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Growth of SiGe Films by Cold-wall UHV/CVD Using GeH_4 and Si_2H_6
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作者 CHENGBu-wen LIDai-zong 《Semiconductor Photonics and Technology》 CAS 2000年第3期134-138,共5页
An ultrahigh vacuum chemical vapor deposition (UHV/CVD) system is introduced. SiGe alloys and SiGe/Si multiple quantum wells (MQWs) have been grown by cold-wall UHV/CVD using disilane (Si 2H 6) and germane (GeH 4) as ... An ultrahigh vacuum chemical vapor deposition (UHV/CVD) system is introduced. SiGe alloys and SiGe/Si multiple quantum wells (MQWs) have been grown by cold-wall UHV/CVD using disilane (Si 2H 6) and germane (GeH 4) as the reactant gases on Si (100) substrates. The growth rate and Ge contents in SiGe alloys are studied at different temperature and different gas flow. The growth rate of SiGe alloy is decreased with the increase of GeH 4 flow at high temperature. X-ray diffraction measurement shows that SiGe/Si MQWs have good crystallinity, sharp interface and uniformity. No dislocation is found in the observation of transmission electron microscopy (TEM) of SiGe/Si MQWs. The average deviation of the thickness and the fraction of Ge in single SiGe alloy sample are 3.31% and 2.01%, respectively. 展开更多
关键词 gesi 量子阱 uhv/cvd 透射电子显微镜
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Comparison of Ge_xSi_(1- x) Grown by UHV/CVD from Si_2H_6/GeH_4 and SiH_4/GeH_4 被引量:1
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作者 LI Dai-zong, YU Zhuo, CHEN Bu-wen, HUANG Chang-jun, LEI Zhen-lin, YU Jin-zhong, WANG Qi-ming (State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083,CHN) 《Semiconductor Photonics and Technology》 CAS 1999年第3期134-138,共5页
Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-fa... Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-favoring position due to the slow growth rate from SiH 4. In this case, a Si buffer that isolates the effect of substrate on epilayer could not be grown, which results in a pit penetrating into epilayer and buffer. The FWHM is 0.055° in DCXRD from SiH 4. The presence of diffraction fringes is an indication of an excellent crystalline quality. The roughness of the surface is improved if grown by Si 2H 6; however, the crystal quality of the Ge x Si 1- x material became worse than that from SiH 4 due to much larger growth rate from Si 2H 6. The content of Ge is obtained from DCXRD, which indicates the growth rate from Si 2H 6 is largest, then GeH 4, and that from SiH 4 is least. 展开更多
关键词 硅化锗 半导体材料 化学气相沉积
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Ge_xSi_(1-x)材料生长的改善
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作者 李代宗 于卓 +3 位作者 雷震霖 成步文 余金中 王启明 《材料研究学报》 EI CAS CSCD 北大核心 2000年第2期215-217,共3页
利用超高真空化学气相淀积(UHV/CVD)系统在 650℃生长出表面光亮的 GeSi单晶 在1200L/min分子泵与前级机械系间串接 450L/min分子泵,改善了生长环境串接分子泵后生长的 样品的X射线双晶衍射分析表... 利用超高真空化学气相淀积(UHV/CVD)系统在 650℃生长出表面光亮的 GeSi单晶 在1200L/min分子泵与前级机械系间串接 450L/min分子泵,改善了生长环境串接分子泵后生长的 样品的X射线双晶衍射分析表明,外延层衍射峰半宽仅为 198arcsec, 且出现了 Pendellosung干涉条 纹,说明外延层结晶质量很好。 展开更多
关键词 超高真空化学气相淀积 硅化锗材料 晶体生长
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D-UHV/VCD系统中SiGe薄膜的低温生长(英文)
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作者 曾玉刚 韩根全 余金中 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第10期1889-1892,共4页
生长温度对SiGe合金的性能有重要影响.在双腔超高真空化学气相淀积生长中,通常采用液氮冷却的方法.该生长模式下,通入乙硅烷时腔内的生长气压约为10-5Pa,SiGe的最低生长温度约为550℃.为了降低生长温度,文中采用了不用液氮冷却的模式,... 生长温度对SiGe合金的性能有重要影响.在双腔超高真空化学气相淀积生长中,通常采用液氮冷却的方法.该生长模式下,通入乙硅烷时腔内的生长气压约为10-5Pa,SiGe的最低生长温度约为550℃.为了降低生长温度,文中采用了不用液氮冷却的模式,腔内生长气压约为10-2Pa,增加3个数量级,并且将生长温度降到了485℃,远低于传统的生长温度.DCXRD测试和TEM图像表明,生长的SiGe薄膜和SiGe/Si超晶格具有良好的晶格质量.结果证明,在UHV/CVD系统中,这是一种有效的实现SiGe低温生长的方法. 展开更多
关键词 SIGE 超高真空化学气相淀积 低温生长 X射线双晶衍射
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