期刊文献+
共找到11篇文章
< 1 >
每页显示 20 50 100
Analytical calculation of electromagnetic, torque for surface mounted permanent magnet brushless motors 被引量:2
1
作者 杜世勤 章跃进 江建中 《Journal of Shanghai University(English Edition)》 CAS 2007年第3期309-313,共5页
With the air gap magnetic field distribution of surface mounted permanent magnet (PM) motors obtained using an analytical technique, the instantaneous electromagnetic torque and its corresponding components are inve... With the air gap magnetic field distribution of surface mounted permanent magnet (PM) motors obtained using an analytical technique, the instantaneous electromagnetic torque and its corresponding components are investigated with the Maxwell stress tensor method. Accurate results can easily be achieved using the proposed method without using the tedious finite element analysis (FEA). In this paper, the electromagnetic torque of a surface mounted PM motor with two phases energized is decomposed into four torque components. This technique is useful not only for the design and optimization of the permanent magnet motor, but also for the choice of control strategy. 展开更多
关键词 surface mounted permanent magnet motors air gap magnetic field analytical technique electromagnetic torque.
下载PDF
Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling 被引量:1
2
作者 马鑫 钱乙余 《中国有色金属学会会刊:英文版》 CSCD 2001年第4期471-474,共4页
Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of... Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test. 展开更多
关键词 finite element simulation surface mounted solder joint thermal cycling mechanical response
下载PDF
High-Speed,High-Power Motor Design for a Four-Legged Robot Actuator Optimized using the Weighted Sum and Response Surface Methods 被引量:1
3
作者 Tae-Woo Lee Do-Kwan Hong Tae-Uk Jung 《CES Transactions on Electrical Machines and Systems》 CSCD 2021年第3期224-231,共8页
In this paper,a design is presented for a high-speed,high-power motor for a four-legged robot actuator that was optimized using the weighted sum method(WSM)based on the Taguchi method,and the response surface method(R... In this paper,a design is presented for a high-speed,high-power motor for a four-legged robot actuator that was optimized using the weighted sum method(WSM)based on the Taguchi method,and the response surface method(RSM).First,output torque,torque constant,torque ripple,and efficiency were selected as objective functions for the optimized design.The sampling method was implemented to use a mixed orthogonal array and the single response characteristics of each objective function were compared using the Taguchi method.Moreover,to consider the multi-response characteristic of the objective functions,WSM was applied.Second,the 2D finite element analysis result of the RSM was compared with that using the WSM.Finally,an experiment was carried out on the manufactured motor and the optimized model is presented here. 展开更多
关键词 Four-legged robot Multiphysics analysis Optimized design surface mounted permanent magnet synchronous motor
下载PDF
Hierarchical planning for a surface mounting machine placement 被引量:4
4
作者 曾又姣 马登哲 +1 位作者 金烨 严隽琪 《Journal of Zhejiang University Science》 EI CSCD 2004年第11期1449-1455,共7页
For a surface mounting machine (SMM) in printed circuit board (PCB) assembly line, there are four problems, e.g. CAD data conversion, nozzle selection, feeder assignment and placement sequence determination. A hierarc... For a surface mounting machine (SMM) in printed circuit board (PCB) assembly line, there are four problems, e.g. CAD data conversion, nozzle selection, feeder assignment and placement sequence determination. A hierarchical planning for them to maximize the throughput rate of an SMM is presented here. To minimize set-up time, a CAD data conversion system was first applied that could automatically generate the data for machine placement from CAD design data files. Then an effective nozzle selection approach was implemented to minimize the time of nozzle changing. And then, to minimize picking time, an algorithm for feeder assignment was used to make picking multiple components simultaneously as much as possible. Finally, in order to shorten pick-and-place time, a heuristic algorithm was used to determine optimal component placement sequence according to the decided feeder positions. Experiments were conducted on a four head SMM. The experimental results were used to analyse the assembly line performance. 展开更多
关键词 Printed circuit board surface mounting machine Hierarchical planning Feeder assignment Placement sequence
下载PDF
CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY 被引量:2
5
作者 G.Z. Wang,C.Q.Wang and Y.Y Qian (National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology,Harbin 150001, China ) 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1996年第4期240-246,共7页
A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of compo... A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward. 展开更多
关键词 surface mount technology chip component solder joint shape
下载PDF
Study on Strengthening of RC Slabs with Different Innovative Techniques
6
作者 Tarek Ali Sameh Yehia 《Open Journal of Civil Engineering》 2016年第4期516-525,共10页
This paper presents a focused study on using different methods to enhance the ultimate capacity of flexural behavior in RC slabs. Four RC specimens were casted with common compressive strength and reinforced with stee... This paper presents a focused study on using different methods to enhance the ultimate capacity of flexural behavior in RC slabs. Four RC specimens were casted with common compressive strength and reinforced with steel mesh. Specimens were strengthened with different methods such as usage of GFRP sheets, carbon fibers laminate strips and near surface mounted steel rebars. All specimens were subjected to two-point loading setup. Load was increased from zero to failure load. First crack was recorded and crack pattern was observed. The behavior of strengthened specimens was compared to that of the control specimen to judge the efficiency of the used techniques. Test results showed that the used techniques were effective in enhancing the behavior of the strengthened slabs by noteworthy values. 展开更多
关键词 Slab Strengthening GFRP Sheets Carbon Fiber Laminate Strips Near surface mounted Rebars
下载PDF
Adaptive Lagrange finite element methods for high precision vibrations and piezoelectric acoustic wave computations in SMT structures and plates with nano interfaces
7
作者 张武 洪涛 《Journal of Zhejiang University Science》 CSCD 2002年第1期6-12,共7页
