With the packing density growing continuously in integrated electronic devices,sufficient heat dissipation becomes a serious challenge.Recently,dielectric materials with high thermal conductivity have brought insight ...With the packing density growing continuously in integrated electronic devices,sufficient heat dissipation becomes a serious challenge.Recently,dielectric materials with high thermal conductivity have brought insight into effective dissipation of waste heat in electronic devices to prevent them from overheating and guarantee the performance stability.Layered CrOCl,an antiferromagnetic insulator with low-symmetry crystal structure and atomic level flatness,might be a promising solution to the thermal challenge.Herein,we have systematically studied the thermal transport of suspended few-layer CrOCl flakes by microRaman thermometry.The CrOCl flakes exhibit high thermal conductivities along zigzag direction,from~392±33 to~1,017±46 W·m^(−1)·K^(−1) with flake thickness from 2 to 50 nm.Besides,pronounced thickness-dependent thermal conductivity ratio(/from~2.8±0.24 to~4.3±0.25)has been observed in the CrOCl flakes,attributed to the discrepancy of phonon dispersion and phonon surface scattering.As a demonstration to the heat sink application of layered CrOCl,we then investigate the energy dissipation in graphene devices on CrOCl,SiO_(2) and hexagonal boron nitride(h-BN)substrates,respectively.The graphene device temperature rise on CrOCl is only 15.4%of that on SiO_(2) and 30%on h-BN upon the same electric power density,indicating the efficient heat dissipation of graphene device on CrOCl.Our study provides new insights into two-dimentional(2D)dielectric material with high thermal conductivity and strong anisotropy for the application of thermal management in electronic devices.展开更多
The exponentially increasing heat generation in electronic devices,induced by high power density and miniaturization,has become a dominant issue that affects carbon footprint,cost,performance,reliability,and lifespan....The exponentially increasing heat generation in electronic devices,induced by high power density and miniaturization,has become a dominant issue that affects carbon footprint,cost,performance,reliability,and lifespan.Liquid metals(LMs)with high thermal conductivity are promising candidates for effective thermal management yet are facing pump-out and surface-spreading issues.Confinement in the form of metallic particles can address these problems,but apparent alloying processes elevate the LM melting point,leading to severely deteriorated stability.Here,we propose a facile and sustainable approach to address these challenges by using a biogenic supramolecular network as an effective diffusion barrier at copper particle-LM(EGaIn/Cu@TA)interfaces to achieve superior thermal conduction.The supramolecular network promotes LM stability by reducing unfavorable alloying and fluidity transition.The EGaIn/Cu@TA exhibits a record-high metallic-mediated thermal conductivity(66.1 W m^(-1) K^(-1))and fluidic stability.Moreover,mechanistic studies suggest the enhanced heat flow path after the incorporation of copper particles,generating heat dissipation suitable for computer central processing units,exceeding that of commercial silicone.Our results highlight the prospects of renewable macromolecules isolated from biomass for the rational design of nanointerfaces based on metallic particles and LM,paving a new and sustainable avenue for high-performance thermal management.展开更多
Composites that can rapidly self-healing their structure and function at room temperature have broad application prospects.However,in view of the complexity of composite structure and composition,its self-heal is faci...Composites that can rapidly self-healing their structure and function at room temperature have broad application prospects.However,in view of the complexity of composite structure and composition,its self-heal is facing challenges.In this article,supramolecular effect is proposed to repair the multistage structure,mechanical and thermal properties of composite materials.A stiff and tough supramolecular frameworks of 2-[[(butylamino)carbonyl]oxy]ethyl ester(PBA)–polydimethylsiloxane(PDMS)were established using a chain extender with double amide bonds in a side chain to extend prepolymers through copolymerization.Then,by introducing the copolymer into a folded graphene film(FGf),a highly thermally conductive composite of PBA–PDMS/FGf with self-healing capacity was fabricated.The ratio of crosslinking and hydrogen bonding was optimized to ensure that PBA–PDMS could completely self-heal at room temperature in 10 min.Additionally,PBA–PDMS/FGf exhibits a high tensile strength of 2.23±0.15 MPa at break and high thermal conductivity of 13±0.2 W m^(−1)K^(−1);of which the self-healing efficiencies were 100%and 98.65%at room temperature for tensile strength and thermal conductivity,respectively.The excellent self-healing performance comes from the efficient supramolecular interaction between polymer molecules,as well as polymer molecule and graphene.This kind of thermal conductive self-healing composite has important application prospects in the heat dissipation field of next generation electronic devices in the future.展开更多
