The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could inc...The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.展开更多
基金supported by the National Natural Science Foundation of China(Nos.52105369,61974070)Natural Science Foundation of the Jiangsu Higher Education Institutions of China(No.20KJB460008)+1 种基金Natural Science Foundation of Jiangsu Province,China(No.BK20200746)NUPTSF(No.NY220077).
文摘The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.
