Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, fo...Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.展开更多
An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-...An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-field scanning data to reconstruct an equivalent magnetic dipole array,and the differential evolution optimization algorithm is proposed to extract the locations,orientation and moments of those dipoles.By importing the equivalent dipoles model into a 3D full-wave simulator together with the victim circuit model,the electromagnetic interference issues in mixed RF/digital systems can be well predicted.A commercial IC is used to validate the accuracy and efficiency of this proposed method.The coupled power at the victim antenna port calculated by the equivalent radiation source is compared with the measured data.Good consistency is obtained which confirms the validity and efficiency of the method.展开更多
基金Sponsored by the National Natural Science Foundation of China(No.61271149)
文摘Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.
基金supported by the National Nature Science Foundation of China(No.61274110)
文摘An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-field scanning data to reconstruct an equivalent magnetic dipole array,and the differential evolution optimization algorithm is proposed to extract the locations,orientation and moments of those dipoles.By importing the equivalent dipoles model into a 3D full-wave simulator together with the victim circuit model,the electromagnetic interference issues in mixed RF/digital systems can be well predicted.A commercial IC is used to validate the accuracy and efficiency of this proposed method.The coupled power at the victim antenna port calculated by the equivalent radiation source is compared with the measured data.Good consistency is obtained which confirms the validity and efficiency of the method.
