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Continuous extrusion and rolling forming velocity of copper strip 被引量:10
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作者 运新兵 游伟 +2 位作者 赵颖 李冰 樊志新 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第4期1108-1113,共6页
A new copper strip production technology combined with continuous extrusion and rolling technology was proposed. The roll velocity must first be matched with the continuous extrusion velocity to achieve continuous ext... A new copper strip production technology combined with continuous extrusion and rolling technology was proposed. The roll velocity must first be matched with the continuous extrusion velocity to achieve continuous extrusion and roll forming. The bite condition of continuous extrusion was determined, and the compatibility equation between the roll velocity and parameters such as the extrusion wheel velocity, reduction, and strip size was established through mechanical by plastic theoretical calculations. The finite element model of continuous extrusion and rolling was then established by using the TLJ400 continuous extrusion machine with a roll diameter of 200 mm. The relationship between the continuous extrusion and rolling velocities was determined through numerical simulations by software DEFORM-3D, and the accuracy of compatibility equation of velocity was verified. 展开更多
关键词 copper strip continuous extrusion and rolling bite condition compatibility equation of velocity
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Extraction and stripping kinetics of copper(Ⅱ)by N902 using single drop technique 被引量:1
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作者 朱萍 范泽云 +2 位作者 吴金华 钱光人 周鸣 《Journal of Shanghai University(English Edition)》 CAS 2010年第4期275-280,共6页
The kinetics of extraction and stripping of copper (Ⅱ) was investigated by the single drop technique with a new extractant N902 (a derivative of the salicylal-doxime) and the rate equations of extraction and stri... The kinetics of extraction and stripping of copper (Ⅱ) was investigated by the single drop technique with a new extractant N902 (a derivative of the salicylal-doxime) and the rate equations of extraction and stripping were derived, respectively. The apparent activation energies of extraction and stripping were estimated to be 20.14 kJ/mol and 30.0 k J/mol. 展开更多
关键词 KINETICS single drop technique copper (Ⅱ) EXTRACTION stripPING N902
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Adsorptive Stripping Voltammetric Study of the Enhancement of Copper(Ⅱ) by Poly(vinyl alcohol), Starch and Polyallylamine 被引量:1
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作者 Ming SONG Hui Min MA Yue Xian HUANG and Shu Quan LIANG (Institute of Chemistry. Academia Sinica, Beijing 100080) 《Chinese Chemical Letters》 SCIE CAS CSCD 1997年第6期529-532,共4页
Adsorptive enhancements of several water-soluble polymers on copper(Ⅱ) were studied by adsorptive stripping voltammetry with a hanging mercury drop electrode. Increases in peak current of cu(Ⅱ) were observed in al... Adsorptive enhancements of several water-soluble polymers on copper(Ⅱ) were studied by adsorptive stripping voltammetry with a hanging mercury drop electrode. Increases in peak current of cu(Ⅱ) were observed in alkaline carbonate media. The enhancing power of poly(vinyl alcohol), starch and polyallylamine is 15, 4. 1, and 2.5 times, repectively 展开更多
