真空热压烧结W(50)/Cu-Al_2O_3的热压缩变形行为

采用真空热压烧结法制备了纳米Al2O3弥散强化铜为基体,W颗粒为增强相的W(50)/Cu-Al2O3新型复合材料。在Gleeble-1500D热模拟机上对真空热压烧结W(50)/Cu-Al2 O3复合材料进行等温热压缩实验,研究了在变形温度为650～950℃;变形速率为0.01～5 s-1;最大真应变为0.7条件下的流变应力行为。结果表明:在实验条件下,复合材料W(50)/Cu-Al2O3存在明显的动态再结晶特征,即变形初期,流变应力随着应变量的增大而迅速增大,达到峰值之后流变应力逐渐趋于平稳,不随应变的增加而明显变化。变形温度和变形速率对流变应力影响显著,随着温度的升高和应变速率的减小,峰值应力逐渐减小,并且在晶界交叉处出现再结晶晶粒,并逐渐增多。复合材料的主要软化机制为动态再结晶。建立了复合材料高温变形时的流变应力本构方程,并确定了热变形激活能Q为176.05 kJ/mol。

真空热压烧结W(50)/Cu-Al_2O_3复合材料的性能研究

采用真空热压烧结工艺制备W(50)/Cu-Al2O3复合材料,观察了其显微组织,测试了其致密度、硬度、抗弯强度和导电率。结果表明:W(50)/Cu-Al2O3复合材料组织致密;致密度和硬度优于Cu-50%W,致密度可达99.8%,显微硬度达135 HV。而导电率为46%IACS,略低于W-50%Cu复合材料。抗弯强度为291.3 MPa,弥散铜钨合金室温弯曲断裂主要以弥散Cu相的撕裂为主,伴随有W-Cu界面的分离和部分W晶粒的解理断裂。

Study on Thermal Deformation Behavior and Properties of Vacuum Hot-press Sintered W(50)/Cu-Al_2O_3 Composite

In this work, the tungsten particulate reinforced Al2O3 dispersion strengthened copper base composites were successfully fabricated by using a vacuum hot-press sintering method. With the test temperature varying from 650 to 950 ℃ and the strain rate varying from 0.01 to 5 s-1, the W(50)/Cu-Al2O3 composites were isothermally compressed on a Gleeble-1500D thermal simulator. The true stress-strain curves of the W(50)/Cu-Al2O3 under different test conditions were obtained. The dynamic recrystallization of the W(50)/Cu-Al2O3 composite occurs during the isothermal compression. The constitutive equations and the hot deformation activation energy of W(50)/Cu-Al2O3 composites were calculated on the basis of the above experimental results.

Influence of lanthanum on enhancement of mechanical and electrical properties of Cu-Al_2O_3 composites

Two kinds of Cu-Al_2O_3 composites(with and without La) were prepared via mechanical alloying-spark plasma sintering(MA-SPS) method. Microstructure, mechanical properties and electrical resistivity were investigated systematically using metallography, scanning electron microscopy, transmission electron microscopy, mechanical and electrical properties testing. The results indicate that an appropriate amount of La can homogenize the distribution of Al_2O_3. As such, yield strength, ultimate tensile strength and elongation of Cu-Al_2O_3-La are greatly increased. Some semi-coherent interface between Cu and Al_2O_3 is found, which means a low interface energy. The grain shape of Cu changes to irregular band with the addition of La. This change results in a density decrease of grain boundary and reduces electrical resistance. Lanthanum may exist in the form of La_2O_3.

W80/Cu-Al_2O_3复合材料的耐电弧侵蚀性能

采用粉末冶金和熔渗法制备W80/Cu-Al_2O_3复合材料,测试其密度、硬度和导电率,探究Al_2O_3对W80/Cu复合材料耐电弧侵蚀性能的影响。结果表明,添加Al_2O_3对复合材料的致密度和导电率影响不大,硬度有所增加;W80/Cu和W80/Cu-Al_2O_3复合材料在不同电流条件下燃弧时间和燃弧能量基本相同,但W80/Cu-Al_2O_3复合材料的稳定性更高;在30 V、30 A条件下,W80/Cu复合材料在电弧侵蚀过程中发生材料从阴极向阳极转移,加入Al_2O_3增强相后,材料的转移方向为阳极向阴极转移,且材料损耗量降低,喷溅现象减少,电弧侵蚀后触头表面更加平整。