This paper presents a 1.2 V high accuracy thermal sensor analog front-end circuit with 7 probes placed around the microprocessor chip.This analog front-end consists of a BGR(bandgap reference),a DEM(dynamic element ma...This paper presents a 1.2 V high accuracy thermal sensor analog front-end circuit with 7 probes placed around the microprocessor chip.This analog front-end consists of a BGR(bandgap reference),a DEM(dynamic element matching)control,and probes.The BGR generates the voltages linear changed with temperature,which are followed by the data read out circuits.The superior accuracy of the BGR’s output voltage is a key factor for sensors fabricated via the FinFET digital process.Here,a 4-stage folded current bias structure is proposed,to increase DC accuracy and confer immunity against FinFET process variation due to limited device length and low current bias.At the same time,DEM is also adopted,so as to filter out current branch mismatches.Having been fabricated via a 12 nm FinFET CMOS process,200 chips were tested.The measurement results demonstrate that these analog front-end circuits can work steadily below 1.2 V,and a less than 3.1%3σ-accuracy level is achieved.Temperature stability is 0.088 mV/℃across a range from-40 to 130℃.展开更多
The monolithic integrated micro sensor is an important direction in the fields of integrated circuits and micro sensors. In this paper,a monolithic thermal vacuum sensor based on a micro-hotplate (MHP) and operating...The monolithic integrated micro sensor is an important direction in the fields of integrated circuits and micro sensors. In this paper,a monolithic thermal vacuum sensor based on a micro-hotplate (MHP) and operating under constant bias voltage conditions was designed. A new monolithic integrating mode was proposed,in which the dielectric and passiva- tion layers in standard CMOS processes were used as sensor structure layers,gate polysilicon as the sacrificial layer,and the second polysilicon layer as the sensor heating resistor. Then, the fabricating processes were designed and the monolithic thermal vacuum sensor was fabricated with a 0. 6μm mixed signal CMOS process followed by sacrificial layer etching technology. The measurement results show that the fabricated monolithic vacuum sensor can measure the pressure range of 2- 10^5 Pa and the output voltage is adjustable.展开更多
Low Resolution Thermal Array Sensors are widely used in several applications in indoor environments. In particular, one of these cheap, small and unobtrusive sensors provides a low-resolution thermal image of the envi...Low Resolution Thermal Array Sensors are widely used in several applications in indoor environments. In particular, one of these cheap, small and unobtrusive sensors provides a low-resolution thermal image of the environment and, unlike cameras;it is capable to detect human heat emission even in dark rooms. The obtained thermal data can be used to monitor older seniors while they are performing daily activities at home, to detect critical situations such as falls. Most of the studies in activity recognition using Thermal Array Sensors require human detection techniques to recognize humans passing in the sensor field of view. This paper aims to improve the accuracy of the algorithms used so far by considering the temperature environment variation. This method leverages an adaptive background estimation and a noise removal technique based on Kalman Filter. In order to properly validate the system, a novel installation of a single sensor has been implemented in a smart environment: the obtained results show an improvement in human detection accuracy with respect to the state of the art, especially in case of disturbed environments.展开更多
According to the sensing structure of a practical silicon resonant pressure micro sensor whose preliminary sensing unit is a square silicon diaphragm and the final sensing unit is a silicon beam resonator, its operati...According to the sensing structure of a practical silicon resonant pressure micro sensor whose preliminary sensing unit is a square silicon diaphragm and the final sensing unit is a silicon beam resonator, its operating mechanism is analyzed. The thermal resistor acts as the excited unit, and the piezoresistive unit acts as the detector, for the above micro sensor. By using the amplitude and phase conditions, the self exciting closed loop system is investigated based on the operating mechanism for the abov...展开更多
A thermal sensor for material identification is proposed. This paper describes the model,design, and testing of the sensor. Some factors of the detector which affect the performancesof the sensor are discussed. A new ...A thermal sensor for material identification is proposed. This paper describes the model,design, and testing of the sensor. Some factors of the detector which affect the performancesof the sensor are discussed. A new concept called the thermal sense characteristic parameter isadvanced, and the relationship between the thermal sense characteristic parameter and theresponse of the sensor is given. A method for computing thermal sense characteristic param-eter from the response of the sensor is indicated. Based on our developed sensor, the correc-tion rates of the testing results of the seven materials (copper, aluminum, steel, rubber, PCB,polyflon, paper) from 130 identifications are 100%.展开更多
This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a ...This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.展开更多
基金This work was supported by the National Natural Science Foundation of China(No.61432016 and No.61521092)the Key Program of the Chinese Academy of Sciences(ZDRWXH-2017-1)the Strategic Priority Research Program of the Chinese Academy of Sciences(No.XDC05020000).
