SIMULATION IN THERMAL DESIGN FOR ELECTRONIC CONTROL UNIT OF ELECTRONIC UNIT PUMP

The high working junction temperature of power component is the most common reason of its failure. So the thermal design is of vital importance in electronic control unit （ECU） design. By means of circuit simulation, the thermal design of ECU for electronic unit pump （EUP） fuel system is applied. The power dissipation model of each power component in the ECU is created and simulated. According to the analyses of simulation results, the factors which affect the power dissipation of components are analyzed. Then the ways for reducing the power dissipation of power components are carried out. The power dissipation of power components at different engine state is calculated and analyzed. The maximal power dissipation of each power component in all possible engine state is also carried out based on these simulations. A cooling system is designed based on these studies. The tests show that the maximum total power dissipation of ECU drops from 43.2 W to 33.84 W after these simulations and optimizations. These applications of simulations in thermal design of ECU can greatly increase the quality of the design, save the design cost and shorten design time

Effect of FeSi additive in dual-chamber sample cup on thermal analysis characteristic values and vermiculating rate of compacted graphite iron

Thermal analysis plays a key role in the online inspection of molten iron quality.Different solidification process of molten iron can be reflected by thermal analysis curves,and silicon is one of important elements affecting the solidification of molten iron.In this study,FeSi75 was added in one chamber of the dual-chamber sample cup,and the influences of FeSi75 additive on the characteristic values of thermal analysis curves and vermiculating rate were investigated.The results show that with the increase of FeSi75,the start temperature of austenite formation TALfirstly decreases and then increases,but the start temperature of eutectic growth TSEF,the lowest eutectic temperature TEU,temperature at maximum eutectic reaction rate TEM,and highest eutectic temperature TERkeep always an increase.The temperature at final solidification point TEShas little change.The FeSi75 additive has different influences on the vermiculating rate of molten iron with different vermiculation,and the vermiculating rate increases for lower vermiculation molten iron while decreases for higher one.According to the thermal analysis curves obtained by a dual-chamber sample cup with 0.30wt.%FeSi75 additive in one chamber,the vermiculating rate of molten iron can be evaluated by comparing the characteristic values of these curves.The time differenceΔtERcorresponding to the highest eutectic temperature TERhas a closer relationship with the vermiculating rate,and a parabolic regression curve between the time differenceΔtERand vermiculating rateηhas been obtained within the range of 65%to 95%,which is suitable for the qualified melt.

Review of Thermal Design of SiC Power Module for Motor Drive in Electrical Vehicle Application

In the current vehicle electric propulsion systems,the thermal design of power modules heavily relies on empirical knowledge,making it challenging to effectively optimize irregularly arranged Pinfin structures,thereby limiting their performance.This paper aims to review the underlying mechanisms of how irregularly arranged Pinfins influence the thermal characteristics of power modules and introduce collaborative thermal design with DC bus capacitor and motor.Literature considers chip size,placement,coolant flow direction with the goal of reducing thermal resistance of power modules,minimizing chip junction temperature differentials,and optimizing Pinfin layouts.In the first step,algorithms should efficiently generating numerous unique irregular Pinfin layouts to enhance optimization quality.The second step is to efficiently evaluate Pinfin layouts.Simulation accuracy and speed should be ensured to improve computational efficiency.Finally,to improve overall heat dissipation effectiveness,papers establish models for capacitors,motors,to aid collaborative Pinfin optimization.These research outcomes will provide essential support for future developments in high power density motor drive for vehicles.

Static and Thermal Analysis of Aluminium (413,390,384 and 332) Piston Using Finite Element Method

The main objective of this research was to examine the suitability of aluminium alloy to design a piston of an internal combustion engine for improvement in weight and cost reduction. The piston was modelled using Autodesk Inventor 2017 software. The modelled piston was then imported into Ansys for further analysis. Static structural and thermal analysis were carried out on the pistons of the four different materials namely: Al 413 alloy, Al 384 alloy, Al 390 alloy and Al332 alloy to determine the total deformation, equivalent Von Mises stress, maximum shear stress, and the safety factor. The results of the study revealed that, aluminium 332 alloy piston deformed less compared to the deformations of aluminium 390 alloy piston, aluminium 384 alloy piston and aluminium 413 alloy piston. The induced Von Mises stresses in the pistons of the four different materials were found to be far lower than the yield strengths of all the materials. Hence, all the selected materials including the implementing material have equal properties to withstand the maximum gas load. All the selected materials were observed to have high thermal conductivity enough to be able to withstand the operating temperature in the engine cylinders.

