Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag

The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.

Thermal reliabilities of Sn−0.5Ag−0.7Cu−0.1Al_(2)O_(3)/Cu solder joint

The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.

Heat transfer in high density electronics packaging

In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the "System in Packaging"(SIP), a new solution of electronics packaging, a heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effect of different factors on the tempe rature distribution in the electronics. The affecting parameters under consideration include the thermophysical properties of the substrates, the coefficient of convection heat transfer, the thickness of the chip, and the density of power dissipation. ALGOR, a kind of finite element analysis software,was used to do the model simulation. Based on the simulation and analysis of the heat conduction and convection resistance, criteria for the thermal design were established and possible measurement for enhancing power dissipation was provided. The results show that the heat transfer model provides a new and effective way to the thermal design and thermal analysis of SIP and to the mechanical analysis for the further investigation of SIP.

Palmitic Acid-Lauric Acid/Expanded Graphite as Form-Stable Composite Phase Change Material for Low-Temperature Energy Storage Applications

Low thermal conductivity of binary fatty acid mixture of palmitic and lauric acids(PA-LA)within the value range of 0.15-0.17 W/(m·K)restricts its wide utilization as thermal energy storage material in the active regime of solar heating applications at low operating temperatures.Nevertheless,this mixture as phase change material(PCM)has a suitable phase-change temperature and heat of 36℃and 176.3 J/g,respectively.Hence,the objective of this study is to formulate a novel form-stable composite PCM with the PA-LA mixture and expanded graphite(EG)as a thermal enhancer.PA-LA eutectic mixture with varied concentrations of EG was prepared and characterized.The thermal conductivity of PA-LA/EG increased gradually with the mass of EG.Optimum thermal properties were observed in PA-LA/(5%EG)composite,where its melting(T_(m)),freezing temperature(T_(t)),latent melting heat and thermal conductivity was 35.53℃,34.84℃,174 J/g,and 1.19 W/(m·K),respectively.Also,the composite PCM is characterized by good chemical-thermal stability and thermal reliability for long-term usage.In conclusion,it can be utilized as a prospective form-stable PCM for thermal energy storage in solar heating systems,overheat treatment systems,and other thermal storage applications at low operating temperatures.