Structured complex silicon components have been widely used in solar cells,biomedical engineering and other industrial applications.As silicon is a typical brittle material,ultrasonic vibration cutting(UVC)is a promis...Structured complex silicon components have been widely used in solar cells,biomedical engineering and other industrial applications.As silicon is a typical brittle material,ultrasonic vibration cutting(UVC)is a promising method to achieve better cutting performance than conventional techniques.High-frequency ID UVC possesses higher nominal cutting speed and material removal rate than many 2D/3D UVC systems,and thus,it has great development potential in industrial applications of structured silicon components.However,few researchers have applied ID UVC to the cutting of structured silicon surfaces,since its main drawback is tool marks imprinted by the vibration on machined surface.In this study,to uncover the key machining characteristics under the condition of ID UVC,a series of tests involving diamond cutting grooves were first performed on the silicon surface.The machined surface and chips were subsequently measured and analyzed to evaluate the critical undeformed chip thickness,surface characteristics,and chip formation.Regarding the main drawback of ID UVC,a novel theoretical model was developed for predicting the length of tool marks and evaluating the impact of tool marks on the surface finish.The results demonstrated that the critical undeformed chip thickness of silicon reached 1030 nm under a certain vibration amplitude and that an array of micro grooves was generated at the plastic region with a surface roughness(7?a)as low as 1.11 nm.Moreover,the micro topography of the continuous chips exhibited discontinuous clusters of lines with diameters of dozens of nanometers,only composed of polysilicon.The novel theoretical model was able to predict the length of tool marks with low error.Thus,the impact of tool marks on the surface finish can be reduced and even eliminated with help of the model.展开更多
基金The authors would like to express their sincere thanks to the National Natural Science Foundation of China(Grant No.51775482)the Hebei Province Natural Science Foundation of China(Grant No.E2016203372)for their financial support in this research work.
文摘Structured complex silicon components have been widely used in solar cells,biomedical engineering and other industrial applications.As silicon is a typical brittle material,ultrasonic vibration cutting(UVC)is a promising method to achieve better cutting performance than conventional techniques.High-frequency ID UVC possesses higher nominal cutting speed and material removal rate than many 2D/3D UVC systems,and thus,it has great development potential in industrial applications of structured silicon components.However,few researchers have applied ID UVC to the cutting of structured silicon surfaces,since its main drawback is tool marks imprinted by the vibration on machined surface.In this study,to uncover the key machining characteristics under the condition of ID UVC,a series of tests involving diamond cutting grooves were first performed on the silicon surface.The machined surface and chips were subsequently measured and analyzed to evaluate the critical undeformed chip thickness,surface characteristics,and chip formation.Regarding the main drawback of ID UVC,a novel theoretical model was developed for predicting the length of tool marks and evaluating the impact of tool marks on the surface finish.The results demonstrated that the critical undeformed chip thickness of silicon reached 1030 nm under a certain vibration amplitude and that an array of micro grooves was generated at the plastic region with a surface roughness(7?a)as low as 1.11 nm.Moreover,the micro topography of the continuous chips exhibited discontinuous clusters of lines with diameters of dozens of nanometers,only composed of polysilicon.The novel theoretical model was able to predict the length of tool marks with low error.Thus,the impact of tool marks on the surface finish can be reduced and even eliminated with help of the model.
