Effect of the thickness of InGaN interlayer on a-plane GaN epilayer

In this paper,we use the a-plane InGaN interlayer to improve the property of a-plane GaN.Based on the a-InGaN interlayer,a template exhibits that a regular,porous structure,which acts as a compliant effect,can be obtained to release the strain caused by the lattice and thermal mismatch between a-GaN and r-sapphire.We find that the thickness of InGaN has a great influence on the growth of a-GaN.The surface morphology and crystalline quality both are first improved and then deteriorated with increasing the thickness of the InGaN interlayer.When the InGaN thickness exceeds a critical point,the a-GaN epilayer peels off in the process of cooling down to room temperature.This is an attractive way of lifting off a-GaN films from the sapphire substrate.

Effects of V/III ratio on the growth of a-plane GaN films

The non-polar a-plane GaN is grown on an r-plane sapphire substrate directly without a buffer layer by metal- organic chemical vapour deposition and the effects of V/III ratio growth conditions are investigated. Atomic force microscopy results show that triangular pits are formed at a relatively high V/III ratio, while a relatively low V/III ratio can enhance the lateral growth rate along the c-axis direction. The higher V/III ratio leads to a high density of pits in comparison with the lower V/III ratio. The surface morphology is improved greatly by using a low V/III ratio of 500 and the roughness mean square of the surface is only 3.9 nm. The high resolution X-ray diffraction characterized crystal structural results show that the rocking curve full width at half maximum along the m axis decreases from 0.757° to 0.720°, while along the c axis increases from 0.220° to 0.251° with the V/III increasing from 500 μmol/min to 2000 μmol/min, which indicates that a relatively low V/III ratio is conducible to the c-axis growth of a-plane GaN.

Effects of V/Ⅲ ratio on a-plane GaN epilayers with an InGaN interlayer

The effects of V/Ill growth flux ratio on a-plane GaN films grown on r-plane sapphire substrates with an InGaN interlayer are investigated. The surface morphology, crystalline quality, strain states, and density of basal stacking faults were found to depend heavily upon the V/III ratio. With decreasing V/III ratio, the surface morphology and crystal quality first improved and then deteriorated, and the density of the basal-plane stacking faults also first decreased and then increased. The optimal V/III ratio growth condition for the best surface morphology and crystalline quality and the smallest basal-plane stacking fault density of a-GaN films are found. We also found that the formation of basal-plane stacking faults is an effective way to release strain.

Optical and structural investigation of a-plane GaN layers on r-plane sapphire with nucleation layer optimization

Nonpolar a-plane GaN epilayers are grown on several r-plane sapphire substrates by metal organic chemical vapour deposition using different nucleation layers： （A） a CaN nucleation layer deposited at low temperature （LT）; （B） an A1N nucleation layer deposited at high temperature; or （C） an LT thin AIN nucleation layer with an AIN layer and an A1N/A1CaN superlattice both subsequently deposited at high temperature. The samples have been characterized by Xray diffraction （XRD）, atomic force microscopy and photoluminescence. The GaN layers grown using nucleation layers B and C show narrower XRD rocking curves than that using nucleation layer A, indicating a reduction in crystal defect density. Furthermore, the GaN layer grown using nucleation layer C exhibits a surface morphology with triangular defect pits eliminated completely. The improved optical property, corresponding to the enhanced crystal quality, is also confirmed by temperature-dependent and excitation power-dependent photoluminescence measurements.

Growth of a-Plane GaN Films on r-Plane Sapphire by Combining Metal Organic Vapor Phase Epitaxy with the Hydride Vapor Phase Epitaxy

Hydride vapor phase epitaxy （HVPE） is utilized to grow nonpolar a-plane GaN layers on r-plane sapphire templates prepared by metal organic vapor phase epitaxy （MOVPE）. The surface morphology and microstructures of the samples are characterized by atomic force microscopy. The full width at half maximum （FWHM） of the HVPE sample shows a W-shape and that of the MOVPE sample shows an M-shape plane with the degree of 0 in the high-resolution x-ray diffraction （HRXRD） results. The surface morphology attributes to this significant anisotropic. HRXRD reveals that there is a significant reduction in the FWHM, both on-axis and off-axis for HVPE GaN are compared with the MOVPE template. The decrease of the FWHM of E2 （high） Raman scat tering spectra further indicates the improvement of crystal quality after HVPE. By comparing the results of secondary- ion-mass spectroscope and photoluminescence spectrum of the samples grown by HVPE and MOVPE, we propose that C-involved defects are originally responsible for the yellow luminescence.

