Preparation of Mg-Yb alloy film by electrolysis in the molten LiCl-KCl-YbCl_3 system at low temperature

The electrochemical behavior of Yb3+ and electrodeposition of Mg-Yb alloy film at solid magnesium cathode in the molten LiCl-KCl-YbCl3(2 wt.%) system at 773 K was investigated.Transient electrochemical techniques,such as cyclic voltammetry,chronopotentiometry and chronoamperometry were used in order to explore the deposition mechanism of Yb.The reduction process of Yb3+ is stepwise reactions which are single-electron and double-electron reversible charge transfer reactions.The speed control step was a diffu...

Magnetic Properties and Heat-Treatment of Electrodeposited Sm-Co Alloy Films

Dense, adhesive and uniform Sm-Co alloy films were prepared by potentiostatic electrolysis on copper substrates in urea-acetamide-NaBr-KBr melt at 353 K, which were observed by SEM. The electroreduction of Co2+ and Sm3+ was investigated by cyclic voltammetry. The reduction of Co2+ is an irreversible process. Sm3+ can not be reduced alone, but Sm-Co can be co-deposited by induced deposition. The films could be crystallized by heat-treatment at different temperature from 723 to 923 K under Ar atmosphere. The annealed time was chosen as 30 s. The phases of deposited and annealed films were investigated by XRD. The content of Sm was analyzed by Inductive Coupled Plasma Emission Spectrometer (ICPES). The hysteresis loops of the Sm-Co alloy films have been measured by Vibrating Sample Magnetometer (VSM). The experimental results reveal that, the heat-treatment has important influence on coercive field Hc and remanent squareness S of Sm-Co alloy films; the deposited Sm-Co alloy films are amorphous, while the annealed those become polycrystalline; in addition, the magnetocrystalline anisotropy and preferring orientation of films depend strongly on the contents of crystal phases.

Electrochemical Preparation of La-Ni Alloy Film in Acetamide-Urea-NaBr Melting System

The reduction of Ni(Ⅱ) is an irreversible reaction and La(Ⅲ) cannot be reduced to La directly but be co-deposited inductively in the present of Ni(Ⅱ) in the Acetamide-Urea-NaBr molten salt electrolyte at 353 K. The uncrystallized alloy film of La-Ni is obtained by potentiostatic electrolysis, and the amount of La grows with increasing cathodic overpotential, molar ratios of La(Ⅲ) to Ni(Ⅱ) and the electrolysis time. The maximum amount of La in alloy film reaches to 78.81% (mass fraction) in present study.

Electrochemical Preparation of La-Fe Alloy Films in Dimethylsulfoxide (DMSO)

The cyclic voltammetry and potential step methods were used to investigate the electrochemical behavior of Fe 2+ and La 3+ in FeCl 2 LiCl DMSO and LaCl 3 LiCl DMSO systems on Pt, Cu and Ni cathodes. The electroreduction of Fe 2+ to Fe is irreversible in one step,while the electroreduction of La 3+ to La is quasi reversible. The diffusion coefficient of La 3+ in LaCl 3 LiCl DMSO system at 298 K was 3 1×10 -6 cm 2·s -1 . The diffusion coefficient and transfer coefficient of Fe 2+ in FeCl 2 LiCl DMSO system at 298 K were 2 54×10 -6 cm 2·s -1 and 0 24, respectively. La Fe alloy films containing La from 22 7% to 37 1% (mass fraction) were prepared by potentiostatic electrolysis on Cu substrates at a deposition potential from -1 750 to -2 450 V (vs SCE). The fine La Fe alloy films were also obtained by pulse electrolysis at a pulse current densities from 2 to 6 mA·cm -2 . The surfaces of these alloy films are smooth, adhesive and uniform, and have metallic luster.

Electrodeposition of Pr-Fe alloy films in urea-dimethylsulfoxide

Cyclic voltammetry and chronoamperometry were used to investigate theelectrochemical behavior of Pr^(3+) ions in a system of 0.01 mol centre dot dm^(-3) Pr(CH_3SO_3)_3 +0.01 mol centre dot dm^(-3) FeCl_2 + 3.0 mol centre dot dm^(-3) urea + DMSO on a R electrode. Someelectrochemical parameters were measured. Potentiostatic depositions between -1.6 and -2.4 V wereapplied to deposit Pr-Fe films in urea-DMSO mixed solution. The Pr content in the alloy films was inthe range of 34.89 wt. percent to 37.15 wt. percent. The Pr-Fe alloy films are proven to beamorphous by XRD (X-ray diffraction).

