Effects of direct current electric field on corrosion behaviour of copper, Cl- ion migration behaviour and dendrites growth under thin electrolyte layer

Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.

In-situ investigation of atmospheric corrosion behavior of bronze under thin electrolyte layers using electrochemical technique

The atmospheric corrosion behavior of bronze under thin electrolyte layer （TEL） with different thicknesses was monitored using cathodic polarization curves, open circuit potential （OCP） and electrochemical impedance spectroscopy （EIS）. Cathodic polarization result indicates that the cathodic limiting current density increases with decreasing the TEL thickness. EIS result shows that the corrosion rate increases with decreasing the TEL thickness at the initial stage because the corrosion is dominated by the cathodic process, whereas after long immersion time, the corrosion degree with the TEL thickness is in the sequence of 150 μm 〉 310 μm〉 10μm ≈ bulk solution 〉 57 μm. The measurements of OCP and EIS present in-situ electrochemical corrosion information and their results are in good agreement with that of physical characterizations.

In situ investigation of atmospheric corrosion behavior of PCB-ENIG under adsorbed thin electrolyte layer

The effects of relative humidity (RH) on a printed circuit board finished with electroless nickel immersion gold (PCB-ENIG) under an adsorbed thin electrolyte layer (ATEL) were investigated in situ via the measurement of cathodic polarization curves, electrochemical impedance spectroscopy, scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy to clearly elaborate the corrosion behavior of PCB-ENIG in the atmospheric environment. Results indicated that the cathodic process of PCB-ENIG under ATEL was dominated by the reduction of dissolved oxygen, corrosion products, and H2O. The cathodic current density of PCB-ENIG increased progressively with increasing RH. Moreover, its cathodic current density in the solution was greater than that under ATEL. This result demonstrated that the diffusion process was not the controlling step during the limiting reduction of cathodic oxygen. When the polarization potentials were located in a more negative region, the cathodic polarization current density gradually decreased under 75% and 85% RH. Notably, the anodic process became the controlling step in the extremely thin liquid film during the remainder of the experiment.

In vitro corrosion of pure magnesium and AZ91 alloy—the influence of thin electrolyte layer thickness

In vivo degradation predication faces a huge challenge via in vitro corrosion test due to the difficulty for mimicking the complicated microenvironment with various influencing factors.A thin electrolyte layer(TEL)cell for in vitro corrosion of pure magnesium and AZ91 alloy was presented to stimulate the in vivo corrosion in the micro-environment built by the interface of the implant and its neighboring tissue.The results demonstrated that the in vivo corrosion of pure Mg and the AZ91 alloy was suppressed under TEL condition.The AZ91 alloy was more sensitive than pure Mg to the inhibition of corrosion under a TEL thickness of less than 200 mm.The TEL thickness limited the distribution of current,and thus localized corrosion was more preferred to occur under TEL condition than in bulk solution.The TEL cell might be an appropriate approach to simulating the in vivo degradation of magnesium and its alloys.

Corrosion behavior of pure zinc and its alloy under thin electrolyte layer

The corrosion behavior of zinc and its alloy under thin electrolyte layers （TEL） in 0.1M NaC1 solution was investigated by cathodic polarization curves and EIS. There was only one phase in pure zinc while zinc alloy consisted of eutectic phase and primary phase. Corrosion rate of zinc alloy was faster than that of pure zinc due to the effect of the micro-galvanic couples between the primary phase and the eutectic phase. The results indicated that corrosion rate of zinc alloy was greatly enhanced under TEL than that in bulk solution. Pure zinc exhibited minimum corrosion resistance as TEL decreased to 198 #m. Zinc and its alloy exhibited localized corrosion under TEL while it was more uniform in bulk solution. There were two capacitive loops in high frequency （HF） and middle frequency （MF） respectively, with finite length diffusion in low frequency （LF） presented in EIS. For pure zinc under TEL below 300 pm an additional inductive loop presented in MF-LF. The corrosion products and morphology were respectively examined by X-ray diffraction （XRD）, FTIR （Fourier Transform Infra Red） and SEM-EDS. FTIR micro spectroscopy results indicated that the component of the corrosion products was similar at different section of the specimen surface but different in content.