90 years of thermal analysis as a control tool in the melting of cast iron

Since its first literature mention in conjunction with cast iron in 1931 by Esser and Lautenbusch,thermal analysis(TA)has journeyed a long way.Today it is an accepted and widely used tool for process control for all types of cast irons.This paper reviews the latest progress in the development of equipment and analysis methods that make TA successful in applications such as the estimation of chemical composition,graphitization potential,and the shape and number of graphite aggregates.The potential and limitations of the prediction of shrinkage defects propensity are analyzed in some details.Examples of attempts at prediction of mechanical properties and shrinkage propensity are also discussed.Several graphs showing the data scattering are presented to convey the reader a better sense of the accuracy of various predictions.

Transient thermal analysis as measurement method for IC package structural integrity

Practices of IC package reliability testing are reviewed briefly, and the application of transient thermal analysis is examined in great depth. For the design of light sources based on light emitting diode （LED） efficient and accurate reliability testing is required to realize the potential lifetimes of 105 h. Transient thermal analysis is a standard method to determine the transient thermal impedance of semiconductor devices, e.g. power electronics and LEDs. The temperature of the semiconductor junctions is assessed by time-resolved measurement of their forward voltage （Vf）. The thermal path in the IC package is resolved by the transient technique in the time domain. This enables analyzing the structural integrity of the semiconductor package. However, to evaluate thermal resistance, one must also measure the dissipated energy of the device （i.e., the thermal load） and the k-factor. This is time consuming, and measurement errors reduce the accuracy. To overcome these limitations, an innovative approach, the relative thermal resistance method, was developed to reduce the measurement effort, increase accuracy and enable automatic data evaluation. This new way of evaluating data simplifies the thermal transient analysis by eliminating measurement of the k-factor and thermal load, i.e. measurement of the lumen flux for LEDs, by normalizing the transient Vf data. This is especially advantageous for reliability testing where changes in the thermal path, like cracks and delaminations, can be determined without measuring the k-factor and thermal load. Different failure modes can be separated in the time domain. The sensitivity of the method is demonstrated by its application to high- power white InGaN LEDs. For detailed analysis and identification of the failure mode of the LED packages, the transient signals are simulated by time-resolved finite element （FE） simulations. Using the new approach, the transient thermal analysis is enhanced to a powerful tool for reliability investigation of semiconductor packages in accelerated lifetime tests and for inline inspection. This enables automatic data analysis of the transient thermal data required for processing a large amount of data in production and reliability testing. Based on the method, the integrity of LED packages can be tested by inline, outgoing inspection and the lifetime prediction of the products is improved.

Solid fraction evolution characteristics of semi-solid A356 alloy and in-situ A356–TiB_2 composites investigated by differential thermal analysis

The key factor in semi-solid metal processing is the solid fraction at the forming temperature because it affects the microstructure and mechanical properties of the thixoformed components. Though an enormous amount of data exists on the solid fraction-temperature re- lationship in A356 alloy, information regarding the solid fraction evolution characteristics of A356-TiB2 composites is scarce. The present article establishes the temperature-solid fraction correlation in A356 alloy and A356-xTiB2 （x = 2.5wt% and 5wt%） composites using dif- ferential thermal analysis （DTA）. The DTA results indicate that the solidification characteristics of the composites exhibited a variation of 2℃ and 3℃ in liquidus temperatures and a variation of 3℃ and 5℃ in solidus temperatures with respect to the base alloy. Moreover, the eutectic growth temperature and the solid fraction（fs） vs. temperature characteristics of the composites were found to be higher than those of the base alloy. The investigation revealed that in-situ formed TiB2 particles in the molten metal introduced more nucleation sites and reduced undercooling.

Experimental Research of Electronic Devices Thermal Control Using Metallic Phase Change Materials

A Phase-change thermal control unit( PTCU) filled with metallic phase change material( PCM) Bismuth alloy for electric devices thermal protection was developed and investigated experimentally. The PTCU filled with PCM was designed and manufactured. Resistance heating components( RCHs) produced 1 W,3 W, 5 W,7W,and 10 W for simulating heat generation of electronic devices. At various heating power levels,the performance of PTCU were tested during heating period and one duty cycle period. The experimental results show that the PTCU delays RCH reaching the maximum operating temperature. Also,a numerical model was developed to enable interpretation of experimental results and to perform parametric studies. The results confirmed that the PTCU is suitable for electric devices thermal control.

Mineralogy and Thermal Analysis of Natural Pozzolana Opal Shale with Nano-pores

Thermodynamic stability, microvoid distribution and phases transformation of natural pozzolana opal shale（POS） were studied systematically in this work. XRD analysis showed that opal-CT, including microcrystal cristobalite and tridymite, is a major component of POS. DTA and FT-IR indicated that there were many hydroxyl groups and acid sites on the surface of amorphous SiO2 materials. FE-SEM analysis exhibited amorphous SiO2 particles（opal-A） covering over stacking sequences microcrystal cristobalite and tridymite. Meanwhile, MIP analysis demonstrated that porosity and pore size distribution of POS remained uniform below 600 ℃. Because stable porous microstructure is a key factor in improving photocatalyst activity, POS is suited to preparing highly active supported.