文摘This paper presents a 1.2 V high accuracy thermal sensor analog front-end circuit with 7 probes placed around the microprocessor chip.This analog front-end consists of a BGR(bandgap reference),a DEM(dynamic element matching)control,and probes.The BGR generates the voltages linear changed with temperature,which are followed by the data read out circuits.The superior accuracy of the BGR’s output voltage is a key factor for sensors fabricated via the FinFET digital process.Here,a 4-stage folded current bias structure is proposed,to increase DC accuracy and confer immunity against FinFET process variation due to limited device length and low current bias.At the same time,DEM is also adopted,so as to filter out current branch mismatches.Having been fabricated via a 12 nm FinFET CMOS process,200 chips were tested.The measurement results demonstrate that these analog front-end circuits can work steadily below 1.2 V,and a less than 3.1%3σ-accuracy level is achieved.Temperature stability is 0.088 mV/℃across a range from-40 to 130℃.
文摘The monolithic integrated micro sensor is an important direction in the fields of integrated circuits and micro sensors. In this paper,a monolithic thermal vacuum sensor based on a micro-hotplate (MHP) and operating under constant bias voltage conditions was designed. A new monolithic integrating mode was proposed,in which the dielectric and passiva- tion layers in standard CMOS processes were used as sensor structure layers,gate polysilicon as the sacrificial layer,and the second polysilicon layer as the sensor heating resistor. Then, the fabricating processes were designed and the monolithic thermal vacuum sensor was fabricated with a 0. 6μm mixed signal CMOS process followed by sacrificial layer etching technology. The measurement results show that the fabricated monolithic vacuum sensor can measure the pressure range of 2- 10^5 Pa and the output voltage is adjustable.
文摘Low Resolution Thermal Array Sensors are widely used in several applications in indoor environments. In particular, one of these cheap, small and unobtrusive sensors provides a low-resolution thermal image of the environment and, unlike cameras;it is capable to detect human heat emission even in dark rooms. The obtained thermal data can be used to monitor older seniors while they are performing daily activities at home, to detect critical situations such as falls. Most of the studies in activity recognition using Thermal Array Sensors require human detection techniques to recognize humans passing in the sensor field of view. This paper aims to improve the accuracy of the algorithms used so far by considering the temperature environment variation. This method leverages an adaptive background estimation and a noise removal technique based on Kalman Filter. In order to properly validate the system, a novel installation of a single sensor has been implemented in a smart environment: the obtained results show an improvement in human detection accuracy with respect to the state of the art, especially in case of disturbed environments.
基金The Chinese Aeronautics Science Foundation(99I5 10 0 6)Foundation for University Key Teacherby the Ministry of Education
文摘According to the sensing structure of a practical silicon resonant pressure micro sensor whose preliminary sensing unit is a square silicon diaphragm and the final sensing unit is a silicon beam resonator, its operating mechanism is analyzed. The thermal resistor acts as the excited unit, and the piezoresistive unit acts as the detector, for the above micro sensor. By using the amplitude and phase conditions, the self exciting closed loop system is investigated based on the operating mechanism for the abov...
基金Project supported by the National Natural Science Foundation of China.
文摘A thermal sensor for material identification is proposed. This paper describes the model,design, and testing of the sensor. Some factors of the detector which affect the performancesof the sensor are discussed. A new concept called the thermal sense characteristic parameter isadvanced, and the relationship between the thermal sense characteristic parameter and theresponse of the sensor is given. A method for computing thermal sense characteristic param-eter from the response of the sensor is indicated. Based on our developed sensor, the correc-tion rates of the testing results of the seven materials (copper, aluminum, steel, rubber, PCB,polyflon, paper) from 130 identifications are 100%.
基金Project supported by the National Natural Science Foundation of China (Grant No 60576053)Technology Innovation of Chinese Academy of Sciences (Grant No CXJJ-176)
文摘This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.