第5代移动通信系统(Fifth generation mobile communication system5G)是面向2020年以后的人类信息社会,尽管在一些标准的制定上还存在很多争议,但是5G的一些基本特征已经明确:大规模天线阵列、基于滤波器组的多载波技术、全双工复用、...第5代移动通信系统(Fifth generation mobile communication system5G)是面向2020年以后的人类信息社会,尽管在一些标准的制定上还存在很多争议,但是5G的一些基本特征已经明确:大规模天线阵列、基于滤波器组的多载波技术、全双工复用、超密集组网、自组织网络、软件定义网络。这七大特征将会是5G移动通信的研究重点与热点。在5G的诸多特征中干扰始终是限制其发展的一个重要因素,例如在超密集组网(Ultra-Dense Network)中的干扰问题,由于超密集组网可以大幅度的提升单位面积的系统容量,所以导致网络节点离终端更近,会造成很严重的干扰问题。在这里我们提出一种基于符号检测的LS(Least squre)和Min-WLI(Minimum Weighted Leakage Interference)结合的干扰对齐算法去消除干扰,经过计算机仿真验证该算法在系统的误码率降低上有着比之前算法都优越的性能。展开更多
In traditional 3D NAND design,peripheral circuit accounts for 20-30%of the chip realestate,which reduces the memory density of flash memory.As 3D NAND technology stacks to 128 layers or higher,peripheral circuits may ...In traditional 3D NAND design,peripheral circuit accounts for 20-30%of the chip realestate,which reduces the memory density of flash memory.As 3D NAND technology stacks to 128 layers or higher,peripheral circuits may account for more than 50%of the overall chip area.On the contrast,the Xtacking^TM technology arranges array and logic parts on two different wafers,and connects the memory arrays to the logic circuit by metal VIAs(Vertical Interconnect Accesses)to achieve unprecedented high storage density as well as DRAM level I/O speed.As a consequence,it becomes increasingly significant to monitor metal VIAs depth before wafer bonding process as to ensure reliability of array-logic connections.Currently,AFM(Atom Force Microscopy)is the main stream method of VIA depth monitoring.Apparently,AFM wins the battle of precision,however the low throughput limited its usage in mass production.In order to accomplish the requirement of VLSI production,a WLI(White Light Interference)metrology is revisited and a novel WLI method was developed to monitor VIAs depth.Basically there are two major limitations that keep WLI tools from wider use,transparent film impact and diffraction limitation.In this work,the engineering solutions are illustrated and inline dishing measurement is achieved with high accuracy and precision.展开更多
文摘第5代移动通信系统(Fifth generation mobile communication system5G)是面向2020年以后的人类信息社会,尽管在一些标准的制定上还存在很多争议,但是5G的一些基本特征已经明确:大规模天线阵列、基于滤波器组的多载波技术、全双工复用、超密集组网、自组织网络、软件定义网络。这七大特征将会是5G移动通信的研究重点与热点。在5G的诸多特征中干扰始终是限制其发展的一个重要因素,例如在超密集组网(Ultra-Dense Network)中的干扰问题,由于超密集组网可以大幅度的提升单位面积的系统容量,所以导致网络节点离终端更近,会造成很严重的干扰问题。在这里我们提出一种基于符号检测的LS(Least squre)和Min-WLI(Minimum Weighted Leakage Interference)结合的干扰对齐算法去消除干扰,经过计算机仿真验证该算法在系统的误码率降低上有着比之前算法都优越的性能。
文摘In traditional 3D NAND design,peripheral circuit accounts for 20-30%of the chip realestate,which reduces the memory density of flash memory.As 3D NAND technology stacks to 128 layers or higher,peripheral circuits may account for more than 50%of the overall chip area.On the contrast,the Xtacking^TM technology arranges array and logic parts on two different wafers,and connects the memory arrays to the logic circuit by metal VIAs(Vertical Interconnect Accesses)to achieve unprecedented high storage density as well as DRAM level I/O speed.As a consequence,it becomes increasingly significant to monitor metal VIAs depth before wafer bonding process as to ensure reliability of array-logic connections.Currently,AFM(Atom Force Microscopy)is the main stream method of VIA depth monitoring.Apparently,AFM wins the battle of precision,however the low throughput limited its usage in mass production.In order to accomplish the requirement of VLSI production,a WLI(White Light Interference)metrology is revisited and a novel WLI method was developed to monitor VIAs depth.Basically there are two major limitations that keep WLI tools from wider use,transparent film impact and diffraction limitation.In this work,the engineering solutions are illustrated and inline dishing measurement is achieved with high accuracy and precision.
