Equalization of Ti 6Al 4V alloy welded joint by scanning electron beam welding

The equalization of Ti 6Al 4V alloy welded joint with base metal on corrosion resistance, strength and ductility was studied. The solidification microstructure is transformed from 650 μm columnar grains to 100 μm equiaxed grains by scanning electron beam welding. The anodic polarization curve of 150 μm equiaxed grains coincides with that of base metal. Equal corrosion resistance between weld metal and base metal was obtained. Uniform microstructure and solute distribution are the basis of equalization. Corrosion rate of weld with 150 μm equiaxed grains is the lowest, 2.45 times lower than that of 650 μm columnar grains. Weld strength is 98% as much as that of base metal, yield strength ratio is 99.5%, which is 3.6% higher than that of base metal.

Control on Electron Beam Scanning Track

In order to use electron beam as a movable welding heat source and whose energy distribution along its moving trace can be controlled, a method of electron beam scanning track and scanning mode control was put forward. Based on it, the electron beam scanning track and scanning mode can be edited at will according to actual requirements, and the energy input of each point of the scanning track can be controlled. In addition, the scanning frequency and points control, real time adjusting of the scanning track etc. were explained. This method can be used in electron beam brazing, surface modification, surface heat treatment etc.

THE GROWTH OF MONOCRYSTALLINE SILICON THIN FILM ON INSULATOR (SOI) BY SCANNING ELECTRON BEAM

An experiment for preparation of SOI films by using the scanning electron beam to modify the polycrystalline silicon on SiO2 is presented. This method takes on the epitaxial lateral growth of liquid phase with the crystallon to form monocrystalline silicon films. The effects of the beam power density, scanning velocity, temperature of the substrates and the construction of samples on the quality of the monocrystalline silicon films were discussed. A good experimental result has been obtained, the monocrystalline silicon zone is nearly 200×25μm2.

Investigation on gradient material fabrication with electron beam melting based on scanning track control

A new electron beam control system was developed in a general vacuum electron beam machine by assembling with industrial control computer, programmable logic control （PLC）, deflection coil, data acquisition card, power amplifier, etc. In this control system, scanning track and energy distribution of electron beam could be edited off-line, real-time adjusted and controlled on-line. Ti-Mo gradient material （GM） with high temperature resistant was fabricated using the technology of electron beam melting. The melting processes include three steps, such as preheating, melting, and homogenizing. The results show that the GM prepared by melting technology has fine appearance, and it has good integrated interface with the Ti alloy. Mo and Ti elements are gradually distributed in the inter.face of the gradient material. The microstructure close to the Ti alloy base metal is α ＋ β basket-waver grain, and the microstructure close to the GM is a single phase of β solid solution.

Effect of Melt Scan Rate on Microstructure and Macrostructure for Electron Beam Melting of Ti-6Al-4V

Microstructure and variations in porosity in Ti-6Al-4V samples built with electron beam melting (EBM) over a range of melt scan speeds, ranging from 100 mm·s-1 to 1000 mm·s-1 were examined. Microstructure was characterized by refinement of α-phase and transformation to α′-martensite. Light optical microscopy, scanning electron microscopy, and transmission electron microscopy were used to observe these phenomena, while corresponding tensile testing and associated macro and microindentation hardness measurements were used to define the microstructural variations. Relative stiffness was observed to be linearly log-log related to relative density, corresponding to ideal porosity associated with open-cellular structures.

Feature Extraction of Sectorial Scan Image of Thick-Walled Electron Beam Welding Seam Based on Principal Component Analysis

A feature extraction method was proposed to sectorial scan image of Ti-6Al-4V electron beam welding seam based on principal component analysis to solve problem of high-dimensional data resulting in timeconsuming in defect recognition. Seven features were extracted from the image and represented 87. 3% information of the original data. Both the extracted features and the original data were used to train support vector machine model to assess the feature extraction performance in two aspects: recognition accuracy and training time. The results show that using the extracted features the recognition accuracy of pore,crack,lack of fusion and lack of penetration are 93%,90.7%,94.7% and 89.3%,respectively,which is slightly higher than those using the original data. The training time of the models using the extracted features is extremely reduced comparing with those using the original data.

Method of temperature rising velocity and threshold control of electron beam brazing

In order to accommodate electron beam to the brazing of the joints with various curve shapes and the brazing of thermo sensitive materials, the method of electron beam scanning and brazing temperature control was developed, in which electron beam was controlled to scan according to predefined scanning track, and the actual temperature rising velocity of the brazed seam was lim- ited in an allowed scope by detecting the brazed seam temperature, calculating the temperature rising velocity and adjusting the beam current during the brazing process; in addition, through the setting of the highest allowed temperature, the actual temperature of the brazed seam could be controlled not exceeding the threshold set value, and these two methods could be employed alone or jointly. It is shown that high precision temperature control in electron beam brazing could be realized and the productivity be increased by the proposed method.

