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Interface Reaction of SiO_2/Ta and Its Influence on Cu Diffusion 被引量:1
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作者 龙世兵 马纪东 +4 位作者 于广华 赵洪辰 朱逢吾 张国海 夏洋 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第10期1046-1050,共5页
Ta/NiFe film is deposited on Si substrate precoated with SiO_2 by magnetron sputtering.SiO_2/Ta interface and Ta_5Si_3 standard sample are investigated by using X-ray photoelectron spectroscopy (XPS) and peak decompos... Ta/NiFe film is deposited on Si substrate precoated with SiO_2 by magnetron sputtering.SiO_2/Ta interface and Ta_5Si_3 standard sample are investigated by using X-ray photoelectron spectroscopy (XPS) and peak decomposition technique.The results show that there is a thermodynamically favorable reaction at the SiO_2/Ta interface:37Ta+15SiO_2=5Ta_5Si_3+6Ta_2O_5.The more stable products Ta_5Si_3 and Ta_2O_5 may be beneficial to stop the diffusion of Cu into SiO_2. 展开更多
关键词 copper interconnection in ulsi diffusion barrier interface reaction X-ray photoelectron spectroscopy
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