Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of...Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.展开更多
HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) ...HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) and BGA(ball grid array) under thermal cycle test,and studies influences of profile parameters of the thermal cycle,such as hot and cold soak temperature,hot and cold soak time and temperature change rate,on elastic strain range,accumulated plastic strain,fatigue life and test efficiency of two types of solder joints.Based on the above research and experimental verification,this paper presents the method to build an optimal thermal cycling profile for HALT of electronic components.展开更多
By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten t...By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.展开更多
文摘Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.
基金Sponsored by National Advanced Research Project of China (41319030101)
文摘HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) and BGA(ball grid array) under thermal cycle test,and studies influences of profile parameters of the thermal cycle,such as hot and cold soak temperature,hot and cold soak time and temperature change rate,on elastic strain range,accumulated plastic strain,fatigue life and test efficiency of two types of solder joints.Based on the above research and experimental verification,this paper presents the method to build an optimal thermal cycling profile for HALT of electronic components.
文摘By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.