关键词 II by Poly Starch and Polyallylamine vinyl alcohol Adsorptive stripping Voltammetric Study of the Enhancement of copper POLY
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Influence of copper on quality of hot strips by EAF-CSP process
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作者 WANG Yuanli, LIU Delu, SHAO Weiran, FU Jie, KANG Yonglin, ZHOU Deguang, and WANG Zhongbing 《Rare Metals》 SCIE EI CAS CSCD 2004年第1期63-63,共1页
Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study on influence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has been carried out. The results indicated that... Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study on influence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has been carried out. The results indicated that copper segregation and enrichment at interfacial layer between oxidized surface and steel matrix is the key factor, which results in microcracks and edge flaws on the strips. The primary considerations to prevent detrimental effects from Cu include controlling copper content in proper level, higher soaking temperature and non-oxidizable atmosphere during soaking. Copper sulfide precipitates with nanometers in size were observed, they may be beneficial to the properties of CSP products, and influence of Cu on quality of CSP hot strips is discussed. 展开更多
关键词 Cu segregation surface flaws CSP hot strips copper sulfide nano-scaled precipitates
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Influence of copper on quality of hot strips by EAF-CSP process
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作者 YuanliWang DeluLiu +4 位作者 WeiranShao JieFu YonglinKang DeguangZhou ZhongbingWang 《Journal of University of Science and Technology Beijing》 CSCD 2004年第1期57-61,共5页
Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study oninfluence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has beencarried out. The results indicated that c... Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study oninfluence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has beencarried out. The results indicated that copper segregation and enrichment at interfacial layerbetween oxidized surface and steel matrix is the key factor, which results in microcracks and edgeflaws on the strips. The primary considerations to prevent detrimental effects from Cu includecontrolling copper content in proper level, higher soaking temperature and non-oxidizable atmosphereduring soaking. Copper sulfide precipitates with nanometers in size were observed, they may bebeneficial to the properties of CSP products, and influence of Cu on quality of CSP hot strips isdiscussed. 展开更多
关键词 Cu segregation surface flaws CSP hot strips copper sulfide nano-scaledprecipitates
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Determination of Hypoxanthine in the Presence of Copper by Adsorptive Stripping Voltammetry
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作者 Percio Augusto Mardini Farias Arnaldo Aguiar Castro 《American Journal of Analytical Chemistry》 2014年第5期291-300,共10页
