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低K介质和阻挡层金属对Cu互连TDDB寿命的影响
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《电子产品可靠性与环境试验》 2003年第2期67-67,共1页
关键词 低K介质 阻挡层金属 CU互连 tddb寿命 铜互联
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铜离子迁移现象及其对Cu金属化TDDB寿命的影响
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《电子产品可靠性与环境试验》 2004年第3期76-76,共1页
关键词 铜离子 迁移 Cu金属化 tddb寿命 时间相关介质击穿
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One Method for Fast Gate Oxide TDDB Lifetime Prediction 被引量:1
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作者 赵毅 万星拱 徐向明 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第12期2271-2274,共4页
A method for fast gate oxide TDDB lifetime prediction for process control monitors (PCM) is proposed. For normal TDDB lifetime prediction at operation voltage and temperature, we must ge(three lifetimes at relative... A method for fast gate oxide TDDB lifetime prediction for process control monitors (PCM) is proposed. For normal TDDB lifetime prediction at operation voltage and temperature, we must ge(three lifetimes at relative low stress voltages and operation temperature. Then we use these three lifetimes to project the TDDB lifetime at operation voltage and temperature via the E-model. This requires a very long time for measurement. With our new method,it can be calculated quickly by projecting the TDDB lifetime at operation voltage and temperature with measurement data at relatively high stress voltages. Our test case indicates that this method is very effective. And the result with our new method is very close to that with the normal TDDB lifetime prediction method. But the measurement time is less than 50s for one sample,less than 1/100000 of that with the normal prediction method. With this new method,we can monitor gate oxide TDDB lifetime on-line. 展开更多
关键词 tddb LIFETIME PREDICTION
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