Morphological and Microstructural Evolution and Related Impurity Incorporation in Non-Polar a-Plane GaN Grown on r-Sapphire Substrates

Effects of the growth temperature on morphological and microstructural evolution of a-plane GaN films grown on r-plane sapphires by metal organic chemical vapor deposition are investigated by atomic force microscopy and secondary ion mass spectroscopy （SIMS）. Surface morphology, structural quality and related impurity incorpora- tion are very sensitive to the growth temperature. A significant difference of yellow luminescence is observed and attributed to the incorporation of carbon into GaN films, which is confirmed by SIMS analysis. Our results show that the sample with triangular-pit morphology has sample with pentagon-like pit morphology, which is significantly higher concentrations of oxygen than the other induced by the existence of an N-face in triangular pits.

Structural and optical investigation of nonpolar a-plane GaN grown by metal-organic chemical vapour deposition on r-plane sapphire by neutron irradiation

Nonpolar （1150） a-plane GaN films are grown by metal-organic chemical vapour deposition （MOCVD） on r-plane （1102） sapphire. The samples are irradiated with neutrons under a dose of 1× 1015 cm-2. The surface morphology, the crystal defects and the optical properties of the samples before and after irradiation are analysed using atomic force microscopy （AFM）, high resolution X-ray diffraction （HRXRD） and photoluminescence （PL）. The AFM result shows deteriorated sample surface after the irradiation. Careful fitting of the XRD rocking curve is carried out to obtain the Lorentzian weight fraction. Broadening due to Lorentzian type is more obvious in the as-grown sample compared with that of the irradiated sample, indicating that more point defects appear in the irradiated sample. The variations of line width and intensity of the PL band edge emission peak are consistent with the XRD results. The activation energy decreases from 82.5 meV to 29.9 meV after irradiation by neutron.

Stress and morphology of a nonpolar a-plane GaN layer on r-plane sapphire substrate

The anisotropic strain of a nonpolar （1120） a-plane GaN epilayer on an r-plane （1102） sapphire substrate, grown by low-pressure metal-organic vapour deposition is investigated by Raman spectroscopy. The room-temperature Raman scattering spectra of nonpolar a-plane GaN are measured in surface and edge backscattering geometries. The lattice is contracted in both the c- and the m-axis directions, and the stress in the m-axis direction is larger than that in the c-axis direction. On the surface of this sample, a number of cracks appear only along the m-axis, which is confirmed by the scanning electron micrograph. Atomic force microscopy images reveal a significant decrease in the root-mean-square roughness and the density of submicron pits after the stress relief.

Improvement in a-plane GaN crystalline quality using wet etching method

Nonpolar （1120） GaN films are grown on the etched a-plane GaN substrates via metalorganic vapor phase epitaxy. High-resolution X-ray diffraction analysis shows great decreases in the full width at half maximum of the samples grown on etched substrates compared with those of the sample without etching, both on-axis and off-axis, indicating the reduced dislocation densities and improved crystalline quality of these samples. The spatial mapping of the E2 （high） phonon mode demonstrates the smaller line width with a black background in the wing region, which testifies the reduced dislocation densities and enhanced crystalline quality of the epitaxial lateral overgrowth areas. Raman scattering spectra of the E2 （high） peaks exhibit in-plane compressive stress for all the overgrowth samples, and the E2 （high） peaks of samples grown on etched substrates shift toward the lower frequency range, indicating the relaxations of in-plane stress in these GaN films. Furthermore, room temperature photoluminescence measurement demonstrates a significant decrease in the yellow-band emission intensity of a-plane GaN grown on etched templates, which also illustrates the better optical properties of these samples.

The etching of a-plane GaN epilayers grown by metal-organic chemical vapour deposition

Morphology of nonpolar （1120） a-plane GaN epilayers on r-plane （1102） sapphire substrate grown by low-pressure metal-organic vapour deposition was investigated after KOH solution etching. Many micron- and nano-meter columns on the a-plane GaN surface were observed by scanning electron microscopy. An etching mechanism model is proposed to interpret the origin of the peculiar etching morphology. The basal stacking fault in the a-plane GaN plays a very important role in the etching process.

