Effect of melt-to-solid volume ratio and preheating temperature on Mg/Al bimetals interface by centrifugal casting

Compound casting is an efficient method for bonding dissimilar metals,in which a dramatic reaction can occur between the melt and solid.The centrifugal casting process,a type of compound casting,was applied to cast Al/Mg dissimilar bimetals.Magnesium melt was poured at 700 °C,with melt-to-solid volume ratios(Vm/Vs) of 1.5 and 3,into a preheated hollow aluminum cylinder.The preheating temperatures of the solid part were 320,400,and 450 °C,and the constant rotational speed was 1,600 rpm.The cast parts were kept inside the casting machine until reaching the cooling temperature of 150 °C.The result showed that an increase in preheating temperature from 320 to 450 °C led to an enhanced reaction layer thickness.In addition,an increase in the Vm/Vs from 1.5 to 3 resulted in raising the interface thickness from 1.2 to 1.8 mm.Moreover,the interface was not continuously formed when a Vm/Vs of 3 was selected.In this case,the force of contraction overcame the resultant acting force on the interface.An interface formed at the volume ratio of 1.5 was examined using scanning electron microscopy(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS),and the results demonstrated the formation of Al_(3)Mg_(2),Al_(12)Mg_(17) and(δ+Al_(12)Mg_(17)) eutectic structures in the interface.

TiN(100)/Al(100)界面性质和电子结构的第一性原理计算

本文采用第一性原理方法计算了TiN和Al的电子性质和弹性性能,分析了TiN(100)/Al(100)界面的粘附功(W_(ad))、电子结构以及键合特性。计算结果表明,TiN表现出一定的金属特性,主要由Ti-3d轨道上的电子贡献,而Al则呈现出显著的导体特性。此外,TiN和Al均具有各向异性,TiN的抗变形能力显著高于Al,而Al的横向变形能力则强于TiN。本文考虑了Al-on-N联结和Al-on-Ti联结两种界面模型。结果显示,Al-on-N联结界面的粘附功为1267 mJ/m^(2),明显高于Al-on-Ti联结界面的粘附功(952 mJ/m^(2)),表明Al-on-N联结界面的粘附强度更强。其原因在于Al-on-N联结界面的键合机制主要依赖于强Al3sp-N2sp极性共价键的相互作用。本研究结果为解释TiN和Al界面的粘附强度和稳定性提供了理论依据。

Interface Engineering of Titanium Nitride Nanotube Composites for Excellent Microwave Absorption at Elevated Temperature

Currently,the microwave absorbers usually suffer dreadful electromagnetic wave absorption(EMWA)performance damping at elevated temperature due to impedance mismatching induced by increased conduction loss.Consequently,the development of high-performance EMWA materials with good impedance matching and strong loss ability in wide temperature spectrum has emerged as a top priority.Herein,due to the high melting point,good electrical conductivity,excellent environmental stability,EM coupling effect,and abundant interfaces of titanium nitride(TiN)nanotubes,they were designed based on the controlling kinetic diffusion procedure and Ostwald ripening process.Benefiting from boosted heterogeneous interfaces between TiN nanotubes and polydimethylsiloxane(PDMS),enhanced polarization loss relaxations were created,which could not only improve the depletion efficiency of EMWA,but also contribute to the optimized impedance matching at elevated temperature.Therefore,the TiN nanotubes/PDMS composite showed excellent EMWA performances at varied temperature(298-573 K),while achieved an effective absorption bandwidth(EAB)value of 3.23 GHz and a minimum reflection loss(RLmin)value of−44.15 dB at 423 K.This study not only clarifies the relationship between dielectric loss capacity(conduction loss and polarization loss)and temperature,but also breaks new ground for EM absorbers in wide temperature spectrum based on interface engineering.

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.

Preparation, interfacial regulation and strengthening of Mg/Al bimetal fabricated by compound casting: A review

