This work presents a novel design of Ka-band(33 GHz)filtering packaging antenna(FPA)that features broadband and great filtering response,and is based on glass packaging material and through-glass via(TGV)technologies....This work presents a novel design of Ka-band(33 GHz)filtering packaging antenna(FPA)that features broadband and great filtering response,and is based on glass packaging material and through-glass via(TGV)technologies.Compared to traditional packaging materials(printed circuit board,low temperature co-fired ceramic,Si,etc.),TGVs are more suitable for miniaturization(millimeter-wave three-dimensional(3D)packaging devices)and have superior microwave performance.Glass substrate can realize 3D high-density interconnection through bonding technology,while the coefficient of thermal expansion(CTE)matches that of silicon.Furthermore,the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology.The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter(BPF)whose reflection coefficients are almost complementary.The BPF unit has three pairs ofλg/4 slots(defect microstrip structure,DMS)and twoλg/2 U-shaped slots(defect ground structure,DGS).The proposed antenna achieves large bandwidth and high radiation efficiency,which may be related to the stacking of glass substrate and TGV feed.In addition,the introduction of four radiation nulls can effectively improve the suppression level in the stopband.To demonstrate the performance of the proposed design,a 33-GHz broadband filtering antenna is optimized,debugged,and measured.The antenna could achieve|S11|<-10 dB in 29.4‒36.4 GHz,and yield an impedance matching bandwidth up to 21.2%,with the stopband suppression level at higher than 16.5 dB.The measurement results of the proposed antenna are a realized gain of~6.5 dBi and radiation efficiency of~89%.展开更多
基金supported by the Fundamental Research Funds for the Central Universities,China(No.ZYGX2019Z003)。
文摘This work presents a novel design of Ka-band(33 GHz)filtering packaging antenna(FPA)that features broadband and great filtering response,and is based on glass packaging material and through-glass via(TGV)technologies.Compared to traditional packaging materials(printed circuit board,low temperature co-fired ceramic,Si,etc.),TGVs are more suitable for miniaturization(millimeter-wave three-dimensional(3D)packaging devices)and have superior microwave performance.Glass substrate can realize 3D high-density interconnection through bonding technology,while the coefficient of thermal expansion(CTE)matches that of silicon.Furthermore,the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology.The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter(BPF)whose reflection coefficients are almost complementary.The BPF unit has three pairs ofλg/4 slots(defect microstrip structure,DMS)and twoλg/2 U-shaped slots(defect ground structure,DGS).The proposed antenna achieves large bandwidth and high radiation efficiency,which may be related to the stacking of glass substrate and TGV feed.In addition,the introduction of four radiation nulls can effectively improve the suppression level in the stopband.To demonstrate the performance of the proposed design,a 33-GHz broadband filtering antenna is optimized,debugged,and measured.The antenna could achieve|S11|<-10 dB in 29.4‒36.4 GHz,and yield an impedance matching bandwidth up to 21.2%,with the stopband suppression level at higher than 16.5 dB.The measurement results of the proposed antenna are a realized gain of~6.5 dBi and radiation efficiency of~89%.
文摘随着摩尔定律的发展迟缓,微电子器件的高密度化、微型化对先进封装技术提出了更高的要求。中介层技术作为2.5D/3D封装中的关键技术,受到了广泛研究。按照中介层材料不同,主要分为有机中介层、硅中介层以及玻璃中介层。与硅通孔(through silicon via,TSV)互连相比,玻璃通孔(through glass via,TGV)中介层(interposer)因其具有优良的高频电学特性、工艺简单、成本低以及可调的热膨胀系数(coefficient of thermal expansion,CTE)等优点,在2.5D/3D先进封装领域受到广泛关注。然而玻璃的导热系数(约1 W·m^(-1)·K^(-1))与硅(约150 W·m^(-1)·K^(-1))相比要低很多,因此玻璃中介层存在着严重的散热问题。为得到高质量的TGV中介层,不仅需要高效低成本的通孔制备工艺,还需要无缺陷的填充工艺,目前玻璃中介层面临的挑战也主要集中在这两方面。本文首先介绍了TGV的制备工艺,如超声波钻孔(ultra-sonic drilling,USD)、超声波高速钻孔(ultra-sonic high speed drilling,USHD)、湿法刻蚀、深反应离子刻蚀(deep reactive ion etching,DRIE)、光敏玻璃、激光刻蚀、激光诱导深度刻蚀(laser induced deep etching,LIDE)等。接着围绕TGV的无缺陷填充进行总结,概述了TGV的几种填充机理以及一些填充工艺,如bottom-up填充、蝶形填充以及conformal填充。然后对TGV电镀添加剂的研究进展进行了介绍,包括典型添加剂的作用机理以及一些新型添加剂的研究现状,最后并对TGV实际应用情况进行了简要综述。
