Effect of Si content on interfacial reaction and properties between solid steel and liquid aluminum

The effect of Si content on the microstructures and growth kinetics of intermetallic compounds(IMCs)formed during the initial interfacial reaction(<10 s)between solid steel and liquid aluminum was investigated by a thermophysical simulation method.The influence of Si addition on interfacial mechanical properties was revealed by a high-frequency induction brazing.The results showed that IMCs layers mainly consisted ofη-Fe_(2)Al_(5)andθ-Fe_(4)Al_(13).The addition of Si reduced the thickness of the IMCs layer.The growth of theηphase was governed by the diffusion process when adding 2 wt.%Si to the aluminum melt.When 5 wt.%or 8 wt.%Si was added to aluminum,the growth was governed by both the diffusion process and interfacial reaction,and ternary phaseτ1/τ9-(Al,Si)_(5)Fe_(3)was formed in theηphase.The apparent activation energies of theηphase decreased gradually with increasing Si content.The joint with pure aluminum metal had the highest tensile strength and impact energy.

PLATEAU TYPE E(%)-pH CURVES OF INTERFACIAL EXCHANGE BETWEEN LIQUID AND SOLID IN SEAWATER

A study on the curves of the exchange ratio E(%)-pH on the liquid-solid interface of the systems Zn(II) with clay minerals (Kaolinite , illite and montmorillonite), Zn(II) with hydrous ferric oxides (amorphous ferric oxide, goethite and hematite). Zn(II) with hydrous manganese oxide (y-MnOOH, manganite and 5-MnO2) etc . in seawater resulted in the discovery of new plateau type exchange ratio ?%)-pH curves not yet reported in literature. The two factors that decide the growth , decline and the change of the " plateau type " curve are : (1) the inherent characteristics of systems , which can be explained by the exchange constants i(i=1 ,2 , 3 . etc .) of interfacial stepwise ion / coordination particle exchange between liquid and solid ; and (2)The theory of interfacial stepwise ion/coordination(the amount of solid exchange reagent)particle exchange in seawater was applied to explain the experimental results of the above study and a general formula was derived for the plateau type exchange ratio E(%)-pH

INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH

The solid-liquid interfacial tensions of Cu(solid)-Pb(liquid)andCu(solid)-Bi(liquid)binary systems have been determined by the dihedral angle method.The results show that at 850℃ the interfacial tensions are 368±55mN/m for Cu-Pb sys-tem and 336±35mN/m for Cu-Bi systa,respectively,the error ranges of which aremore narrow than those found in some papers published abroad.In addition,there is nodetective segregation of other solute atoms or compounds in the vicinity of the tip of cop-per grain boundary where dihedral angles formed.

Experimental determination of interfacial energies for Ag_2Al solid solution in the CuAl_2-Ag_2Al system

The equilibrated grain boundary groove shapes of solid solution Ag2Al in equilibrium with an AI-Cu-Ag liquid were observed from a quenched sample with a radial heat flow apparatus. The Gibbs Thomson coefficient, solid liquid interfacial energy and grain boundary energy of the solid solution Ag2Al have been determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase and the thermal conductivity ratio of the liquid phase to solid phase for Ag2Al-28.3 at the %CuAl2 alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, separately.

The effect of interfacial energy anisotropy on planar interface instability in a succinonitrile alloy under a small temperature gradient

The morphological stability of a planar interface with different crystallographic orientations is studied under a small positive temperature gradient using a transparent model alloy of succinonitrile. Novel experimental apparatus is constructed to provide a temperature gradient of about 0.37 K/mm. Under this small temperature gradient, the planar interface instability depends largely on the crystallographic orientation. It is shown experimentally that the effect of interfacial energy anisotropy on planar interface stability cannot be neglected even in a small temperature gradient system. Higher interfacial energy anisotropy leads the planar interface to become more unstable, which is different from the stabilizing effect of the interfacial energy on the planar interface. The experimental results are in agreement with previous theoretical calculations and phase field simulations.

The interfacial engineering of metal electrodes for high-specific-energy and long-lifespan batteries

High-specific-energy batteries with long-lifespan are the development aspiration for energy storage applications.Metal electrodes with high specific capacity and low reduction potential are potential candidates for next-generation high-specific-energy batteries.Nevertheless,the stability of the metal electrode batteries is constantly suffered from the unstable interface issue during the plat-ing/stripping process,such as dendrite formation,dynamic evolution of solid electrolyte interphase,and other accompanied side reactions.To solve these challenges,numerous researches have been intensively studied based on the interfacial engineering of metal electrodes,including electrode configuration optimization,interfacial chemistry regulation and solid-solid interface construc-tion,and the recent progress is elaborately introduced in this paper.Nevertheless,the dendrite issues cannot be entirely prohibited in solid metal electrodes,which motivate the search for potential alternatives.Liquid-metal electrodes with completely reversible structural changes and high mass transfer rate are rendered as an effective approach to solve the dendrite problem.Therefore,the development of liquid metal electrode batteries is reviewed in this paper,in which the interfacial issues are explicated and some commendable achievements are summarized.In the end,the implementation of interfacial engineering and the development roadmap of the metal electrode batteries are prospected.

