Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an...Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.展开更多
Applications of HIP technique on W-Cu composites are studied and developed. TheCuinfiltrated W composites without nickel can be densified easily by HIP processing at the tempera-ture below the melting point of copper....Applications of HIP technique on W-Cu composites are studied and developed. TheCuinfiltrated W composites without nickel can be densified easily by HIP processing at the tempera-ture below the melting point of copper. The relative density of W-Cu composites increases from 96%-97% to nearly full dense for the materials in which copper contents are more than 30 percent inweight and improves to near 99 percent for W-Cu20 composites. The properties of W-Cu materials ,such as strength, hardness and electrical conductivity, and the homogeneity of properties are im-proved significantly. The diffusion bonding of W-Cu to W-Cu or Cu by HIP processing is also stud-ied. The bonding strength is in correspondence with that of matrix. It is possible to produce largedimension W-Cu workpieces and (W-Cu)-Cu complex layer materials in commercial scale.展开更多
In order to improve the process of co-reduction of oxide powder, a new mechano-thermal process was de-signed to produce high-dispersed W-Cu composite powder by high temperature oxidation, short time high-energymilling...In order to improve the process of co-reduction of oxide powder, a new mechano-thermal process was de-signed to produce high-dispersed W-Cu composite powder by high temperature oxidation, short time high-energymilling and reduction at lower temperature. The particle size, oxygen content and their sintering abilities of W-Cucomposite powder in different conditions were analyzed. The results show that after a quick milling of the oxidepowder for about 3-10 h, the reduction temperature of the W-Cu oxide powder can be lowered to about 650 ℃ from700-750 ℃ owning to the lowering of particle size of the oxide powder. The average particle size of W-Cu powder af-ter reduction at 650 ℃ is about 0.5 μm smaller than that reduced at 750 ℃. After sintering at 1 200 ℃ for 1 h inhydrogen atmosphere, the relative density and thermal conductivity of final products (W-20Cu) can attain 99.5%and 210 W @ m-1 @ K-1 respectively.展开更多
A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sul...A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions （flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃） by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.展开更多
基金This Project was financially supported by the National Natural Science Foundation of China (No. 50471033).
文摘Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.
文摘Applications of HIP technique on W-Cu composites are studied and developed. TheCuinfiltrated W composites without nickel can be densified easily by HIP processing at the tempera-ture below the melting point of copper. The relative density of W-Cu composites increases from 96%-97% to nearly full dense for the materials in which copper contents are more than 30 percent inweight and improves to near 99 percent for W-Cu20 composites. The properties of W-Cu materials ,such as strength, hardness and electrical conductivity, and the homogeneity of properties are im-proved significantly. The diffusion bonding of W-Cu to W-Cu or Cu by HIP processing is also stud-ied. The bonding strength is in correspondence with that of matrix. It is possible to produce largedimension W-Cu workpieces and (W-Cu)-Cu complex layer materials in commercial scale.
基金Project (59871064) supported by the National Nature Science Foundation of China
文摘In order to improve the process of co-reduction of oxide powder, a new mechano-thermal process was de-signed to produce high-dispersed W-Cu composite powder by high temperature oxidation, short time high-energymilling and reduction at lower temperature. The particle size, oxygen content and their sintering abilities of W-Cucomposite powder in different conditions were analyzed. The results show that after a quick milling of the oxidepowder for about 3-10 h, the reduction temperature of the W-Cu oxide powder can be lowered to about 650 ℃ from700-750 ℃ owning to the lowering of particle size of the oxide powder. The average particle size of W-Cu powder af-ter reduction at 650 ℃ is about 0.5 μm smaller than that reduced at 750 ℃. After sintering at 1 200 ℃ for 1 h inhydrogen atmosphere, the relative density and thermal conductivity of final products (W-20Cu) can attain 99.5%and 210 W @ m-1 @ K-1 respectively.
基金Funded by the National Natural Science Foundation of China(Nos.51202175 and 11072228)the National 111 Project(No.B13035)
文摘A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions （flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃） by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.