A stripping method for the determination of hypoxanthine in the presence of copper at the submicromolar concentration levels is described. The method is based on controlled adsorptive accumulation of hypoxanthine-copp... A stripping method for the determination of hypoxanthine in the presence of copper at the submicromolar concentration levels is described. The method is based on controlled adsorptive accumulation of hypoxanthine-copper at the thin-film mercury electrode followed by a fast linear scan voltammetric measurement of the surface species. Optimum experimental conditions were found to be the use of 1.0 × 10﹣3 mol·L﹣1 NaOH solution as electrolyte supporting, an accumulation potential of ﹣0.50 V and a linear scan rate of 200 mV·s﹣1. The response of hypoxanthine-copper is linear over the concentration ranges of 10 - 60 ppb. For an accumulation time of 30 minutes, the detection limit was found to be 250 ppt (1.8 × 10﹣9 mol·L﹣1). Adequate conditions for measuring the hypoxanthine in the presence of metal ions, xanthine, uric acid and other nitrogenated bases were also investigated. The utility of the method is demonstrated by the presence of hypoxanthine associated in ATP or ssDNA. 展开更多
关键词 HYPOXANTHINE DETERMINATION XANTHINE Uric Acid copper Ion ATP SSDNA Thin-Film Mercury Electrode Fast Linear Scan stripping VOLTAMMETRY
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Adsorptive Stripping Voltammetric Study of the Enhancement of Copper(Ⅱ) in Phosphate and Carbonate media and in the Presence of Silicate
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作者 Ming SONG Hui Min MA +1 位作者 Yue Xian HUANG and Shu Quan LIANG(Institute of Chemistry Chinese Academy of Sciences Beijing 100080) 《Chinese Chemical Letters》 SCIE CAS CSCD 1997年第1期61-64,共4页
Adsorptive enhancements of several inorganic salts on copper(II) were studied by adsorptive stripping voltammetry with a hanging mercury drop electrode Increase in peak curren of cu(II) were observed in alkaline phosp... Adsorptive enhancements of several inorganic salts on copper(II) were studied by adsorptive stripping voltammetry with a hanging mercury drop electrode Increase in peak curren of cu(II) were observed in alkaline phosphate or media owing to adsorption Silicate can also enhance the peak current of Cu(II). The enhancing power phosphate,carbonate, and silicate is 33, 26, and 8.9 times, respectively. 展开更多
关键词 in Phosphate and Carbonate media and in the Presence of Silicate II Adsorptive stripping Voltammetric Study of the Enhancement of copper
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Solvent extraction and separation of copper from base metals using bifunctional ionic liquid from sulfate medium 被引量:5
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作者 Niharbala Devi 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2016年第3期874-881,共8页