Immersing Treatment of Steel Plate Surface in Steel-Aluminum Solid to Liquid Bonding

The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and X-ray diffraction . The results showed that the layer of flux (the minimum thickness was 15 μm on the steel plate surface) could protect the steel plate surface from oxidizing effectively at high temperature in solid to liquid bonding. The melt temperatUre of the flux should be lower than 580 ℃ so that it could be melted and removed completely. No. 1 flux (patent product made by the author) made up of halogeindes could also force liquid aluminum to infiltrate into steel plate surface and thus the interfacial shear strength of the bonding plate was rather large.

Effect of cold-rolling and annealing on interfacial structures and properties of A500/steel bimetal strip

The effect of cold-rolling, by both a series of small passes and single-pass with different deformations as well as the subsequent annealing, on the interfacial structures and properties of A500（AlSn8Pb2Si2.5Cu0.8Cr0.2）/steel bimetal strip produced by liquid-solid roll cladding was investigated. Experimental results of the cold-rolling by a series of small passes show that the interfacial bonding strength increases slightly when the total deformation is less than 7.32% and then decreases gradually with the increase in deformation. Subsequent annealing has no effect on the interfacial structures and properties. The effect of cold-rolling by single-pass less than 33.2% deformation on the interfacial structures and properties is the same as that of multi-pass cold-rolling, whereas cold-rolling by single-pass more than 33.2% deformation followed by annealing at 350℃ for 2.5h can make the interfacial bonding strength increase to a great extent. Metallographic examination of the interface shows that there exist only transverse cracks within the interfacial layer and the clad strip does not split along the interface during cold-rolling if the thickness of interfacial layer is less than 45μm. The thick interfacial layer（>56μm）, however, crumbles during cold-rolling, thus resulting in the splitting of the clad strip.

Tuning hybrid liquid/solid electrolytes by lowering Li salt concentration for lithium batteries

Hybrid liquid/solid electrolytes（HLSEs） consisting of conventional organic liquid electrolyte（LE）, polyacrylonitrile（PAN）, and ceramic lithium ion conductor Li（1.5）Al（0.5）Ge（1.5）（PO4）3（LAGP） are proposed and investigated. The HLSE has a high ionic conductivity of over 2.25 × 10^（-3） S/cm at 25？C, and an extended electrochemical window of up to 4.8 V versus Li/Li＋. The Li｜HLSE｜Li symmetric cells and Li｜HLSE｜Li FePO4 cells exhibit small interfacial area specific resistances（ASRs） comparable to that of LE while much smaller than that of ceramic LAGP electrolyte, and excellent performance at room temperature. Bis（trifluoromethane sulfonimide） salt in HLSE significantly affects the properties and electrochemical behaviors. Side reactions can be effectively suppressed by lowering the concentration of Li salt. It is a feasible strategy for pursuing the high energy density batteries with higher safety.

Effect of current density on distribution coefficient of solute at solid-liquid interface

When current passes through the solid-liquid interface, the growth rate of crystal, solid-liquid interface energy and radius of curvature at dendritic tip will change. Based on this fact, the theoretical relation between the distribution of solute at solid-liquid interface and current density was established, and the effect of current on the distribution coefficient of solute through effecting the rate of crystal growth, the solid-liquid interface energy and the radius of curvature at the dendritic tip was discussed. The results show that as the current density increases, the distribution coefficient of solute tends to rise in a whole, and when the former is larger than about 400 A/cm 2, the latter varies significantly.

Thermal rectification induced by Wenzel–Cassie wetting state transition on nano-structured solid–liquid interfaces

Thermal rectification refers to the phenomenon by which the magnitude of the heat flux in one direction is much larger than that in the opposite direction.In this study,we propose to implement the thermal rectification phenomenon in an asymmetric solid–liquid–solid sandwiched system with a nano-structured interface.By using the non-equilibrium molecular dynamics simulations,the thermal transport through the solid–liquid–solid system is examined,and the thermal rectification phenomenon can be observed.It is revealed that the thermal rectification effect can be attributed to the significant difference in the interfacial thermal resistance between Cassie and Wenzel states when reversing the temperature bias.In addition,effects of the liquid density,solid–liquid bonding strength and nanostructure size on the thermal rectification are examined.The findings may provide a new way for designs of certain thermal devices.

