Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness...Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.展开更多
To investigate the influence of the solidification on the solder bump formation in the solder jet process,the volume of fluid (VOF) models of the solder droplets impinging onto the fluxed and non-fluxed substrates wer...To investigate the influence of the solidification on the solder bump formation in the solder jet process,the volume of fluid (VOF) models of the solder droplets impinging onto the fluxed and non-fluxed substrates were presented.The high speed camera was used to record the solder impingement and examine the validity of the model.The results show that the complete rebound occurs during the process of the solder droplet impinging onto the fluxed substrate,whereas a cone-shaped solder bump forms during the process of the solder droplet impinging onto the non-fluxed substrate.Moreover,the solder solidification results in the lift-up of the splat periphery and the reduction in the maximum spread factor.展开更多
Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more difficult to inspect the defects of solder bumps as they are...Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more difficult to inspect the defects of solder bumps as they are hidden in the package. A nondestructive method using the transient active thermography has been proposed to inspect the defects of a solder bump, and we aim at developing an intelligent diagnosis system to eliminate the influence of emissivity unevenness and non-uniform heating on defects recognition in active infrared testing. An improved fuzzy c-means(FCM) algorithm based on the entropy weights is investigated in this paper. The captured thermograms are preprocessed to enhance the thermal contrast between the defective and good bumps. Hot spots corresponding to 16 solder bumps are segmented from the thermal images. The statistical features are calculated and selected appropriately to characterize the status of solder bumps in FCM clustering. The missing bump is identified in the FCM result, which is also validated by the principle component analysis. The intelligent diagnosis system using FCM algorithm with the entropy weights is effective for defects recognition in electronic packages.展开更多
This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated o...This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization（UBM） in sequence.After an accurate reflow process,Sn_（1.8）Ag_（9.4）In solder bumps are obtained.It is found that the intermetallic compounds（IMCs） between Sn-Ag-In solder and Cu grow with the reflow time,which results in an increase in Ag concentration in the solder area.So during solidification, more Ag_2In nucleates and strengthens the solder.展开更多
Solder bumps realize the mechanical and electrical interconnection between chips and substrates in surface mount components,such as flip chip, wafer level packaging and three-dimensional integration. With the trend to...Solder bumps realize the mechanical and electrical interconnection between chips and substrates in surface mount components,such as flip chip, wafer level packaging and three-dimensional integration. With the trend to smaller and lighter electronics,solder bumps decrease in dimension and pitch in order to achieve higher I/O density. Automated and nondestructive defect inspection of solder bumps becomes more difficult. Machine learning is a way to recognize the solder bump defects online and overcome the effect caused by the human eye-fatigue. In this paper, we proposed an automated and nondestructive X-ray recognition method for defect inspection of solder bumps. The X-ray system captured the images of the samples and the solder bump images were segmented from the sample images. Seven features including four geometric features, one texture feature and two frequency-domain features were extracted. The ensemble-ELM was established to recognize the defects intelligently. The results demonstrated the high recognition rate compared to the single-ELM. Therefore, this method has high potentiality for automated X-ray recognition of solder bump defects online and reliable.展开更多
Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface...Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface.展开更多
文摘Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.
基金Project(50675047) supported by the National Natural Science Foundation of China
文摘To investigate the influence of the solidification on the solder bump formation in the solder jet process,the volume of fluid (VOF) models of the solder droplets impinging onto the fluxed and non-fluxed substrates were presented.The high speed camera was used to record the solder impingement and examine the validity of the model.The results show that the complete rebound occurs during the process of the solder droplet impinging onto the fluxed substrate,whereas a cone-shaped solder bump forms during the process of the solder droplet impinging onto the non-fluxed substrate.Moreover,the solder solidification results in the lift-up of the splat periphery and the reduction in the maximum spread factor.
基金supported by the National Natural Science Foundation of China(Grant Nos.51305179&51305177)the Natural Science Foundation of Jiangsu Higher Education Institutions(Grant No.13KJB510009)
文摘Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more difficult to inspect the defects of solder bumps as they are hidden in the package. A nondestructive method using the transient active thermography has been proposed to inspect the defects of a solder bump, and we aim at developing an intelligent diagnosis system to eliminate the influence of emissivity unevenness and non-uniform heating on defects recognition in active infrared testing. An improved fuzzy c-means(FCM) algorithm based on the entropy weights is investigated in this paper. The captured thermograms are preprocessed to enhance the thermal contrast between the defective and good bumps. Hot spots corresponding to 16 solder bumps are segmented from the thermal images. The statistical features are calculated and selected appropriately to characterize the status of solder bumps in FCM clustering. The missing bump is identified in the FCM result, which is also validated by the principle component analysis. The intelligent diagnosis system using FCM algorithm with the entropy weights is effective for defects recognition in electronic packages.
文摘This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization（UBM） in sequence.After an accurate reflow process,Sn_（1.8）Ag_（9.4）In solder bumps are obtained.It is found that the intermetallic compounds（IMCs） between Sn-Ag-In solder and Cu grow with the reflow time,which results in an increase in Ag concentration in the solder area.So during solidification, more Ag_2In nucleates and strengthens the solder.
基金supported by the National Key Basic Research Special Fund of China(Grant No.2015CB057205)the National Natural Science Foundation of China(Grant Nos.51705203,51775243,51675250)+3 种基金the Natural Science Foundation of Jiangsu Province(Grant Nos.BK20160183,BK20160185)the project funded by China Postdoctoral Science Foundation(Grant No.2017M611690)“111” Project(Grant No.B18027)the Open Foundation of State Key Lab of Digital Manufacturing Equipment Technology(Grant No.DMETKF2018022)
文摘Solder bumps realize the mechanical and electrical interconnection between chips and substrates in surface mount components,such as flip chip, wafer level packaging and three-dimensional integration. With the trend to smaller and lighter electronics,solder bumps decrease in dimension and pitch in order to achieve higher I/O density. Automated and nondestructive defect inspection of solder bumps becomes more difficult. Machine learning is a way to recognize the solder bump defects online and overcome the effect caused by the human eye-fatigue. In this paper, we proposed an automated and nondestructive X-ray recognition method for defect inspection of solder bumps. The X-ray system captured the images of the samples and the solder bump images were segmented from the sample images. Seven features including four geometric features, one texture feature and two frequency-domain features were extracted. The ensemble-ELM was established to recognize the defects intelligently. The results demonstrated the high recognition rate compared to the single-ELM. Therefore, this method has high potentiality for automated X-ray recognition of solder bump defects online and reliable.
文摘Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface.