A novel solvent extraction process for extraction and separation of copper from other base metal ions using a bifunctional ionic liquid (IL) (trioctylmethylammonium/2,4,4-trimethylpentyl phosphinate, [A336/Cy272]) in ... A novel solvent extraction process for extraction and separation of copper from other base metal ions using a bifunctional ionic liquid (IL) (trioctylmethylammonium/2,4,4-trimethylpentyl phosphinate, [A336/Cy272]) in kerosene was reported. This IL was found to extract copper more efficiently than the individual extractants Aliquat 336 or Cyanex 272. Formation of an octahedral copper-IL complex was characterized by UV-Visible spectra and metal ligand interaction was confirmed by FTIR spectra. The loading capacity of 0.1 mol/L [A336/Cy272] was found to be 1.71 g/L. Stripping studies reported that 0.298 g/L copper ions were efficiently stripped using 0.1 mol/L sulfuric acid from 0.05 mol/L loaded IL. The selectivity of copper against nickel, cadmium and iron was investigated from their equimolar binary mixtures using 0.05 mol/L [A336/Cy272] in kerosene. The highest separation factorβCu/Cd=8.41 was obtained at pH 3.56. Copper can be effectively separated from nickel over the pH range studied. The IL extracts preferentially iron over copper and the highest separation factorβFe/Cuwas 3246 at pH 2.4. The extraction rate of metal ions from a synthetic solution containing copper with other metal impurities was in the order of Fe>Zn>Cu>Cd>Co>Ni. 展开更多
关键词 copper ionic liquid extraction stripPING SEPARATION
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Manufacturing techniques of armor strips excavated from Emperor Qin Shi Huang's mausoleum,China 被引量:2
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作者 廖灵敏 潘春旭 马宇 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2010年第3期395-399,共5页
The chemical compositions and microstructures of the armor strips excavated from the Emperor Qin Shi Huang's mausoleum were examined systematically by using optical microscopy and electron microscopy.It was found ... The chemical compositions and microstructures of the armor strips excavated from the Emperor Qin Shi Huang's mausoleum were examined systematically by using optical microscopy and electron microscopy.It was found that the armor strips were made of pure copper.Based on the morphology of α-Cu recrystal grain and copper sulphide(Cu2S) inclusions in the armor strips,the manufacturing techniques were proposed as follows:smelting pure copper,casting a lamellar plate,forming the cast ingots into sheets through repeated cold forging combined with annealing heat treatment,and finally cutting the sheets into filaments.Furthermore,through the deformation of copper sulphide(Cu2S) inclusions in the strips,the work rate during forging was evaluated and calculated to be close to 75%. 展开更多
关键词 Qin Shi Huang's mausoleum armor strips copper manufacturing techniques cold forging annealing
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Voltammetric Detection of Nanomolar Levels of Hypoxanthine in the Presence of Copper(Ⅱ) at Glassy Carbon Electrode
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作者 Hu Shengshui Cui Dafu Marco Mascini 《Wuhan University Journal of Natural Sciences》 CAS 1999年第1期101-104,共4页
Nanomolar levels of the hypoxanthine in NaOH electrolyte cantaining copper(Ⅱ) can be determined by anodic stripping voltammetry at a glassy carbon electrode. In the present article hypoxanthine Cu + is shown to be ... Nanomolar levels of the hypoxanthine in NaOH electrolyte cantaining copper(Ⅱ) can be determined by anodic stripping voltammetry at a glassy carbon electrode. In the present article hypoxanthine Cu + is shown to be adsorbed on the electrode surface in the presence of an excess of copper(Ⅱ). After accumulation period, hypoxanthine Cu + was stripped from the electrode surface and the anodic current coming near to the oxidation of Cu(Ⅰ) to Cu(Ⅱ) was measured. A linear calibration curve in the range of 5 nmol/L 1.5 mmol/L hypoxanthine, with a detection limit of 0.5 nmol/L hypoxanthine were obtained. 展开更多