Design of 10 MeV electron linear accelerator for space environment simulation

A compact 10 MeV S-band irradiation electron linear accelerator(linac)was developed to simulate electronic radiation in outer space and perform electron irradiation effect tests on spacecraft materials and devices.According to the requirements of space environment simulation,the electron beam energy can be adjusted in the range from 3.5 to 10 MeV,and the average current can be adjusted in the range from 0.1 to 1 mA.The linac should be capable of providing beam irradiation over a large area of 1 m^(2) with a uniformity greater than 90% and a scanning rate of 100 Hz.A novel method was applied to achieve such a high beam scanning rate by combining a kicker and a scanning magnet.Based on this requirement,a design for the10 MeV linac is proposed with an RF power pulse repetition rate of 500 Hz;it includes a thermal cathode electron gun,a bunching-accelerating section,and a scanning transport line.The detailed physical design and dynamic simulation results of the proposed 10 MeV electron linac are presented in this paper.

An electron moir■ method for a common SEM

In the electron moiré method, a high-frequency grating is used to measure microscopic deformation, which promises significant potential applications for the method in the microscopic analysis of materials. However, a special beam scanning control device is required to produce a grating and generate a moiré fringe pattern for the scanning electron microscope （SEM）. Because only a few SEMs used in the material science studies are equipped with this device, the use of the electron moiré method is limited. In this study, an electron moiré method for a common SEM without the beam control device is presented. A grating based on a multi-scanning concept is fabricated in any observing mode. A real-time moiré pattern can also be generated in the SEM or an optical filtering system. Without the beam control device being a prerequisite, the electron moiré method can be more widely used. The experimental results from three different types of SEMs show that high quality gratings with uniform lines and less pitch error can be fabricated by this method, and moiré patterns can also be correctly generated.

Electro-optical sampling non-synchronous delay scanning measurement of electron beam bunch length at BFEL

The Electro-optical sampling delay scanning technique can be used for electron beam bunch length measurement. A novel non-synchronous delay scanning technique based on the electro-optical sampling measurements is presented. Based on Beijing Free Electron Laser （BFEL）, the electron beam bunch length was measured with the electro-optical sampling technique for the first time in China. The result shows that the electron beam bunch length at BFEL is about 5.6±1.2 ps.

Slice Thickness Optimization for the Focused Ion Beam-Scanning Electron Microscopy 3D Tomography of Hierarchical Nanoporous Gold

The combination of focused ion beam (FIB) with scanning electron microscopy (SEM), also known as FIB-SEM tomography, has become a powerful 3D imaging technique at the nanometer scale. This method uses an ion beam to mill away a thin slice of material, which is then block-face imaged using an electron beam. With consecutive slicing along the z-axis and subsequent imaging, a volume of interest can be reconstructed from the images and further analyzed. Hierarchical nanoporous gold (HNPG) exhibits unique structural properties and has a ligament size of 15–110 nm and pore size of 5–20 nm. Accurate reconstruction of its image is crucial in determining its mechanical and other properties. Slice thickness is one of the most critical and uncertain parameters in FIB-SEM tomography. For HNPG, the slice thickness should be at least half as thin as the pore size and, in our approach, should not exceed 10 nm. Variations in slice thickness are caused by various microscope and sample parameters, e.g., converged ion milling beam shape, charging effects, beam drift, or sample surface roughness. Determining and optimizing the actual slice thickness variation appear challenging. In this work, we examine the influence of ion beam scan resolution and the dwell time on the mean and standard deviation of slice thickness. After optimizing the resolution and dwell time to achieve the target slice thickness and lowest possible standard deviation, we apply these parameters to analyze an actual HNPG sample. Our approach can determine the thickness of each slice along the z-axis and estimate the deviation of the milling process along the y-axis (slow imaging axis). For this function, we create a multi-ruler structure integrated with the HNPG sample.

Electron Moirémethod

It is very important to measure local deformations for an in-depth understanding of mechanical properties and fracture mechanism of structural and functional materials. In this paper, different types of model grid fabrication methods and many types of electron Moire methods using an electron beam drawing system, a scanning electron microscope or a focus ion beam are reported, together with their applications in the measurement of deformations occurring in various engineerings and materials science research.

Nanoparticles Production and Inclusion in <i>S. aureus</i>Incubated with Polyurethane: An Electron Microscopy Analysis

This study shows that submicron/nanoparticles found in bacterial cells (S. aureus) incubated with polyurethane (a material commonly used for prostheses in odontostomatology) are a consequence of biodestruction. The presence of polyurethane nanoparticles into bacterial vesicles suggests that the internalization process occurs through endocytosis. TEM and FIB/SEM are a suitable set of correlated instruments and techniques for this multi facet investigation: polyurethane particles influence the properties of S. aureus from the morpho-functional standpoint that may have undesirable effects on the human body. S. aureus and C. albicans are symbiotic microorganisms;it was observed that C. albicans has a similar interaction with polyurethane and an increment of the biodestruction capacity is expected by its mutual work with S. aureus.

