In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is...In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.展开更多
620# and 56# paraffin mixtures were impregnated into expanded perlite （EP） by vacuuming method. Effects of impregnation with/without vacuum, vacuuming time, and thermal cycles were discussed. The appropriate mass fr...620# and 56# paraffin mixtures were impregnated into expanded perlite （EP） by vacuuming method. Effects of impregnation with/without vacuum, vacuuming time, and thermal cycles were discussed. The appropriate mass fraction of paraffin mixture in the composite and vacuuming time were found respectively to be 80% and 20 min. Fourier transform infrared spectrometer （FT-IR） analysis shows that it has a good compatibility between paraffin mixture and EP. From differential scanning calorimetry （DSC） analysis, the latent heat of EP/Paraffin mixture composite is almost linearly related with the mass fraction of paraffin mixture in the composite. After 100 thermal cycles, the deviation of phase change temperatures is acceptable, but more deviation of latent heat appears. The calcium stearate dispersing granule coated by epoxy resin can effectively lower leakage during thermal cycles.展开更多
文摘In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.
基金Funded by the National Technology R&D Program for the 11th Five-year Plan(2006BAJ04A04)the College Graduate Innovative Research Plan of JiangSu Province in 2011(CXLX11_0342) and the Opening Project of Key Laboratory in Universities of Jiangsu Province,China
文摘620# and 56# paraffin mixtures were impregnated into expanded perlite （EP） by vacuuming method. Effects of impregnation with/without vacuum, vacuuming time, and thermal cycles were discussed. The appropriate mass fraction of paraffin mixture in the composite and vacuuming time were found respectively to be 80% and 20 min. Fourier transform infrared spectrometer （FT-IR） analysis shows that it has a good compatibility between paraffin mixture and EP. From differential scanning calorimetry （DSC） analysis, the latent heat of EP/Paraffin mixture composite is almost linearly related with the mass fraction of paraffin mixture in the composite. After 100 thermal cycles, the deviation of phase change temperatures is acceptable, but more deviation of latent heat appears. The calcium stearate dispersing granule coated by epoxy resin can effectively lower leakage during thermal cycles.
