Contact Resistance and Arc Erosion of Tungsten-copper Contacts in Direct Currents

The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper（W-Cu） contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy（SEM） and transmission electron microscopy（TEM） were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.

Arc erosion of AgSnO_2 electrical contacts at different stages of a break operation

Arc erosion studies are conducted on AgSnO2 contact materials at different stages in the break operation. A resistive load arrangement is used with up to 42 V DC at 24 A and a constant contact opening velocity. The arc current is terminated at different stages as the arc is drawn between the contacts enabling a study of the arcing phenomena up to that point. Surface profiling of the contacts is conducted to determine the extent of erosion at the different stages as the arc is drawn. Spectral analysis is also conducted on the arc and then related to the extent of erosion. The results show that particular features occur at different stages as the arc is drawn. As the arc is initially established, it goes through an ＂Arc Generation＂ regime where the arc roots are small and immobile on both the anode and the cathode. Material transfer occurs mainly from anode to cathode. The spectral analysis indicates that Sn and O species dominate the arc followed by the Ag species. As the arc is drawn further and enters the ＂Arc Degeneration＂ regime, the anode undergoes significantly larger erosion than the cathode. Also, both contacts indicate that multiple arc roots have formed, which are highly mobile in the later stages of the discharge. The spectral analysis indicates that Ag and N species are in high concentrations compared to other species. The mechanisms of erosion and deposition are discussed in relation to the species within the arc discharge. For the complete break operation, it is found that the anode undergoes major erosion, and it is thought that the gaseous ions species do not dominate the arc under these conditions of short arcs and voltage 〈42 V to cause cathode erosion.

混粉法和包覆法制备的AgSnO_2电接触材料表面电弧烧蚀

采用扫描电子显微镜(SEM)、表面电子探针显微分析仪、电接触性能试验机等手段,研究了混粉法和包覆法制备的AgSnO_2电接触材料在直流条件下(DC 24 V/15 A),铆钉触头表面的电弧烧蚀情况。对材料的表面烧蚀机理、金属转移情况,以及电寿命等进行了讨论。结果表明,包覆法制备的AgSnO_2电接触材料具有较强的耐电弧侵蚀能力与较少的材料转移量。