原子力显微镜-扫描电子显微镜共定位表征系统的研发与应用

微纳加工过程中,常有样品需要进行聚焦离子束(FIB)溅射、切割,扫描电子显微镜(SEM)以及原子力显微镜(AFM)表征,而这三类仪器都需要将样品固定在样品台上才可测试,固定不佳会影响表征结果.但固定好的样品在不同仪器之间转移、拆卸、再固定的过程中极易受到破坏.基于以上问题,设计了AFM-SEM-FIB样品共定位系统,可实现样品在此三种仪器之间的无损转移及共定位,避免珍贵样品破坏及目标丢失,以及解决AFM扫描无法控制方向、迅速调整位点等问题.在微纳表征中有优异的表现,系统已被开发成产品并量产销售.

体电子显微成像技术在肝癌细胞超微结构分析中的应用研究

体电子显微成像技术(volume electron microscopy)可以在更大三维空间中对样品进行纳米分辨率三维结构分析,获取样品内部结构的三维模型和各结构之间的位置关系、体积比例等信息,更加全面地反映样品的超微结构与功能的关系。本文利用基于聚焦离子束扫描电镜的体电子显微成像技术对人源肝癌细胞的三维超微结构进行分析,获得了多种细胞器包括细胞核、线粒体、内质网和高尔基体等的高分辨率三维结构模型。

三元锂电正极材料截面样品制备及表征

三元正极材料结合了LiNiO2的高比容量、LiCoO2的良好循环性能、LiMnO2的高安全性和低成本,已经成为锂离子电池最有发展前景的正极材料之一。正极材料的微观结构是影响电池性能的重要因素。扫描电子显微镜(SEM)分析是研究电池材料微观结构的重要手段,二次电子信号、背散射电子信号以及能谱分析,EBSD晶界、取向分析等能给出电池材料的微观结构、成分、内部晶体结构等重要信息。高质量的SEM和EBSD分析需要采用合适的制样方法获得尽量平整的颗粒截面,本实验用离子束加工技术切割抛光方法制备三元材料极片截面样品。结果表明,该方法获得的样品截面平整度好,可观测区域大,满足了在SEM下观察和表征电池正极材料的研究需要。

双束电子显微镜在锂离子电池研究中的应用

锂离子电池技术作为新能源储存领域重要的电池技术,具有广阔的发展前景.近年来,电极材料的开发和制备工艺的优化成为了锂离子电池技术的研究重点.双束电子显微镜又称聚焦离子束–扫描电子显微镜(focused ion beam-scanning electron microscope,FIB-SEM),是一种兼具微纳加工和显微成像功能的显微分析仪器,具有精确定点加工、高分辨扫描成像、适用多种类样品等优点,可为锂离子电池材料表征提供重要的技术支撑.对锂离子电池材料研究中FIB-SEM的应用场景进行了总结,归纳了FIB-SEM和其他仪器联用可实现的拓展功能.最后,对FIB-SEM在锂离子电池材料研究中的潜在应用进行了展望.

基于聚焦离子双束电镜的透射电镜微柱试样制备

利用聚焦离子双束电镜在传统透射电镜试样制备的方法上进行改进,通过改变离子束辅助沉积的区域及作用,以及将U形切改良为L形切,成功提取压缩后的小鼠骨骼微柱试样至专用铜网上。提取出的试样通过离子束精确减薄后,可在透射电镜下观察到胶原纤维走向。

Scan Strategy in Electron Beam Selective Melting

In electron beam selective melting process, powder pushed-away phenomena and uneven temperature field are two main obstacles, which are greatly associated with the electron beam scan mode. In this paper, various scan strategies, including iterative scan mode, reverse scan mode, interlaced reverse scan mode, randomized block scan mode, and constant length scan mode, are investigated. The analyses for each scan strategy are presented based on the influence to the temperature field over the formation zone and the powder pushed-away phenomena. The most promising strategy, interlaced reverse scan mode, is approved by the ANSYS simulation and a two-dimensional scan experiment. The result shows interlaced reverse scan mode can improve the uniformity of the temperature field and reduce the powder pushed-away phenomena.

电子束扫描控制系统

设计了一个可编程电子束扫描控制系统 ,能够使电子束受控的偏摆产生任何图形。该系统的控制软件能够计算、控制电子束偏摆获得所要的波形 ,这些波形是由若干独立的数据点构成。使用该系统 ,温度梯度可以很精确地调整 ,且误差比较小。该系统可以很容易地应用于原有的电子束加工设备上 ,适用于电子束硬化、重熔、钎焊和表面改性处理。