The structures of the Si/Cu heterogenous interface impacted by a nanoindenter with different incident angles and depths are investigated in detail using molecular dynamics simulation.The simulation results suggest tha...The structures of the Si/Cu heterogenous interface impacted by a nanoindenter with different incident angles and depths are investigated in detail using molecular dynamics simulation.The simulation results suggest that for certain incident angles,the nanoindenter with increasing depth can firstly increase the stress of each atom at the interface and it then introduces more serious structural deformation of the Si/Cu heterogenous interface.A nanoindenter with increasing incident angle（absolute value） can increase the length of the Si or Cu extended atom layer.It is worth mentioning that when the incident angle of the nanoindenter is between-45° and 45°,these Si or Cu atoms near the nanoindenter reach a stable state,which has a lower stress and a shorter length of the Si or Cu extended atom layer than those of the other incident angles.This may give a direction to the planarizing process of very large scale integration circuits manufacture.展开更多
基金Project supported by the Tribology Science Fund of State Key Laboratory of Tribology,China(Grant No.SKLTKF12A01)the National Natural Science Foundation of China(Grant No.11474123)+1 种基金the Natural Science Foundation of Jilin Province of China(Grant No.20130101011JC)the Fundamental Research Funds for Central Universities at Jilin University,China
文摘The structures of the Si/Cu heterogenous interface impacted by a nanoindenter with different incident angles and depths are investigated in detail using molecular dynamics simulation.The simulation results suggest that for certain incident angles,the nanoindenter with increasing depth can firstly increase the stress of each atom at the interface and it then introduces more serious structural deformation of the Si/Cu heterogenous interface.A nanoindenter with increasing incident angle（absolute value） can increase the length of the Si or Cu extended atom layer.It is worth mentioning that when the incident angle of the nanoindenter is between-45° and 45°,these Si or Cu atoms near the nanoindenter reach a stable state,which has a lower stress and a shorter length of the Si or Cu extended atom layer than those of the other incident angles.This may give a direction to the planarizing process of very large scale integration circuits manufacture.