Hydrogen Bonding in Thermoplastic Polyurethane Elastomers:IR Thermal Analysis

The hydrogen bond percentage and its temperature dependence of the three TPU samples synthesized from polytetrahydrofuran, 4,4'-diphenylmethane diisocyanate, N -methyl diethanol amine or 1,4-butane diol were studied by means of IR thermal analysis. The enthalpy and the entropy of the hydrogen bond dissociation were determined by the Van't Hoff plot.

APPLICATION OF THERMAL ANALYSIS TO THE QUICK DETERMINATION OF THE PROXIMATE ANALYSIS ITEMS AND CALORIC VALUE FOR COAL

A research on the application of a TG-DTA(thermal gravimetry aifferential thermal analysis)to the quick determination of moisture,organic volatile fixed carbon,ash and caloric value for coal is described.

Numerical Investigation of Laser Surface Hardening of AISI 4340 Using 3D FEM Model for Thermal Analysis of Different Laser Scanning Patterns

Laser surface hardening is becoming one of the most successful heat treatment processes for improving wear and fatigue properties of steel parts. In this process, the heating system parameters and the material properties have important effects on the achieved hardened surface characteristics. The control of these variables using predictive modeling strategies leads to the desired surface properties without following the fastidious trial and error method. However, when the dimensions of the surface to be treated are larger than the cross section of the laser beam, various laser scanning patterns can be used. Due to their effects on the hardened surface properties, the attributes of the selected scanning patterns become significant variables in the process. This paper presents numerical and experimental investigations of four scanning patterns for laser surface hardening of AISI 4340 steel. The investigations are based on exhaustive modelling and simulation efforts carried out using a 3D finite element thermal analysis and structured experimental study according to Taguchi method. The temperature distribution and the hardness profile attributes are used to evaluate the effects of heating parameters and patterns design parameters on the hardened surface characteristics. This is very useful for integrating the scanning patterns’ features in an efficient predictive modeling approach. A structured experimental design combined to improved statistical analysis tools is used to assess the 3D model performance. The experiments are performed on a 3 kW Nd:Yag laser system. The modeling results exhibit a great agreement between the predicted and measured values for the hardened surface characteristics. The model evaluation reveals also its ability to provide not only accurate and robust predictions of the temperature distribution and the hardness profile as well an in-depth analysis of the effects of the process parameters.

Evaluation on the Thermal Stability and Hazards Behaviors of ADVN Using Green Thermal Analysis Approach

ADVN （2,2＇-Azobis （2,4-dimethyl） valeronitrile）, a free radical initiator, is widely applied for the polymerization reaction of polymers in the chemical industries. When ADVN releases free radical during the decomposition process, it can accompany abundant heat and huge pressure to increase the possibility of thermal runaway and hazard, causing unacceptable thermal explosion or fire accidents. To develop an inherently safer process for ADVN, the thermal stability parameters of ADVN were obtained to investigate thermal decomposition characteristics using a DSC （differential scanning calorimetry） and TG （thermogravimetry）. We used various kinetic models to completely depict the kinetic behavior and determine the thermal safety parameters for ADVN. The green thermal analysis approach could be used to substitute for complicated procedures and large-scale experiments of traditional thermal analysis methods, avoiding environmental pollution and energy depletion.

Modal and Thermal Analysis of a Modified Connecting Rod of an Internal Combustion Engine Using Finite Element Method

The connecting rod is one of the most important moving components in an internal combustion engine. The present work determined the possibility of using aluminium alloy 7075 material to design and manufacture a connecting rod for weight optimisation without losing the strength of the connecting rod. It considered modal and thermal analyses to investigate the suitability of the material for connecting rod design. The parameters that were considered under the modal analysis were: total deformation, and natural frequency, while the thermal analysis looked at the temperature distribution, total heat flux and directional heat flux of the four connecting rods made with titanium alloy, grey cast iron, structural steel and aluminium 7075 alloy respectively. The connecting rod was modelled using Autodesk inventor2017 software using the calculated parameters. The steady-state thermal analysis was used to determine the induced heat flux and directional heat flux. The study found that Aluminium 7075 alloy deformed more than the remaining three other materials but has superior qualities in terms of vibrational natural frequency, total heat flux and lightweight compared to structural steel, grey cast iron and titanium alloy.

Recent advances on thermal analysis of stretchable electronics

Stretchable electronics, which offers the performance of conventional wafer-based devices and mechan- ical properties of a rubber band, enables many novel applications that are not possible through conven- tional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1-2℃ temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.