Effects of Ⅴ/Ⅲ ratio on species diffusion anisotropy inthe MOCVD growth of non-polar a-plane GaN films

Non-polar a-plane （1120） GaN films have been grown on r-plane （1102） sapphire substrates by metal organic chemical vapour deposition. The influences of V/III ratio on the species diffusion anisotropy of a-plane GaN films were investigated by scanning electron microscopy, cathodoluminescence and high-resolution x-ray diffraction measurements. The anisotropy of a-plane GaN films may result from the different migration length of adatoms along two in-plane directions. V/III ratio has an effect on the growth rates of different facets and crystal quality. The stripe feature morphology was obviously observed in the film with a high V/III ratio because of the slow growth rate along the [1100] direction. When the V/III ratio increased from 1000 to 6000, the in-plane crystal quality anisotropy was decreased due to the weakened predominance in migration length of gallium adatoms.

Effects of Mg-doping temperature on the structural and electrical properties of nonpolar a-plane p-type GaN films

Nonpolar(11–20) a-plane p-type GaN films were successfully grown on r-plane sapphire substrate with the metal–organic chemical vapor deposition(MOCVD) system. The effects of Mg-doping temperature on the structural and electrical properties of nonpolar p-type GaN films were investigated in detail. It is found that all the surface morphology, crystalline quality, strains, and electrical properties of nonpolar a-plane p-type GaN films are interconnected, and are closely related to the Mg-doping temperature. This means that a proper performance of nonpolar p-type GaN can be expected by optimizing the Mg-doping temperature. In fact, a hole concentration of 1.3×10^(18)cm^(-3), a high Mg activation efficiency of 6.5%,an activation energy of 114 me V for Mg acceptor, and a low anisotropy of 8.3% in crystalline quality were achieved with a growth temperature of 990℃. This approach to optimizing the Mg-doping temperature of the nonpolar a-plane p-type GaN film provides an effective way to fabricate high-efficiency optoelectronic devices in the future.

0.2~2.0GHz100W超宽带GaN功率放大器

设计并实现了一款基于0.25μm GaN高电子迁移率晶体管(HEMT)工艺的100 W超宽带功率放大器。基于SiC无源工艺设计了集成无源器件(IPD)输入预匹配电路芯片;设计了基于陶瓷基片的T型集成输出预匹配电路;基于建立的传输线变压器(TLT)的精确模型,设计了宽带阻抗变换器,在超宽频带内将50Ω的端口阻抗变换至约12.5Ω,再通过多节微带电路与预匹配后的GaN HEMT芯片实现阻抗匹配。最终,以较小的电路尺寸实现了功率放大器的超宽带性能指标。测试结果表明,功率放大器在0.2~2.0 GHz频带内,在漏极电压36 V、输入功率9 W、连续波的工作条件下,输出功率大于103 W,漏极效率大于50%,输入电压驻波比(VSWR)≤2.5。

VHF频段小型化千瓦级GaN功率放大器

为了满足VHF频段对高功率放大器小型化的需求,设计并制备了一款基于05μm GaN高电子迁移率晶体管(HEMT)工艺的VHF频段小型化千瓦级功率放大器。通过采用多节微带电容网络和高介电常数的印制电路板(PCB)实现了末级功率放大器匹配电路的小型化;以高通滤波器作为级间匹配电路,在减小电路尺寸的同时,提高了链路增益;采用混合集成工艺,实现了电源调制器、前级驱动功率放大器和末级功率放大器等各单元的小型化高密度集成。测试结果表明,在024~030 GHz频带内,该功率放大器的工作电压为50 V,工作脉宽为100μs,在占空比10%、输入功率10 dBm的工作条件下,带内输出功率大于1000 W,功率附加效率约为60%~69%,功率增益大于50 dB,功放体积为46 mm×30 mm×6 mm。

InGaN/GaN量子阱悬空微盘发光二极管

设计并制备了三种不同结构的电泵浦InGaN/GaN量子阱微盘发光器件,对其光增益和光损耗进行了分析和优化。以p型层的结构为分类标准,器件Ⅰ为圆柱形;器件Ⅱ为器件Ⅰ的悬空结构;器件Ⅲ是悬空的圆环形结构。实验和仿真结果表明,三种器件结构中,器件Ⅱ的结果最好。电极布局为内p外n型的圆柱形器件表面电流分布能够保证发光区和微腔高增益区重合,悬空结构能够降低微盘在垂直方向上的光损耗,有利于更好的光学增益。考虑到共振模式,器件Ⅱ在注入电流大于0.7 mA时,器件Ⅱ实现了峰值波长为408.2 nm、半峰宽为2.62 nm的振荡模式输出。这种电泵浦InGaN/GaN量子阱悬浮微盘二极管器件的设计思路对电泵浦微盘或微环激光器的研制具有重要参考意义。

