Ceramic thermal wind sensor based on advanced direct chip attaching package

An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.

Advanced Micro Narrows Gap in Race for New Chip

90纳米制程生产就是使一张芯片能容纳更多的晶体管或使现行的芯片体积变得更小,并且在增加功能,提高效率的同时降低价格。90纳米制程生产对半导体制造公司来说一直是意义重大,这种工艺可以使这个工业的生产能力增加一倍,提高了生产效率。美国先进微器件公司在转向这种新的90纳米制程生产方面一直落后于因特尔公司和国际商用机器公司这两个对手。但它已成功地转向生产64比特芯片,并开始从与国际商用机器公司联盟中获益,避免了90纳米制程生产上的一些易犯的错误。