This paper presents the temperature dependence of in-plane thermal diffusivity and anisotropy distribution for pitch-based carbon-fiber-reinforced polymers (CFRPs). The measurement was performed using the laser-spot p...This paper presents the temperature dependence of in-plane thermal diffusivity and anisotropy distribution for pitch-based carbon-fiber-reinforced polymers (CFRPs). The measurement was performed using the laser-spot periodic heating method. The samples were unidirectional (UD) and crossply (CP) CFRPs. All carbon fibers of the UD samples ran in one direction, while those of the CP samples ran in two directions. In both UD and CP CFRPs, from -80°C to +80°C, temperature dependence of thermal diffusivity values increased as temperature decreased. In this temperature range, the anisotropic ratio between the fiber direction and its perpendicular direction of the UD CFRP was 106 - 124. During the anisotropy distribution measurement, it was found that thermal anisotropy can be visualized by scanning the laser in a circle on the sample. The thermal diffusivity of the UD CFRP in the fiber direction was 17 times larger than that in the 15°direction, and the thermal diffusivity in the other directions was lower than that in the 15°direction. The anisotropy distribution for the CP CFRP reflected its inhomogeneous structure.展开更多
Silica aerogels are light weight, nanostructured, and highly porous materials with an open pore structure. Due to their excellent characteristics, such as extremely low thermal conductivity, low density and high poros...Silica aerogels are light weight, nanostructured, and highly porous materials with an open pore structure. Due to their excellent characteristics, such as extremely low thermal conductivity, low density and high porosity, the silica aerogels become promising potential adsorbents, catalysts, thermal insulation, and acoustic absorption materials for environmental purposes. This paper presents the synthesis of a highly flexible polymer modified silica aerogel with the use of a cellulose-methyltriethoxysilane (MTES) precursor in a two-step acid-base catalyzed sol-gel process. The physical properties of the resulting aerogels were characterized by thermogravimetry, scanning electron microscopy, nitrogen adsorption-desorption, contact angle, thermal conductivity measurements, compression testing and Fourier transform infrared spectroscopy. The fabricated aerogel exhibited high flexibility with a Young’s modulus of compression of 0.33 MPa and the density of 0.132 g/cm3. They were hydrophobic in nature and had low thermal conductivity. Preparation of aerogel with solid waste (fly ash/bottom ash) is also discussed. The preliminary results showed that the materials have great potential for environmental application, i.e. enhancement of solid waste recycling rate by converting waste to high value-added materials, super thermal and acoustic insulation materials in green building and removal of oil spilled into surface drainage.展开更多
基金supported by the National Natural Science Foundation of China(No.11874423).
文摘With the packing density growing continuously in integrated electronic devices,sufficient heat dissipation becomes a serious challenge.Recently,dielectric materials with high thermal conductivity have brought insight into effective dissipation of waste heat in electronic devices to prevent them from overheating and guarantee the performance stability.Layered CrOCl,an antiferromagnetic insulator with low-symmetry crystal structure and atomic level flatness,might be a promising solution to the thermal challenge.Herein,we have systematically studied the thermal transport of suspended few-layer CrOCl flakes by microRaman thermometry.The CrOCl flakes exhibit high thermal conductivities along zigzag direction,from~392±33 to~1,017±46 W·m^(−1)·K^(−1) with flake thickness from 2 to 50 nm.Besides,pronounced thickness-dependent thermal conductivity ratio(/from~2.8±0.24 to~4.3±0.25)has been observed in the CrOCl flakes,attributed to the discrepancy of phonon dispersion and phonon surface scattering.As a demonstration to the heat sink application of layered CrOCl,we then investigate the energy dissipation in graphene devices on CrOCl,SiO_(2) and hexagonal boron nitride(h-BN)substrates,respectively.The graphene device temperature rise on CrOCl is only 15.4%of that on SiO_(2) and 30%on h-BN upon the same electric power density,indicating the efficient heat dissipation of graphene device on CrOCl.Our study provides new insights into two-dimentional(2D)dielectric material with high thermal conductivity and strong anisotropy for the application of thermal management in electronic devices.
