）Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling.
基金Projects(50971086,51171105)supported by the National Natural Science Foundation of China
文摘Sn3.5Ag （mass fraction, %） nanoparticles were synthesized by an improved chemical reduction method at room temperature. 1,10-phenanthroline and sodium borohydride were selected as the surfactant and reducing agent, respectively. It was found that no obvious oxidation of the synthesized nanoparticles was traced by X-ray diffraction. In addition, the results show that the density of primary particles decreases with decreasing the addition rate of the reducing agent. Moreover, the slight particle agglomeration and slow secondary particle growth can result in small-sized nanoparticles. Meanwhile, the effect of surfactant concentration on the particle size can effectively be controlled when the reducing agent is added into the precursor at an appropriate rate. In summary, the capping effect caused by the surfactant molecules coordinating with the nanoclusters will restrict the growth of the nanoparticles. The larger the mass ratio of the surfactant to the precursor is, the smaller the particle size is.
基金financial support of this work from the Ministry of Science and Technology, Taibei, China, under Projects No. MOST 105-ET-E-020002-ET, 105-2622-E-020-003-CC3
文摘Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.
基金supported by the National Natural Science Foundation of China(50971086,51171105)
文摘The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity,calling for Pb-free substitute materials.Sn–Ag alloy is a potential candidate in terms of good mechanical property.The major problematic issue of using Sn–Ag is their high melting temperature,consequently this study is dedicated to lowering the melting temperature of Sn3.5Ag(wt%)alloy by developing nanomaterials using a chemical reduction approach.The resultant nanocrystalline Sn3.5Ag is characterized by field emission scanning electron microscope.The size dependence of the melting temperature is discussed based on differential scanning calorimetry results.We have reduced the melting temperature to 209.8°C in the nanocrystalline Sn3.5Ag of(32.4±8.0)nm,compared to*221°C of the bulk alloy.The results are consistent with the prediction made by a relevant theoretical model,and it is possible to further lower the melting temperature using the chemical reduction approach developed by this study.