关键词 HYPOXANTHINE copper glassy carbon electrode stripping voltammetry
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引线框架用高性能铜合金板带材及制备工艺 被引量:1
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作者 梁海成 高博伦 +2 位作者 王松伟 刘劲松 邓偲瀛 《铜业工程》 CAS 2024年第2期45-53,共9页
电子信息产业的飞速发展,对铜及铜合金产品性能提出了更高的要求,其中集成电路封装用引线框架材料代表了铜合金板带材发展的较高水平。本文对近年来引线框架用高性能铜合金板带材及制备工艺进行了综述,介绍了国内外高性能铜合金板带材... 电子信息产业的飞速发展,对铜及铜合金产品性能提出了更高的要求,其中集成电路封装用引线框架材料代表了铜合金板带材发展的较高水平。本文对近年来引线框架用高性能铜合金板带材及制备工艺进行了综述,介绍了国内外高性能铜合金板带材料的成分和制备加工技术及发展过程,并对其未来发展趋势进行了展望,提出未来高性能铜板带材性能将朝着抗拉强度为700 MPa、导电率为70%IACS的目标发展,其制备工艺将向着智能化、绿色化、高效化等方向发展。 展开更多
关键词 集成电路 铜合金 板带材 引线框架 生产工艺
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高性能高精度铜合金带材六辊冷轧机组的研发与应用
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作者 尤磊 刘云飞 +2 位作者 王恬 魏维刚 袁欢媚 《中国重型装备》 2024年第4期32-37,共6页
针对高性能高精度铜带材生产的技术难点,首次开发了800 mm小辊径六辊可逆中精轧机组。介绍了机组的工艺设备组成、主要工艺技术参数配置和装机水平;重点阐述了开发的新技术:紧凑式弯辊小辊径六辊轧机、高精度自动厚度控制技术、高精度... 针对高性能高精度铜带材生产的技术难点,首次开发了800 mm小辊径六辊可逆中精轧机组。介绍了机组的工艺设备组成、主要工艺技术参数配置和装机水平;重点阐述了开发的新技术:紧凑式弯辊小辊径六辊轧机、高精度自动厚度控制技术、高精度板形自动控制系统以及高效除油装置。机组投入使用后,产品质量得到有效提高,对于厚度为0.175 mm,宽度为620 mm的铜带,成品厚差不大于±1μm,板形均方差不大于0.55I。 展开更多
关键词 铜带 高精度 板形 板厚 六辊冷轧机 小辊径
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国内铜板带发展现状与热轧技术的创新方向分析
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作者 韩晨 《有色金属加工》 CAS 2024年第1期1-8,共8页
文章论述了国内铜板带行业的发展现状,指出铜板带的热轧应分别从理论和技术,生产和工艺,设备设计制造,生产线配置和工程设计等方面进行基础性的研究和改进,并在工程项目的实践中不断创新。
关键词 铜板带 热轧 控轧控冷 技术 创新
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425/630 mm超宽铜带坯一次性连续挤压技术及质量控制
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作者 周海涛 代正昆 +3 位作者 刘珈豪 赵任飞 金炜 瞿威 《南昌工程学院学报》 CAS 2024年第1期1-7,共7页
研究了425/630 mm超宽紫铜带一次性连续挤压工艺,并对成型过程进行了模拟。结果表明:通过一次性连续挤压成型的425 mm超宽铜排组织均匀细小,抗拉强度平均值大于210 MPa,性能较理想,适合后续进行大变形量压延加工;通过对630 mm超宽铜排... 研究了425/630 mm超宽紫铜带一次性连续挤压工艺,并对成型过程进行了模拟。结果表明:通过一次性连续挤压成型的425 mm超宽铜排组织均匀细小,抗拉强度平均值大于210 MPa,性能较理想,适合后续进行大变形量压延加工;通过对630 mm超宽铜排一次性连续挤压模型数值模拟,计算得到的理论值与Deform-3D软件模拟结果基本一致。 展开更多
关键词 超宽铜带坯 连续挤压 模具设计 数值模拟
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热浸镀锡电子铜带材回流焊过程中镀锡层的微观结构及缺陷分析
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作者 欧阳豫鲁 张国赏 +5 位作者 柳亚辉 朱倩倩 宋克兴 皇涛 张彦敏 刘栋 《材料热处理学报》 CAS CSCD 北大核心 2024年第7期184-193,共10页
热浸镀锡电子铜带材是高端连接器和PCB(Printed circuit board)所需的关键导体材料,该材料在回流焊过程中产生的缺陷严重影响其服役性能。采用扫描电镜(SEM)、能谱仪(EDS)对热浸镀锡铜带材回流焊过程中缺陷组织类型及分布形态进行表征,... 热浸镀锡电子铜带材是高端连接器和PCB(Printed circuit board)所需的关键导体材料,该材料在回流焊过程中产生的缺陷严重影响其服役性能。采用扫描电镜(SEM)、能谱仪(EDS)对热浸镀锡铜带材回流焊过程中缺陷组织类型及分布形态进行表征,并对回流焊锡珠样品、回流焊非正常样品和回流焊正常样品的表层形貌进行对比。结果表明:回流焊过程中,样品镀层中均产生了不同程度的孔洞缺陷,孔洞尺寸在0.2~36μm,孔洞的产生与基体合金类型、基体合金厚度和镀层厚度无明显关联;孔洞形态并不一致,发现了孔洞边缘呈现出立体网状结构、边缘参差不齐、孔洞中存在小颗粒的现象。回流焊过程中,镀锡层中Cu、Sn元素发生了重新分布,不同缺陷所造成的元素分布情况并不相同。镀层结构中,化合物层、多相界面间高低起伏与镀层表面高度起伏无明显关联。 展开更多
关键词 热浸镀锡 回流焊 铜带材 镀层缺陷 锡珠
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附载体极薄铜箔的剥离机制
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作者 殷光茂 韩俊青 +2 位作者 杨祥魁 王浩然 武玉英 《精密成形工程》 北大核心 2024年第8期11-18,共8页
