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Regeneration of deactivated CeCoxO2 catalyst by simple thermal treatment 被引量:1
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作者 Yandi Cai Lihua Wang +3 位作者 Shuohan Yu Jingfang Sun Baochun Liu Lin Dong 《Journal of Rare Earths》 SCIE EI CAS CSCD 2020年第8期899-905,I0003,共8页
Active species loss owing to reactant stream washing is a general problem which industrial catalysts suffer from.In case of catalysts synthesized by co-precipitation method,which have active species unused in bulk pha... Active species loss owing to reactant stream washing is a general problem which industrial catalysts suffer from.In case of catalysts synthesized by co-precipitation method,which have active species unused in bulk phase,can be regenerated by a simple thermal treatment that leads to active species in bulk phase migration to surface of the deactivated catalysts.In this work,the influence of regeneration temperature was investigated by employing ammonium hydroxide washing to simulate reactant stream washing of CeCoxO2 catalysts for NO+CO reaction.It is found that the deactivated catalyst can be regenerated by simple thermal treatment and increasing calcination temperature could accelerate the Co species migration from the bulk phase to surface of catalysts. 展开更多
关键词 NO+CO CEO2 Catalyst regeneration thermal migration Rare earths
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Progress on Soldering Failure Analysis During the Period of Enlistment in Micro-Nanoelectronic Packaging
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作者 HUA Li HOU Hanna 《Wuhan University Journal of Natural Sciences》 CAS 2012年第3期268-276,共9页
With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily ... With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology.In this paper,research process and some typical failure mechanisms on interconnect solder point reliability are discussed,including electro-migration (EM),thermal migration (TM),K-cavity,corrosion,electrochemical migration (ECM) and whisker growth,etc.It provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability. 展开更多
关键词 electromigration (EM) and thermal migration (TM) corrosion electrochemical migration whisker growth
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