Finite Element Analysis of the Material’s Area Affected during a Micro Thermal Analysis Applied to Homogeneous Materials

Micro-thermal analysis (μ-TA), with a miniaturized thermo-resistive probe, allows topographic and thermal imaging of surfaces to be carried out and permits localized thermal analysis of materials. In order to estimate the effective volume of material thermally affected during this localized measurement, simulations, using finite element method were used. Several parameters and conditions were considered. So, thermal conductivity was found to be the driving physical parameter in thermal exchanges. Indeed, the evolution of the heat affected zone (HAZ) versus thermal conductivity can well be described by a linear interpolation. Therefore it is possible to estimate the HAZ before experimental measurements. This result is an important progress especially for accurate interphase characterization in heterogeneous materials.

A Chip Level Thermal Analysis Algorithm Using Boundary Element Method

With the scale of integration and operation speed of modern ICs increasing,a series of thermo-related problems arise.Hot spots,which are due to the uneven distribution of heat,invalidate some functions of the chip.An algorithm is presented to calculate the profile.With the boundary element method,3D problems are converted into 2D ones,so the temperatures of both the chip surface and inner points can be calculated quickly.This algorithm can be used to evaluate the thermal quality of a definite chip.

Thermal resistance matrix representation of thermal effects and thermal design of microwave power HBTs with two-dimensional array layout

Based on the thermal network of the two-dimensional heterojunction bipolar transistors(HBTs) array, the thermal resistance matrix is presented, including the self-heating thermal resistance and thermal coupling resistance to describe the self-heating and thermal coupling effects, respectively.For HBT cells along the emitter length direction, the thermal coupling resistance is far smaller than the self-heating thermal resistance, and the peak junction temperature is mainly determined by the self-heating thermal resistance.However, the thermal coupling resistance is in the same order with the self-heating thermal resistance for HBT cells along the emitter width direction.Furthermore, the dependence of the thermal resistance matrix on cell spacing along the emitter length direction and cell spacing along the emitter width direction is also investigated, respectively.It is shown that the moderate increase of cell spacings along the emitter length direction and the emitter width direction could effectively lower the self-heating thermal resistance and thermal coupling resistance,and hence the peak junction temperature is decreased, which sheds light on adopting a two-dimensional non-uniform cell spacing layout to improve the uneven temperature distribution.By taking a 2 × 6 HBTs array for example, a twodimensional non-uniform cell spacing layout is designed, which can effectively lower the peak junction temperature and reduce the non-uniformity of the dissipated power.For the HBTs array with optimized layout, the high power-handling capability and thermal dissipation capability are kept when the bias voltage increases.

Hydrothermal Synthesis,Crystal Structure and Thermal Analysis of a Dinuclear Complex Cd_2(3,5-Dinitrobenzoate)_4(pyridine)_4

A dinuclear complex Cd2（dnba）4（pyridine）4 （dnba = 3,5-dinitrobenzoate） has been synthesized by hydrothermal method and characterized by X-ray single-crystal diffraction, elemental analysis, FT-IR spectroscopy, DSC and TG-DTG techniques. The complex with empirical formula C48H32Cd2NI2024 （Mr = 692.83） crystallizes in monoclinic, space group P21/n with a - 12.0344（14）, b = 10.5752（13）, c = 21.578（3） A, β = 104.150（2）°, V = 2662.8（6） A^3, Z = 2, D, = 1.728 g/cm^3,μ（MoKa） = 0.897 mm^-1, F（000） = 1384, S = 1.016 and （△/σ）max = 0.001. R = 0.0638 and wR = 0.0737 for all data; the final R = 0.0337 and wR = 0.0644. In this complex, four carboxylates are bidentate-or chelate-coordinated with the Cd（Ⅱ） centers to give the dinuclear structure. The other coordination positions of Cd（Ⅱ） are occupied by the lone pair electrons from N of four pyridines. Thermal analyses DSC and TG-DTG have been used to determine the thermal decomposition mechanism of the title complex.

Influence of fading on characteristics of thermal analysis curve of compacted graphite iron

In general, during the production of compacted graphite iron (CGI), the active residual magnesium reduces and the effect of inoculation fades after magnesium treatment. In this paper, characteristics of the thermal analysis curve of CGI are compared with those of ductile iron and grey cast iron. The fading effect on the compacted graphite percentage and thermal analysis curve were also studied. Results indicate that the undercooling of CGI is as low as that of ductile iron, but CGI shows evident recalescence. In fading process, the magnesium element acts with oxygen. For a decrease in magnesium content, both the compacted graphite percentage and the austenitic liquidus temperature increase. The temperature of eutectic undercooling (TEU) decreases before the flake graphite appears. After that, TEU increases quickly, up to as high as 20℃, and then gradually decreases. The evolution of recalescence degree is opposite to that of TEU.