Mg/Al bimetal combines the advantages of both aluminum and magnesium and has broad application prospects in automotive, aerospace,weapons, digital products and so on. The compound casting has the characteristics of low cost, easy to achieve metallurgical combination and suitable for the preparation of complex bimetallic parts. However, bimetallic joint strength is low due to differences of physical properties between Al and Mg, oxide film on metallic surface and interfacial Al-Mg IMCs, which is closely related to the interfacial microstructure and properties. Therefore, how to control the interface of the bimetal to achieve performance enhancement is the focus and difficulty in this field. At present, there are mainly the following strengthening methods. First, the “zincate galvanizing” and “electrolytic polishing+anodic oxidation” technology were exert on the surface of Al alloy to remove and break the oxide film, which improved the wettability between Al and Mg. Second, the undesirable Al-Mg IMCs were reduce or elimination by adding the interlayers(Zn, Ni and Ni-Cu). Thirdly, the evolution process of interfacial microstructure was changed and fine strengthening phases were formed by adding Si element to Al alloy or rare earth element to Mg alloy. Fourthly, mechanical vibration and ultrasonic vibration were applied in the process of the filling and solidification to refine and homogenize the interfacial structure. Finally, some other methods, including secondary rolling, thermal modification, heat treatment and constructing exterior 3D morphology, also can be used to regulate the interfacial microstructure and compositions. The above strengthening methods can be used alone or in combination to achieve bimetallic strengthening. Finally, the future development direction of the Mg/Al bimetal is prospected, which provides some new ideas for the development and application of the Mg/Al bimetal.

Segregation of Si and Mg at Fe(110)/Al(110) Interface

The interface structure and electronic properties of Fe(110)/Al(110) are investigated by the first-principles plane-wave pseudopotential method. The interface segregation position of Si and Mg is determined, and the effect of Mg and Si on the interface binding of Fe(110)/Al(110) is analyzed by combining the work of separation and charge density. The results show that the Fe(110)/Al(110) interface energy of FeHollow coordination is smaller and the interface structure is more stable. The Fe(110)/Al(110) interface separation surface in the form of Fe-Hollow coordination appears at the sub interface layer on the side of Al(110)near the interface. The interface structure of Mg and Si segregation is similar to that of undoped alloy elements.The calculations also suggest that Mg and Si segregate on the Al(110) side of the interface and occupy the Al lattice on the Al(110) side. The segregation of Mg and Si elements will reduce the interface binding, primarily because the Fe-Si bond and Fe-Mg bond are weaker than Fe-Al bond.

Bonding properties of interface in Fe/Al clad tube prepared by explosive welding

A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy（SEM）.The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.

Characterization and evaluation of interface in SiC_p/2024 Al composite

35% SiCp/2024 Al（volume fraction） composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.

TiN_(0.3)/AlN复合烧结界面扩散现象

为研究TiN_(0.3)/AlN复合烧结体中两相界面区域的N原子的扩散现象,通过机械合金化方法制备出非化学计量比TiN_(0.3),采用放电等离子体烧结技术分层及复合烧结TiN_(0.3)/AlN复合材料,采用金相、XRD、SEM、EDS及TEM等分析表征TiN_(0.3)/AlN复合材料的物相组成、元素分布和组织形貌。结果表明:AlN中的N通过空位扩散机制向TiN_(0.3)中扩散,其扩散程度逐渐减弱;与AlN接触的TiN_(0.3)部分由于吸收了来自AlN中的N使成分接近正常比例的TiN,而远离界面处的部分则接近TiN_(0.3)的成分;在两相结合区域有宽度在1 nm以下的非晶层,其电子衍射斑点出现纵向伸长,产生共格,说明六方结构的AlN晶格向TiN晶格畸变,形成面心立方结构的TiN_(0.3)/AlN。

不同形貌Al-Fe金属的块体压制成形模拟研究

文章以含40%Al的Al-Fe复合金属为研究对象,对颗粒状和屑状40Al-Fe复合金属分别进行压制预变形,并对屑状40Al-Fe复合金属预制坯进行了二次热压缩变形,重点研究压制预变形及二次热压缩对Al-Fe复合金属成形性和界面影响。结果表明:压力为16 MPa时,颗粒状40Al-Fe复合金属预制坯(密度为4.54 g/cm^(3))成形性良好且形成致密界面;压力为16 MPa时,屑状40Al-Fe复合金属预制坯(密度为3.50 g/cm3)可以成形但界面存在孔洞,Al屑主要为“片层状”“狗牙状”“圆圈状”“波浪状”,其经二次热压缩变形,“圆圈状”Al屑连成一个整体,“狗牙状”与“波浪状”Al屑均演变为“片层状”,而Fe屑仍为“片层状”“块状”,未发生明显变形。变形温度300℃、变形速率0.5 s^(-1)、变形程度0.1是目前生产工艺最佳参数,此时屑状40Al-Fe复合金属成形性最佳且界面结合良好(密度为4.66 g/cm^(3))。

