BACKGROUND Neuroendoscopy is a very useful technique to Chronic Subdural Hematoma(CSH).But how to achieve the goal of treatment more minimally invasive?AIM To develop a simple,fast and accurate preoperative planning m...BACKGROUND Neuroendoscopy is a very useful technique to Chronic Subdural Hematoma(CSH).But how to achieve the goal of treatment more minimally invasive?AIM To develop a simple,fast and accurate preoperative planning method in our way for endoscopic surgery of patients with CSH.METHODS From June 2018 to May 2020,forty-two patients with CSH,admitted to our hospital,were performed endoscopic minimally invasive surgery;computed tomography(CT)imaging was employed to locate the intracerebral hematoma and select the appropriate endoscopic approach before the endoscopic surgery.The clinical data and treatment efficacy were analyzed.RESULTS According to the learning of CT scanning images,the surgeon can accurately design the best minimally invasive neuroendoscopic surgical approach and realize the precise positioning and design of the drilling site of the skull and the size of the bone window,so as to provide the most effective operation space with the smallest bone window.In this group,the average operation time was only about 1 h,and the clearance rate of hematoma was about 95%.CONCLUSION Patients with CSH can achieve good therapeutic effect by using our way to positioning and design to assist the operation of CSH according to CT scan and image,and our way is very useful and necessary.展开更多
Based on a stochastic wire length distributed model, the interconnect distribution of a three-dimensional integrated circuit (3D IC) is predicted exactly. Using the results of this model, a global interconnect design ...Based on a stochastic wire length distributed model, the interconnect distribution of a three-dimensional integrated circuit (3D IC) is predicted exactly. Using the results of this model, a global interconnect design window for a giga-scale system-on-chip (SOC) is established by evaluating the constraints of 1) wiring resource, 2) wiring bandwidth, and 3) wiring noise. In comparison to a two-dimensional integrated circuit (2D IC) in a 130-nm and 45-nm technology node, the design window expands for a 3D IC to improve the design reliability and system performance, further supporting 3D IC application in future integrated circuit design.展开更多
文摘BACKGROUND Neuroendoscopy is a very useful technique to Chronic Subdural Hematoma(CSH).But how to achieve the goal of treatment more minimally invasive?AIM To develop a simple,fast and accurate preoperative planning method in our way for endoscopic surgery of patients with CSH.METHODS From June 2018 to May 2020,forty-two patients with CSH,admitted to our hospital,were performed endoscopic minimally invasive surgery;computed tomography(CT)imaging was employed to locate the intracerebral hematoma and select the appropriate endoscopic approach before the endoscopic surgery.The clinical data and treatment efficacy were analyzed.RESULTS According to the learning of CT scanning images,the surgeon can accurately design the best minimally invasive neuroendoscopic surgical approach and realize the precise positioning and design of the drilling site of the skull and the size of the bone window,so as to provide the most effective operation space with the smallest bone window.In this group,the average operation time was only about 1 h,and the clearance rate of hematoma was about 95%.CONCLUSION Patients with CSH can achieve good therapeutic effect by using our way to positioning and design to assist the operation of CSH according to CT scan and image,and our way is very useful and necessary.
基金supported by the National Natural Science Foundation of China (Grant Nos. 60725415 and 60676009)the Natural Science and Technology Major Project of the Ministry of Science and Technology of China (Grant No. 2009ZX01034-002-001-005)
文摘Based on a stochastic wire length distributed model, the interconnect distribution of a three-dimensional integrated circuit (3D IC) is predicted exactly. Using the results of this model, a global interconnect design window for a giga-scale system-on-chip (SOC) is established by evaluating the constraints of 1) wiring resource, 2) wiring bandwidth, and 3) wiring noise. In comparison to a two-dimensional integrated circuit (2D IC) in a 130-nm and 45-nm technology node, the design window expands for a 3D IC to improve the design reliability and system performance, further supporting 3D IC application in future integrated circuit design.
