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A novel voltage output integrated circuit temperature sensor 被引量:2
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作者 吴晓波 方志刚 《Journal of Zhejiang University Science》 CSCD 2002年第5期553-558,共6页
The novel integrated circuit (IC) temperature sensor presented in this paper works similarly as a two terminal Zener, has breakdown voltage directly proportional to Kelvin temperature at 10 mV/℃, with typical error ... The novel integrated circuit (IC) temperature sensor presented in this paper works similarly as a two terminal Zener, has breakdown voltage directly proportional to Kelvin temperature at 10 mV/℃, with typical error of less than ±1.0℃ over a temperature range from -50℃ to +125℃. In addition to all the features that conventional IC temperature sensors have, the new device also has very low static power dissipation ( 0.5 mW ) , low output impedance ( less than 1Ω), excellent stability, high reproducibility, and high precision. The sensor's circuit design and layout are discussed in detail. Applications of the sensor include almost any type of temperature sensing over the range of -50℃-+125℃. The low impedance and linear output of the device make interfacing the readout or control circuitry especially easy. Due to the excellent performance and low cost of this sensor, more applications of the sensor over wide temperature range are expected. 展开更多
关键词 Temperature sensing IC (integrated circuit) sensor thermal matching
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Thermoelastic stresses in SiC single crystals grown by the physical yapor transport method 被引量:1
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作者 Zibing Zhang Jing Lu +1 位作者 Qisheng Chen V. Prasad 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2006年第1期40-45,共6页
A finite element-based thermoelastic anisotropic stress model for hexagonal silicon carbide polytype is developed for the calculation of thermal stresses in SiC crystals grown by the physical vapor transport method. T... A finite element-based thermoelastic anisotropic stress model for hexagonal silicon carbide polytype is developed for the calculation of thermal stresses in SiC crystals grown by the physical vapor transport method. The composite structure of the growing SiC crystal and graphite lid is considered in the model. The thermal expansion match between the crucible lid and SiC crystal is studied for the first time. The influence of thermal stress on the dislocation density and crystal quality is discussed. 展开更多
关键词 Silicon carbide Physical vapor transport thermal stress Thermoelastic thermal expansion match
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