Mg/Al真空爆炸焊接微观形貌及力学性能

镁合金和铝合金因具有较高的化学活性,在常规焊接方式下,其表面的氧化物会掺杂到焊接接头内,使得复合板的结合性能下降。为了提高Mg/Al复合板的结合强度,采用真空爆炸焊接法制备了Mg-AZ31B/Al-6061复合板,并与常规空气环境下制备的相同参数复合板进行了对比。通过光学显微镜、扫描电子显微镜、能谱仪以及万能试验机,对结合界面的微观形貌、元素分布和力学性能进行分析。结果表明:由于气体冲击波压力不同,真空环境下复合材料的界面形貌与空气环境下有很大区别;真空环境有效抑制了镁、铝2种金属氧化,在熔化区未检测到金属氧化物。此外,还观察到真空环境下试样的剪切强度和拉伸强度显著增大。因此,真空爆炸焊接对Mg/Al复合板性能的提升起到了重要作用,可以作为一种有效的金属焊接方法。

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material

Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.

First-principles investigation on stability and electronic structure of Sc-dopedθ′/Al interface in Al−Cu alloys

The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.

Study on Interface between Sub-micron Particles and Matrix in Al_2O_3p/Al Composites

The microstructural characteristic of 1070AI matrix composites reinforced by 0.15 祄 AI2O3 particles whose volume fraction was 40% was investigated by TEM and HREM. The results showed that the interface between the matrix and reinforcements was clean and bonded well, without any interfacial reaction products. There were some preferential crystallographic orientation relationships between Al matrix and AI2O3 particle because of the lattice imperfection on the surface of Al2O3 particles.

Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip

Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.

Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel

TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase arise closest to Ti base at lower temperature and higher temperature respectively; Structure of TiAl/TC4 interface is TiAl/γ+α 2/Ti 3Al/α-Ti/TC4 at lower temperature and TiAl/γ+β+α 2/TC4 at high temperature; in TiAl/40Cr steel interface, obvious decarbonised layer on steel side while TiC and reaction phase with Fe Al Ti system form on TiAl side.

Mg/Al双金属固相复合界面特征与性能

Mg/Al双金属层状复合材料因兼具镁合金低密度和铝合金耐腐蚀的特性,在轻量化与高性能成形制造方面应用需求巨大.而金属材料接触面在固态下直接结合的双金属固相复合工艺,因避免了液–液复合或液–固复合中氧化、夹杂等缺陷对复合材料性能的影响,在双金属复合技术中具有显著的优势.为阐明Mg/Al双金属固相复合过程中热变形条件对复合界面特征和性能的影响规律,开展了变形温度300~430℃、应变率5×10^(-3)~1 s^(-1)和变形量20%~40%条件下的热压缩复合实验,采用扫描电镜、能谱仪和维氏硬度仪获得了复合界面的微观形貌、元素和硬度的分布规律.结果表明:随着应变率降低、变形量增加和变形温度升高,元素扩散时间增长、扩散能力增强,过渡区总厚度增加,形成了Mg_(17)Al_(12)相和Al_(3)Mg_(2)相组成的高硬度金属间化合物层.在此基础上,通过建立金属间化合物层的厚度演化模型,结合双金属冶金结合的临界变形量计算公式,构建了Mg/Al双金属复合界面特征随热变形条件演化图.计算结果说明:较高温度(>400℃)和较高应变率(~1 s^(-1))的变形条件在保证Mg/Al双金属冶金结合同时,可以抑制金属间化合物层的出现和长大,从而有助于良好复合界面的实现.

退火工艺对Cu/Al复层材料界面影响的研究

采用纯铜/纯铝和纯铜/铝合金进行400℃温轧和退火热处理,并对得到的Cu/Al复层材料进行界面结合强度测试、界面金相显微组织分析和界面扫描电镜分析。结果表明:Cu/Al复层材料界面处Cu/Al中间相的形成需要一定的孕育期,其形成过程为:形核→核长大→沿界面横向连片生长→沿界面法线方向纵向生长;纯铜/纯铝复层材料最佳退火工艺为300℃×1 h,最大界面结合强度可达2.4 N/mm;而纯铜/铝合金为300℃×3 h,界面结合强度最大值为3.1 N/mm,保证了材料的成型性能,同时防止金属间化合物的生成;经较高温度的长时退火(500℃×5 h),纯铜/铝合金比纯铜/纯铝复层材料界面更容易形成脆性金属间化合物相,导致界面结合强度的降低,造成界面在剥离条件下的脆性断裂。

RELATIONS BETWEEN INTERFACE OF CF/Al-4.5 Cu COMPOSITE AND SOLIDIFICATION PROCESSING

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