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Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature 被引量:4
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作者 F. Yan H. W. Zhang N.R. Tao K. Lu 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2011年第8期673-679,共7页
A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding h... A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (〈15°) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect ∑3 coincidence (60°/〈111〉) up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship. 展开更多
关键词 Quantitative structural characterization CU Dynamic plastic deformation trans mission electron microscopy Convergent beam electron diffraction
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