Theoretical analysis of reactive solid-liquid interfacial energies

The characterization of reactive solid-liquid interfacial energies and solid surface energies is a pressing problem in materials science and surface science. Based on the concept that unbalanced forces doing work, a mathematical formulation between surface energies and interfacial energies for reactive wetting is presented. The resulting formalism has significant generality in which the equilibrium Young's equation for solid-liquid interfacial energies is just a special case. It is shown that a solid-liquid interfacial energy at non-equilibrium is always higher than that at equilibrium, and that the transformation of reactive interfaces to equilib-rium interfaces is an inevitable, spontaneous process. The numerical range of solid-liquid interfacial energies γsl for a limited, solid-liquid interfacial wetting system was calculated to be 0 ≤γsl ≤γsg. The calculation methods for reactive solid-liquid interfacial energies and solid surface energies are presented. They are significant for composite materials and weld, powder sinter, package of electronic devices, and other surface and interfacial issues in metallurgy.

Microstructure evolution of hot pressed AZ91D alloy chips reheated to semi-solid state

AZ91D magnesium alloy chips, which were directly collected on the spot of machining process, were recycled to prepare billet via hot pressing for semi-solid processing. The semi-solid microstructure evolution of the billet during reheating was investigated. The results indicate that there are three stages during reheating to semi-solid state: the dissolution of Mg17Al12 and diffusion of Al into α-Mg matrix, the melting of the region with high content of solute and formation of isolated solid particles, and spheroidization and growth of solid particles. Meanwhile, a number of entrapped liquid droplets form within solid particles. In addition, the number and size of entrapped liquid droplets rely on the holding time in the semi-solid temperature range. With increasing isothermal holding time, the solid fraction remains unchanged when the solid-liquid system reaches the dynamic equilibrium at last, while the solid particles become more globular and the average size of solid particles increases owing to the decreasing of interfacial energy and the effect of interfacial tension.

固液界面热阻的温度依赖特性模拟研究

基于非平衡态分子动力学模拟方法,研究了系统温度及固液结合强度对固液界面传热的影响规律。模拟结果表明,固液界面热阻随着系统温度的升高而降低,并且亲水性界面的界面热阻温度依赖性较弱。基于微观热流密度计算式的分析表明,随着系统温度升高,动能项和维里项的贡献均逐渐增大,因而固液界面传热增强,但是动能项占比逐渐增大,维里项占比逐渐降低;随着固液结合强度逐渐增大,界面吸附效应增强,维里项贡献明显增大,这是较强的固液相互作用能够强化界面传热的主要原因。

稠油冷采用冻胶分散体调驱体系的相互作用机制

目的旨在有效解决稠油化学冷采过程中降黏剂窜流现象严重、油藏动用效率低的问题,支撑稠油绿色高效开发。方法基于稠油冷采降黏剂高效降黏洗油与冻胶分散体调剖剂储层调控的协同效应,采用复配方式构建了稠油冷采用冻胶分散体调驱体系,测试其基本性能,并使用界面扩张流变仪以及流变仪,考查了体系的界面流变特性和剪切应力特性。结果体系由质量分数为0.06%~0.12%的冻胶分散体和质量分数为0.05%~0.15%的降黏剂组成,为粒径均一的低黏流体,能够降低界面张力并乳化稠油,降黏率达到95%以上。体系中降黏剂在油水界面的吸附行为决定了体系的乳化降黏能力,降黏剂通过吸附在冻胶分散体的表面提高了体系的聚结稳定性,并考查了组分含量及油藏条件对以上过程的影响。结论构建了一种兼具储层调控和高效降黏能力稠油冷采用冻胶分散体调驱体系,探明了体系中各组分间的相互作用机制,为稠油化学冷采提供了技术支持。

外电场作用下纳米结构表面的固-液界面传热特性

在固体表面布置纳米结构是一种强化固-液界面传热的简单有效的方法.但是,当固-液界面相互作用较弱时,由于纳米结构并不能被液体浸润,纳米结构的存在反而会弱化固-液界面之间的传热,而外电场的施加则可以解决这一问题.本文基于分子动力学模拟的方法,研究了纳米结构固-液界面在外电场作用下的传热特性.通过在2块平行金属板布置数量相同的正负电荷,产生垂直于板面的均匀电场,并在下层金属板上布置了不同尺寸的纳米结构.结果表明:在外电场作用下,纳米结构处会产生电润湿现象,固-液界面的润湿状态能够从Cassie态变为Wenzel态,界面处的Kapitza热阻长度明显减小,因而热流密度显著增大;当电荷量增至发生电冻结的临界值,液态水会产生电冻结现象,其热导率骤增至1.2 W/(m·K),热流密度也随之发生骤增;继续增加电场强度,由于电冻结现象的发生,固-液界面热阻则基本保持不变.

