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Weierstrass-Mandelbrot分形曲面的多重分形谱 被引量:2
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作者 吕建国 戴结林 +1 位作者 宋学萍 孙兆奇 《功能材料》 EI CAS CSCD 北大核心 2008年第9期1574-1576,共3页
构造了不同分形维数的Weierstrass-Man-delbrot(W-M)分形曲面,采用多重分形方法研究了W-M曲面表面高度的分布特征。结果表明,随着曲面分形维数的增加,多重分形谱的谱宽Δα从0.082增大到0.215,说明曲面的起伏、粗糙程度随分形维数的增... 构造了不同分形维数的Weierstrass-Man-delbrot(W-M)分形曲面,采用多重分形方法研究了W-M曲面表面高度的分布特征。结果表明,随着曲面分形维数的增加,多重分形谱的谱宽Δα从0.082增大到0.215,说明曲面的起伏、粗糙程度随分形维数的增加不断增大,与方均根rms粗糙度σ的计算结果一致。分形谱的Δf均>0,表明曲面上高度最大处数目多于高度最小处数目,曲面的峰位处比较平缓、圆润。 展开更多
关键词 weierstrass-mandelbrot(w-m)曲面 分形 维数 多重分形谱 粗糙度
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Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond 被引量:1
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作者 Song YUAN Xiaoguang GUO +2 位作者 Hao WANG Renke KANG Shang GAO 《Friction》 SCIE EI CAS CSCD 2024年第6期1119-1132,共14页
The roughness of the contact surface exerts a vital role in rubbing.It is still a significant challenge to understand the microscopic contact of the rough surface at the atomic level.Herein,the rough surface with a sp... The roughness of the contact surface exerts a vital role in rubbing.It is still a significant challenge to understand the microscopic contact of the rough surface at the atomic level.Herein,the rough surface with a special root mean square(RMS)value is constructed by multivariate Weierstrass–Mandelbrot(W–M)function and the rubbing process during that the chemical mechanical polishing(CMP)process of diamond is mimicked utilizing the reactive force field molecular dynamics(ReaxFF MD)simulation.It is found that the contact area A/A0 is positively related with the load,and the friction force F depends on the number of interfacial bridge bonds.Increasing the surface roughness will increase the friction force and friction coefficient.The model with low roughness and high lubrication has less friction force,and the presence of polishing liquid molecules can decrease the friction force and friction coefficient.The RMS value and the degree of damage show a functional relationship with the applied load and lubrication,i.e.,the RMS value decreases more under larger load and higher lubrication,and the diamond substrate occurs severer damage under larger load and lower lubrication.This work will generate fresh insight into the understanding of the microscopic contact of the rough surface at the atomic level. 展开更多
关键词 DIAMOND random roughness reactive force field molecular dynamics(ReaxFF MD) friction weierstrass-mandelbrot(w-m)function chemical mechanical polishing(CMP)
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