The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low...The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.展开更多
The preparation of lead-free thick-film resistors are reported:using RuO 2 and ruthenates as conductive particles,glass powders composed of B 2 O 3,SiO 2,CaO and Al2 O 3 as insulating phase,adding organic matter which...The preparation of lead-free thick-film resistors are reported:using RuO 2 and ruthenates as conductive particles,glass powders composed of B 2 O 3,SiO 2,CaO and Al2 O 3 as insulating phase,adding organic matter which mainly consists of ethyl cellulose and terpineol to form printable pastes.Resistors were fabricated and sintered by conventional screen-printing on 96%Al 2 O 3 substrates,and then sintering in a belt furnace.X-ray diffraction(XRD) and electron scanning microscopy(SEM) have been used to characterize the conductive particles.The resistors exhibit good refiring stability and low temperature coefficient of resistance.Sheet resistance spans from about 80Ω/□ to 600Ω/□.The resistors prepared are qualified for common use.展开更多
A series of water-based conductive carbon pastes were prepared by wet ball milling, followed by vacuum defoaming using isopropyl alcohol, propylene glycol or glycerin as co-solvents. Screen printing was then used to p...A series of water-based conductive carbon pastes were prepared by wet ball milling, followed by vacuum defoaming using isopropyl alcohol, propylene glycol or glycerin as co-solvents. Screen printing was then used to prepare conductive patterns. To determine the influence of co-solvent hydroxyl group number on the properties of water-based conductive carbon pastes, the rheological properties of the pastes and the surface morphologies and conductivities of the printed patterns were characterized. The results show that paste viscosity increased with the number of hydroxyl groups and the latter also affected thixotropy. In addition, the boiling points and surface tensions of the co-solvents increased consistently with hydroxyl group number, affecting the hydrodynamic flow. The conductive carbon paste created using propylene glycol as a co-solvent was the best for screen printing because of its weak coffee-ring effect and appro- priate rheological properties, resulting in a smooth coating surface and uniform deposition of the fillers. The resistivity of the pattern printed using paste PG, containing the closest packing of conductive carbon black particles, was 0.44 Ω cm.展开更多
基金fund for this work was provided by the“Research on Key Technologies of Photosensitive Conductive Silver Paste Based on Domestic Circuit Protection Micro Chip Components”(Project No.BE2020008 and Supporting Author:Chen P).
文摘The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.
文摘The preparation of lead-free thick-film resistors are reported:using RuO 2 and ruthenates as conductive particles,glass powders composed of B 2 O 3,SiO 2,CaO and Al2 O 3 as insulating phase,adding organic matter which mainly consists of ethyl cellulose and terpineol to form printable pastes.Resistors were fabricated and sintered by conventional screen-printing on 96%Al 2 O 3 substrates,and then sintering in a belt furnace.X-ray diffraction(XRD) and electron scanning microscopy(SEM) have been used to characterize the conductive particles.The resistors exhibit good refiring stability and low temperature coefficient of resistance.Sheet resistance spans from about 80Ω/□ to 600Ω/□.The resistors prepared are qualified for common use.
文摘A series of water-based conductive carbon pastes were prepared by wet ball milling, followed by vacuum defoaming using isopropyl alcohol, propylene glycol or glycerin as co-solvents. Screen printing was then used to prepare conductive patterns. To determine the influence of co-solvent hydroxyl group number on the properties of water-based conductive carbon pastes, the rheological properties of the pastes and the surface morphologies and conductivities of the printed patterns were characterized. The results show that paste viscosity increased with the number of hydroxyl groups and the latter also affected thixotropy. In addition, the boiling points and surface tensions of the co-solvents increased consistently with hydroxyl group number, affecting the hydrodynamic flow. The conductive carbon paste created using propylene glycol as a co-solvent was the best for screen printing because of its weak coffee-ring effect and appro- priate rheological properties, resulting in a smooth coating surface and uniform deposition of the fillers. The resistivity of the pattern printed using paste PG, containing the closest packing of conductive carbon black particles, was 0.44 Ω cm.
