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Electrochemical investigation on the formations of Dy-Ni alloy films in dimethylformamide
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作者 HE Fengrong, WANG Yu, LIU Guankun, and SA LichangSchool of Chemistry and Chemical Engineering, Zhongshan University. Guangzhou 510275, China 《Rare Metals》 SCIE EI CAS CSCD 2002年第2期85-89,共5页
The elexctrochemical properties of Dy (III), Ni(II) + Ni(II) indimethylformamide were studied by cyclic voltammetry on Pt or Cuelectrode. Black, metallic lustered, compact and well adhesive Dy-Nialloy films can be co-... The elexctrochemical properties of Dy (III), Ni(II) + Ni(II) indimethylformamide were studied by cyclic voltammetry on Pt or Cuelectrode. Black, metallic lustered, compact and well adhesive Dy-Nialloy films can be co-deposited on Cu electrode bysweeping-potential-deposition method within some potentials. SEM,EDAX and XRD were used to analyze the alloy films. The Dy content inthe Dy-Ni alloy film is up to 56.91/100 (mass fraction) and the Dy-Ni alloy films are amorphous. 展开更多
关键词 Dy-Ni alloy film dimethylformamide (DMF) sweeping-potential-deposition-method induced coi-deposition
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