异质固液界面中多界面态的原子模拟研究

在晶界和固体表面系统中,针对界面“complexion”(或界面相、界面态)转变及其调控相关的研究,近年来呈现出持续增长的关注趋势.与此同时,这些界面相之间的转变问题,在异质固液界面体系中尚未得到足够的关注.使用分子动力学模拟方法预言了处于Pb熔点温度之上,Cu(111)/Pb(L)固液界面体系中存在的多界面相共存的界面状态;观察到4种单原子层的界面状态,即2种界面CuPb层状合金液相以及2种界面预凝固的Pb层状固相,共存于固体Cu和液体Pb之间的双原子界面层内;通过计算界面相在面内共存的各种性质空间分布,模拟出了该体系多界面相共存的力学、热力学和动力学性质的不均匀性和面内各向异性;计算获得的界面态热力学与动力学性质数值显著区别于固相Cu和液相Pb的相应性质.另外,测量得到的Cu(111)/Pb(L)固液界面态共存的“相平衡”条件具有共晶二元合金相图特征,而不是CuPb合金的偏晶相图.故所报道的数据有望为调节异质形核和润湿过程提供新的理论思路.

料液输运对太阳能界面蒸发过程的影响

太阳能是一种清洁、环保的可再生能源,将太阳能应用到海水淡化系统中是解决淡水资源短缺和能源危机的有效措施。针对太阳能界面蒸发海水淡化系统,为了探究基底宽度以及料液浓度对蒸发性能的影响,本文搭建了界面蒸发实验平台,开展了组合式蒸发结构的界面蒸发过程实验研究。研究发现:对于同一种料液浓度,基底结构上水量小于界面蒸发需求时,随着基底宽度的增大,蒸发速率增大;当上水量满足界面蒸发需求后,随着基底宽度增大,蒸发速率下降,蒸发速率存在最大值点;对于同一种基底宽度,当料液浓度增大时,蒸发速率减小;随着料液浓度的增大,蒸发速率最大值向基底宽度增大的方向偏移。

Cu核微焊点液-固界面反应及剪切行为研究

相较于传统Sn基焊点,Cu核焊点具备更好的导热性、导电性及力学性能。为揭示尺寸效应对Cu核焊点界面反应及剪切强度的影响,制备了不同Sn镀层厚度的Cu核焊点(Cu@Ni-Sn/Cu)。观察回流不同时间后Cu核微焊点横截面微观组织,研究了Cu核微焊点在尺寸效应下的液-固界面反应。之后对Cu核微焊点进行剪切测试,结合断口形貌,分析断裂机理。界面反应结果表明:Cu@Ni-Sn/Cu焊点在250℃回流时,Sn/Ni界面生成Ni含量较高的针状(Cu,Ni)_(6)Sn_(5)IMC,Sn/Cu界面生成Ni含量较低的层状(Cu,Ni)_(6)Sn_(5)IMC。剪切测试结果表明:随着Sn镀层厚度增加,Cu@Ni-Sn/Cu焊点的剪切强度先增大后减小。基于Sn镀层厚度对界面(Cu,Ni)_(6)Sn_(5)IMC层体积的直接影响,Sn层厚度的增加提升了焊点剪切强度。然而Cu@Ni-Sn(60μm)/Cu焊点中Cu核位置的偏移,造成剪切强度略有降低。

探索微纳尺度润湿动力学:长针式原子力显微镜的应用与进展

“如何在微观层面测量界面现象”是微纳尺度实验流体力学的关键科学问题,被列入世界前沿125个科学问题名单(Sanders S,Science,2021).由于光学衍射极限的限制,传统光学手段很难直接测量微纳尺度下的流动与界面现象.利用原子力显微镜的精准操控和小尺度力学测量等优势,结合长针式探针组装成的微流变计可以直接测量气-液-固三相接触线上的毛细力,并监测探针在垂直方向运动中力的动态变化.通过该技术手段,可以实现对流体界面的动力学行为以及各类材料在液体环境中力学性质在微纳尺度的精确表征.文章将系统介绍长针式原子力显微镜技术的实验原理和方法,及其在微纳尺度非理想界面润湿动力学中的最新研究进展,包括低能垒表面毛细力的速度依赖性与非对称性、无序粗糙表面接触线黏滑运动的统计学规律、柔性表面接触线动力学的状态与速度定律、以及离子液体-金属界面处电场对接触角迟滞的调控等,最后展望了该技术在新兴领域中的应用.该实验手段为检验各类理论模型与数值模拟提供了可信数据,为探究界面上复杂现象的物理本质提供参考.