石墨烯插入层对蓝宝石上GaN材料的应力调制

较大的晶格失配和热失配使得异质外延生长的GaN材料具有很高的残余应力,对材料和器件的性能产生重要影响。在蓝宝石衬底和GaN外延层之间插入一层石墨烯,通过Raman光谱和弯曲度测试分析了石墨烯插入层对GaN材料应力的影响。Raman测试结果表明,蓝宝石衬底上GaN材料压应力为0.56 GPa,引入石墨烯插入层后GaN材料压应力为0.08 GPa。弯曲度测试结果表明无石墨烯插入层的蓝宝石上GaN材料弯曲度约为21.74μm,引入石墨烯插入层后弯曲度约为1.39μm,引入石墨烯插入层的GaN材料弯曲度显著降低。讨论了石墨烯插入层对蓝宝石上GaN材料的应力调制机制,验证了石墨烯插入层技术对于异质衬底上获得完全弛豫GaN外延层的可行性。

大尺寸GaN微波材料范德瓦耳斯外延机理及应力调控研究

本文基于金属有机化学气相沉积(MOCVD)技术,以少层氮化硼(BN)作为插入层在4英寸蓝宝石衬底上开展范德瓦耳斯异质外延GaN微波材料的生长机理及应力调控方面的研究,探讨了AlN成核工艺对GaN缓冲层生长机制的影响,以及与材料晶体质量、应力及电学性能等之间的关联。提出了一种基于AlN/AlGaN复合成核技术的应力调控方案,首次实现了大尺寸范德瓦耳斯(vdW)异质外延材料应力的有效管控,研制的GaN微波材料的弯曲度(Bow)为+20.4μm,(002)/(102)面半峰全宽为471.6/933.5 arcsec,表面均方根粗糙度为0.52 nm,电子迁移率达到2000 cm^(2)/(V·s)。最后,基于机械剥离实现了大尺寸晶圆级GaN微波材料与蓝宝石衬底的分离,为高导热衬底转移提供便利,为大功率射频器件的制作创造条件。

GAN与Diffusion在传统纹样设计中的实验研究

传统纹样是中国优秀传统文化的重要组成部分,传统人工设计已经无法满足纹样的现代设计需求,生成式AI为传统纹样设计提供了新的设计路径和方法。文章将生成式AI应用于传统纹样设计中,通过适配实验优选基于GAN的Style GAN和基于Diffusion的Stable Diffusion两种主流图像生成模型进行实验,采用技术分析与艺术分析相结合,对实验结果进行多角度、多维度对比分析,为设计师选择生成设计方法提供参照。实验结果表明,两个模型均能满足基本的艺术设计需求。Style GAN模型生成的纹样图像更接近真实图像的分布,具有更高的图像质量和多样性;Stable Diffusion模型能较好地传承传统纹样的基因,艺术性与创造性兼具,更加符合传统纹样的艺术设计需求。

基于GaN器件与磁集成技术的车载充电机实验平台研究

随着新能源汽车的普及,对车载充电机的要求越来越高。为了有效提升整机效率和功率密度,将GaN器件与磁集成技术应用于车载充电机,进行了实验平台研究。基于GaN器件设计了两级式车载充电机拓扑结构与外围电路,通过制作磁集成平面变压器,优化了CLLC变换器,完成了整机控制程序设计及2kW车载充电机实验样机搭建,并对样机进行了实验测试与波形分析。实验结果表明,实验样机具有良好的稳态特性与动态特性,整机功率因数在0.98以上,满载峰值效率达到95.22%。该平台能够帮助学生加深对电力电子技术的认识,掌握新型电力电子器件的特性及应用,锻炼实践操作能力,提高相关课程的教学质量。

低成本高结晶GaN纳米线柔性薄膜制备及其场发射性能

旨在探究非贵金属Cu替代贵金属Au作为催化剂在柔性碳膜上制备高结晶的GaN纳米线的可行性,并研究其场发射特性及机理。采用非贵金属Cu替代贵金属Au作为催化剂,在柔性碳膜上制备了直径为20~100 nm、长度为3~15μm的高结晶的GaN纳米线,并通过工艺参数对其结构与尺寸进行调控,得到GaN纳米线薄膜的催化生长机制。通过对其场发射特性进行研究,发现其场发射性能与其纳米结构紧密相关,催化剂厚度以及薄膜弯曲状态可显著影响其场发射性能。结果表明,采用Cu作为催化剂所制备的GaN纳米线柔性薄膜的场发射电流具有较好的稳定性。该研究为GaN纳米线的低成本制备方法提供了可借鉴思路,同时也为场发射柔性器件的制作提供了可行的技术手段。