目的研究一种极薄铜箔制备过程中所需要的新型剥离层结构,以此来实现极薄铜箔的顺利剥离。方法利用两步电沉积法制备了可剥离的极薄铜箔,利用EBSD分析了“载体铜箔-剥离层-极薄铜箔”结构的附载体铜箔截面晶粒分布规律,利用聚焦离子束技... 目的研究一种极薄铜箔制备过程中所需要的新型剥离层结构,以此来实现极薄铜箔的顺利剥离。方法利用两步电沉积法制备了可剥离的极薄铜箔,利用EBSD分析了“载体铜箔-剥离层-极薄铜箔”结构的附载体铜箔截面晶粒分布规律,利用聚焦离子束技术(FIB)制备了TEM样品,通过HRTEM对“载体铜箔-剥离层-极薄铜箔”结构中剥离层/极薄铜箔、剥离层/载体铜箔的界面微观结构进行了研究。结果与单一Ni剥离层相比,通过两步电沉积法制备的复合剥离层(Ni,Cr-O)具有更好的可剥离性,复合剥离层由有序Ni层和无序Cr-O层组成。复合剥离层中的Ni层与载体铜箔相结合,界面完全共格,形成较强的界面结合;复合剥离层中的无序Cr-O层与极薄铜箔相结合,Cr-O层与极薄铜箔界面原子紊乱,形成较弱的界面结合。对制备的极薄铜箔剥离强度进行测试可知,极薄铜箔与载体铜箔能够剥离,极薄铜箔与剥离层之间的剥离强度约为0.01N/mm。结论利用载体铜箔-剥离层、极薄铜箔-剥离层结合界面的差异化实现了界面结合的差异化,复合剥离层内有序和无序的结构分布调控了载体铜箔与剥离层、极薄铜箔与剥离层之间的界面结合,使剥离层与极薄铜箔之间的结合弱于剥离层与载体铜箔之间的结合,有助于极薄铜箔与剥离层分离,同时剥离层与载体铜箔之间不会分离,进而获得可洁净剥离的极薄铜箔。 展开更多
关键词 极薄铜箔 剥离层 界面 载体铜箔 剥离强度
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低轮廓电解铜箔表面微细粗化工艺研究
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作者 凌羽 卢伟伟 +5 位作者 宋克兴 刘海涛 武玉英 杨祥魁 樊斌锋 王庆福 《精密成形工程》 北大核心 2024年第7期173-181,共9页
目的针对低轮廓电解铜箔剥离强度不足的问题,进行铜箔表面微细粗化处理研究,通过在铜箔表面生成可控形态的针状结构粗化层,以期在不影响低轮廓铜箔表面整体轮廓的条件下,提高铜箔的抗剥离性能。方法采用电化学微细粗化法,以NaOH和K_(2)S... 目的针对低轮廓电解铜箔剥离强度不足的问题,进行铜箔表面微细粗化处理研究,通过在铜箔表面生成可控形态的针状结构粗化层,以期在不影响低轮廓铜箔表面整体轮廓的条件下,提高铜箔的抗剥离性能。方法采用电化学微细粗化法,以NaOH和K_(2)S_(2)O_(8)的混合溶液为粗化电解液,研究电流密度、NaOH浓度及K_(2)S_(2)O_(8)浓度等主要工艺参数对铜箔表面针状结构形貌、粗糙度及铜箔剥离强度的影响。结果经过微细粗化处理后,低轮廓电解铜箔表面形成了针状多面体结构,在粗化电流密度为1.5 A/dm^(2)、粗化液中NaOH质量浓度为100 g/L、K_(2)S_(2)O_(8)质量浓度为20 g/L的条件下,粗化层形成的针状多面体结构致密且均匀,铜箔的剥离强度提升至0.48 N/mm。结论通过电化学微细粗化法,在低轮廓电解铜箔表面成功制备了针状结构的粗化层,通过优化微细粗化工艺参数,实现了铜箔表面针状结构粗化层的可控制备,在保证铜箔低表面粗糙度的同时,有效提高了铜箔的剥离强度。 展开更多
关键词 电解铜箔 微细粗化处理 针状多面体 粗糙度 剥离强度
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铜板带水平连铸生产工艺及铸坯缺陷探究
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作者 张良利 王松伟 +2 位作者 刘劲松 宋鸿武 刘羽飞 《有色金属材料与工程》 CAS 2024年第2期70-75,共6页
随着国民经济的持续快速发展,国内对铜合金带材的需求量也在逐年增加。水平连铸是目前生产铜及铜合金带材的重要工艺。主要从国内外水平连铸技术的发展历史、水平连铸设备、水平连铸的生产工艺流程、结晶器的基本结构和水平连铸的优点... 随着国民经济的持续快速发展,国内对铜合金带材的需求量也在逐年增加。水平连铸是目前生产铜及铜合金带材的重要工艺。主要从国内外水平连铸技术的发展历史、水平连铸设备、水平连铸的生产工艺流程、结晶器的基本结构和水平连铸的优点等方面对铜板带的水平连铸进行了论述与介绍。并且重点分析了铜合金板带坯在凝固过程中产生表面凹坑、气孔、晶粒不均匀、边部裂纹、反偏析、缩松等缺陷的原因,并提出了相应的改善措施,有效预防了缺陷的产生,提高了带材的成品率,延长了结晶器的使用寿命。并对铜板带水平连铸未来的发展趋势进行了展望。 展开更多
关键词 水平连铸 铜板带 结晶器 质量缺陷 发展趋势
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关键参数智能优化建模方法及其在铜板带加热炉智能燃烧系统中的应用
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作者 周宇 侯文武 +2 位作者 吕光锁 黄永冠 杨英华 《有色金属加工》 CAS 2024年第5期63-67,共5页
针对铜板带产品种类众多,数学模型参数调试难的问题,提出了基于智能优化的智能建模方法。该模型根据运行过程中采集的仪表数据和测试数据,通过智能优化算法优化出模型关键参数。结合加热炉一级控制程序的改进和二级数学模型的软件开发,... 针对铜板带产品种类众多,数学模型参数调试难的问题,提出了基于智能优化的智能建模方法。该模型根据运行过程中采集的仪表数据和测试数据,通过智能优化算法优化出模型关键参数。结合加热炉一级控制程序的改进和二级数学模型的软件开发,智能燃烧系统在铜板带步进式加热炉上成功应用,改善了铸锭加热的一致性,并节省了吨铜的天然气消耗。 展开更多
关键词 铜板带 加热炉 智能燃烧 智能优化
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高纯铜带耐高温性能的研究进展
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作者 刘媛 林志霖 +3 位作者 张青科 宋振纶 钱少平 许赪 《中国有色金属学报》 EI CAS CSCD 北大核心 2024年第8期2530-2546,共17页
随着5G电子通信、新能源汽车等产业的发展,高纯铜带在电子器件中的应用愈来愈广泛,同时电子器件封装、热沉等技术发展对其提出了苛刻的耐高温性能要求。高纯铜带对杂质控制要求非常严格,不能采用第二相来调控耐高温性能,因此是当前研究... 随着5G电子通信、新能源汽车等产业的发展,高纯铜带在电子器件中的应用愈来愈广泛,同时电子器件封装、热沉等技术发展对其提出了苛刻的耐高温性能要求。高纯铜带对杂质控制要求非常严格,不能采用第二相来调控耐高温性能,因此是当前研究的一大难点。本文综述了高纯铜带耐高温性能的最新研究进展,从制备工艺和组织控制两个角度出发,着重探讨了电解、压延、气相沉积制备的高纯铜带高温下晶粒长大机理的研究进展,针对织构和晶界工程对高纯铜带耐高温性能当前存在的问题和解决办法进行了讨论,并对其发展方向进行了展望。 展开更多
关键词 高纯铜带 耐高温性能 晶粒长大 组织 进展
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