This paper discusses the validity of (adaptive) Lagrange generalized plain finite element method (FEM) and plate element method for accurate analysis of acoustic waves in multi-layered piezoelectric structures with ti... This paper discusses the validity of (adaptive) Lagrange generalized plain finite element method (FEM) and plate element method for accurate analysis of acoustic waves in multi-layered piezoelectric structures with tiny interfaces between metal electrodes and surface mounted piezoelectric substrates. We have come to conclusion that the quantitative relationships between the acoustic and electric fields in a piezoelectric structure can be accurately determined through the proposed finite element methods. The higher-order Lagrange FEM proposed for dynamic piezoelectric computation is proved to be very accurate (prescribed relative error 0.02% - 0.04% ) and a great improvement in convergence accuracy over the higher order Mindlin plate element method for piezoelectric structural analysis due to the assumptions and corrections in the plate theories.The converged lagrange finite element methods are compared with the plate element methods and the computedresults are in good agreement with available exact and experimental data. The adaptive Lagrange finite elementmethods and a new FEA computer program developed for macro- and micro-scale analyses are reviewed, and recently extended with great potential to high-precision nano-scale analysis in this paper and the similarities between piezoelectric and seismic wave propagations in layered structures and plates are stressed. 展开更多
关键词 Lagrangian finite element surface mount resonator structure plate element anisotropic piezoelectric quartz material acoustic wave computational nano\|dynamics SMT(surface mount technology)
下载PDF
Study on surfce mount technology for fine pitch L type lead devices
8
作者 李明雨 冯武锋 +1 位作者 王春青 何民 《China Welding》 EI CAS 1998年第1期43-49,共7页
Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type lead devices welded are depicted. Bridging mechanism and influence factors are analyzed with two-dimensional geom... Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type lead devices welded are depicted. Bridging mechanism and influence factors are analyzed with two-dimensional geometric model. Based on this, high-density surface mount technology ( SMT) for fine pitch L type lead devices heated by scanning laser is raised. Surface mount process for QFP208 on printed circuit board (PCB) is studied. The results of tests are that it is quite possible to solve the solder bridging of surface mounting for fine pitch devices with scanning laser-heating method. 展开更多
关键词 surface Mount Technology (SMT) DEFECT BRIDGING laser-heating
下载PDF
Test research and mechanism analysis of vacuum fluxless laser soldering for SMD
9
作者 冯武锋 王春青 +1 位作者 李明雨 孙福江 《China Welding》 EI CAS 1998年第2期62-70,共9页
Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out... Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out. Fluxless soldering succeeded in spreading and wetting on Cu pad with laser heating source in vacuum surroundings. What' s more, this fluxless technology was applied in surface mounting of chip resistance successfully. 展开更多
关键词 VACUUM fluxless soldering LASER SMD (surface Mount Device)
下载PDF
Load Optimization Scheduling of Chip Mounter Based on Hybrid Adaptive Optimization 被引量:2
10
作者 Xuesong Yan Hao Zuo +2 位作者 Chengyu Hu Wenyin Gong Victor S.Sheng 《Complex System Modeling and Simulation》 2023年第1期1-11,共11页
A chip mounter is the core equipment in the production line of the surface-mount technology,which is responsible for finishing the mount operation.It is the most complex and time-consuming stage in the production proc... A chip mounter is the core equipment in the production line of the surface-mount technology,which is responsible for finishing the mount operation.It is the most complex and time-consuming stage in the production process.Therefore,it is of great significance to optimize the load balance and mounting efficiency of the chip mounter and improve the mounting efficiency of the production line.In this study,according to the specific type of chip mounter in the actual production line of a company,a maximum and minimum model is established to minimize the maximum cycle time of the chip mounter in the production line.The production efficiency of the production line can be improved by optimizing the workload scheduling of each chip mounter.On this basis,a hybrid adaptive optimization algorithm is proposed to solve the load scheduling problem of the mounter.The hybrid algorithm is a hybrid of an adaptive genetic algorithm and the improved ant colony algorithm.It combines the advantages of the two algorithms and improves their global search ability and convergence speed.The experimental results show that the proposed hybrid optimization algorithm has a good optimization effect and convergence in the load scheduling problem of chip mounters. 展开更多
关键词 surface Mount Technology(SMT) chip mounter load optimization scheduling adaptive genetic algorithm ant colony algorithm
原文传递
A Microwave Ceramic Band-Pass Filter for Mobile Communications with New Coupling Structure
11
作者 LIANG Fei WU Zhipeng +1 位作者 LU Wenzhong WANG Xiaochuan 《Wuhan University Journal of Natural Sciences》 CAS 2009年第1期43-46,共4页
A surface mounted device (SMD) microwave ceramic band-pass filter for mobile communication with a new coupling structure is reported in this paper. In this filter, the external and internal coupling structures are f... A surface mounted device (SMD) microwave ceramic band-pass filter for mobile communication with a new coupling structure is reported in this paper. In this filter, the external and internal coupling structures are fabricated on an alumina substrate and both resonators and coupling structures are placed into a metal house to cut off its radiation. The relationship between the coupling structures and the performance of the filter is analyzed by high frequency structure software (HFSS) and the filter with a center frequency of 836.5 MHz, bandwidth of 40.0 MHz, pass-band ripple of 0.1 dB and insertion loss of 1.5 dB has been successfully designed and fabricated. The measured results show a good agreement with the simulation results. 展开更多
关键词 band-pass filter coaxial resonator coupling coefficient surface mounted device (SMD)
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部