期刊文献+
共找到1篇文章
< 1 >
每页显示 20 50 100
Direct active soldering of Al_(0.3)CrFe _(1.5)MnNi_(0.5) high entropy alloy to 6061-Al using Sn-Ag-Ti active solder 被引量:4
1
作者 L.C.TSAO S.Y.CHANG Y.C.YU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第4期748-756,共9页
Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti ac... Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics. 展开更多
关键词 high entropy alloy Sn3.5Ag4ti active filler Al0.3CrFe1.5MnNi0.5 direct active soldering
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部