基金National Talents ProgramNational Natural Science Foundation of China,Grant/Award Numbers:22108181,22178233+4 种基金Talents Program of Sichuan ProvinceDouble First-Class University Plan of Sichuan UniversityState Key Laboratory of Polymer Materials Engineering,Grant/Award Number:sklpme 2020-03-01Sichuan Science and Technology Program,Grant/Award Number:2022YFN0070The Sichuan Province Postdoctoral Special Funding。
文摘The exponentially increasing heat generation in electronic devices,induced by high power density and miniaturization,has become a dominant issue that affects carbon footprint,cost,performance,reliability,and lifespan.Liquid metals(LMs)with high thermal conductivity are promising candidates for effective thermal management yet are facing pump-out and surface-spreading issues.Confinement in the form of metallic particles can address these problems,but apparent alloying processes elevate the LM melting point,leading to severely deteriorated stability.Here,we propose a facile and sustainable approach to address these challenges by using a biogenic supramolecular network as an effective diffusion barrier at copper particle-LM(EGaIn/Cu@TA)interfaces to achieve superior thermal conduction.The supramolecular network promotes LM stability by reducing unfavorable alloying and fluidity transition.The EGaIn/Cu@TA exhibits a record-high metallic-mediated thermal conductivity(66.1 W m^(-1) K^(-1))and fluidic stability.Moreover,mechanistic studies suggest the enhanced heat flow path after the incorporation of copper particles,generating heat dissipation suitable for computer central processing units,exceeding that of commercial silicone.Our results highlight the prospects of renewable macromolecules isolated from biomass for the rational design of nanointerfaces based on metallic particles and LM,paving a new and sustainable avenue for high-performance thermal management.
基金financially supported by National Natural Science Foundation of China (Grant Nos. 52173078, 52130303, 51973158, 51803151, and 51973152)the Science Foundation for Distinguished Young Scholars in Tianjin (No. 19JCJQJC61700)Tianjin Postgraduate Scientific Research Innovation Project in 2019 (2019YJSB181)
文摘Composites that can rapidly self-healing their structure and function at room temperature have broad application prospects.However,in view of the complexity of composite structure and composition,its self-heal is facing challenges.In this article,supramolecular effect is proposed to repair the multistage structure,mechanical and thermal properties of composite materials.A stiff and tough supramolecular frameworks of 2-[[(butylamino)carbonyl]oxy]ethyl ester(PBA)–polydimethylsiloxane(PDMS)were established using a chain extender with double amide bonds in a side chain to extend prepolymers through copolymerization.Then,by introducing the copolymer into a folded graphene film(FGf),a highly thermally conductive composite of PBA–PDMS/FGf with self-healing capacity was fabricated.The ratio of crosslinking and hydrogen bonding was optimized to ensure that PBA–PDMS could completely self-heal at room temperature in 10 min.Additionally,PBA–PDMS/FGf exhibits a high tensile strength of 2.23±0.15 MPa at break and high thermal conductivity of 13±0.2 W m^(−1)K^(−1);of which the self-healing efficiencies were 100%and 98.65%at room temperature for tensile strength and thermal conductivity,respectively.The excellent self-healing performance comes from the efficient supramolecular interaction between polymer molecules,as well as polymer molecule and graphene.This kind of thermal conductive self-healing composite has important application prospects in the heat dissipation field of next generation electronic devices in the future.
文摘This paper presents the temperature dependence of in-plane thermal diffusivity and anisotropy distribution for pitch-based carbon-fiber-reinforced polymers (CFRPs). The measurement was performed using the laser-spot periodic heating method. The samples were unidirectional (UD) and crossply (CP) CFRPs. All carbon fibers of the UD samples ran in one direction, while those of the CP samples ran in two directions. In both UD and CP CFRPs, from -80°C to +80°C, temperature dependence of thermal diffusivity values increased as temperature decreased. In this temperature range, the anisotropic ratio between the fiber direction and its perpendicular direction of the UD CFRP was 106 - 124. During the anisotropy distribution measurement, it was found that thermal anisotropy can be visualized by scanning the laser in a circle on the sample. The thermal diffusivity of the UD CFRP in the fiber direction was 17 times larger than that in the 15°direction, and the thermal diffusivity in the other directions was lower than that in the 15°direction. The anisotropy distribution for the CP CFRP reflected its inhomogeneous structure.
文摘Silica aerogels are light weight, nanostructured, and highly porous materials with an open pore structure. Due to their excellent characteristics, such as extremely low thermal conductivity, low density and high porosity, the silica aerogels become promising potential adsorbents, catalysts, thermal insulation, and acoustic absorption materials for environmental purposes. This paper presents the synthesis of a highly flexible polymer modified silica aerogel with the use of a cellulose-methyltriethoxysilane (MTES) precursor in a two-step acid-base catalyzed sol-gel process. The physical properties of the resulting aerogels were characterized by thermogravimetry, scanning electron microscopy, nitrogen adsorption-desorption, contact angle, thermal conductivity measurements, compression testing and Fourier transform infrared spectroscopy. The fabricated aerogel exhibited high flexibility with a Young’s modulus of compression of 0.33 MPa and the density of 0.132 g/cm3. They were hydrophobic in nature and had low thermal conductivity. Preparation of aerogel with solid waste (fly ash/bottom ash) is also discussed. The preliminary results showed that the materials have great potential for environmental application, i.e. enhancement of solid waste recycling rate by converting waste to high value-added materials, super thermal and acoustic insulation materials in green building and removal of oil spilled into surface drainage.
