Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, bu...Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.展开更多
The structural changes around a crack tip in a high density polyethylene were investigated by means of scanning synchrotron microfocus small-angle X-ray scattering technique. The scattering data confirm the process of...The structural changes around a crack tip in a high density polyethylene were investigated by means of scanning synchrotron microfocus small-angle X-ray scattering technique. The scattering data confirm the process of craze structure development near a crack tip based on the evolution of voids. In addition, it was found that the main stress in the plastic zone near a crack tip exhibited a gradient distribution with respect to its strength and direction. The whole damaged area showed a strain distribution indicating a flow behavior toward the crack tip.展开更多
In the present paper, three dimensional analyses of some general constraint parameters and fracture parameters near the crack tip of Mode I CT specimens in two different thicknesses are carried out by employing ADINA ...In the present paper, three dimensional analyses of some general constraint parameters and fracture parameters near the crack tip of Mode I CT specimens in two different thicknesses are carried out by employing ADINA program. The results reveal that the constraints along the thickness direction are obviously separated into two parts: the keeping similar high constraint field (Z1) and rapid reducing constraints one(Z2). The two fields are experimentally confiremed to correspond to the smooth region and the shear lip on the fracture face respectively. So the three dimensional stress structure of Mode I specimens can be derived through discussing the two fields respectively. The distribution of the Crack Tip Opening Displacement (CTOD) along the thickness direction and the three dimensional distribution of the void growth ratio (Vg) near the crack tip are also obtained. The two fracture parameters are in similar trends along the thickness direction, and both of them can reflect the effect of thickness and that of the loading level to a certain degree.展开更多
基金financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416)the Fundamental Research funds for the Central Universities (No.3102017GX06003)
文摘Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.
基金supported by the"Hundred Talents Project"of the Chinese Academy of Sciences,the National Basic Research Program of China(No.2005CB623800)National Natural Science Foundation of China(Nos.50603024, 50621302) and HASYLAB projectⅡ-20052011
文摘The structural changes around a crack tip in a high density polyethylene were investigated by means of scanning synchrotron microfocus small-angle X-ray scattering technique. The scattering data confirm the process of craze structure development near a crack tip based on the evolution of voids. In addition, it was found that the main stress in the plastic zone near a crack tip exhibited a gradient distribution with respect to its strength and direction. The whole damaged area showed a strain distribution indicating a flow behavior toward the crack tip.
文摘In the present paper, three dimensional analyses of some general constraint parameters and fracture parameters near the crack tip of Mode I CT specimens in two different thicknesses are carried out by employing ADINA program. The results reveal that the constraints along the thickness direction are obviously separated into two parts: the keeping similar high constraint field (Z1) and rapid reducing constraints one(Z2). The two fields are experimentally confiremed to correspond to the smooth region and the shear lip on the fracture face respectively. So the three dimensional stress structure of Mode I specimens can be derived through discussing the two fields respectively. The distribution of the Crack Tip Opening Displacement (CTOD) along the thickness direction and the three dimensional distribution of the void growth ratio (Vg) near the crack tip are also obtained. The two fracture parameters are in similar trends along the thickness direction, and both of them can reflect the effect of thickness and that of the loading level to a certain degree.