Preparation of Dy-Bi alloy films by electrodeposition in organic bath

The cyclic voltammetry and potentiostatic electrolysis were used toinvestigate the preparing of Dy-Bi alloy films in LiCl-DMSO (dimethylsulfoxide) system. The effectsof several factors including the potential of deposition, concentrations of main salts, and theconcentration ratio of DyCl_3 to Bi(NO_3)_3 were studied. Dy-Bi alloy films containing 4.82%-80.62%(mass fraction) dysprosium were prepared in DyCl_3-Bi(NO_3)_3-LiCl-DMSO system by controlling thesystem composition and deposition conditions. The films are gray, uniform, metallic luster andadhere firmly to the copper substrates analyzed by SEM (scanning electron microscope), EDS (X-rayenergy dispersive analysis), and XRD (X-ray diffraction). After heat treatment at 718 K for 1 h, thealloy phase of Dy-Bi was found in XRD patterns.

STUDY ON CO-ELECTRODEPOSITION OF Bi-Fe ALLOY FILMS IN ORGANIC BATH

The cyclic voltametry and potentiostatic electrolysis was used to investigate the preparation of Bi-Fe alloy films in LiClO4-DMSO (dimethylsulfoxide) system. The effects of several factors including the potential of deposition, current density and concentration of iron and bismuth in the solution on the Fe content in the alloy deposits were studied. Experimental results indicated that the amorphous alloy films of Bi-Fe containing Fe 4.40wt%-33.67wt% could be prepared by controlling the system composition and deposition conditions. They were gray, uniform, metallic luster and adhered firmly to the copper substrates analyzed by EDS, SEM and XRD. After heat treatment of crystallization at 270℃ for 1h, the crystal phase of Bi-Fe can be found in XRD patterns.

Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

The Tm-Ni-Co alloy films have been prepared by the sweep potential deposition technique. The surface appear-ance of Tm-Ni-Co alloy films was silver smooth and adhesive. The surfaces of Tm-Ni-Co alloy films observed by scanningelectron microscope (SEM) were uniform, adhesive and compact. The sizes of metallic grains were about 80-100nm,100-200nm, 50-60nm, and 90-120nm at 1mV·s^(-1), 5mV·s^(-1), 10mV·s^(-1) and 50mV·s^(-1), respectively. The Tm-Ni-Co alloy film wasamorphous as proven by the X-ray diffraction(XRD).

Studies on Preparation of Co-Bi Alloy Films by Electrodeposition From Nonaqueous Medium

Cyclic voltammetry and potentiostatic electrolysis were used to investigate the preparation of Co-Bi alloy films in a LiClO 4-DMSO system. The experimental results indicate that the Co-Bi alloy films containing 14 35%-29 77% Co can be prepared via potentionstatic electrolysis on Cu substrates, at deposition potential -1 10--1 65 V( vs. SCE) and by controlling the system composition and deposition condition. They are uniform gray films with a metallic luster and they are adhered firmly to the Cu substrate. The films were analyzed by EDS, SEM and XRD. After heat treatment of crystallization at 275 ℃ for 1 h, the alloy phase of Co-Bi can be confirmed via the XRD pattern.

Electrochemical investigation on the formations of Dy-Ni alloy films in dimethylformamide

The elexctrochemical properties of Dy (III), Ni(II) + Ni(II) indimethylformamide were studied by cyclic voltammetry on Pt or Cuelectrode. Black, metallic lustered, compact and well adhesive Dy-Nialloy films can be co-deposited on Cu electrode bysweeping-potential-deposition method within some potentials. SEM,EDAX and XRD were used to analyze the alloy films. The Dy content inthe Dy-Ni alloy film is up to 56.91/100 (mass fraction) and the Dy-Ni alloy films are amorphous.

Oxidation of Ion Plated Ni—Cr Alloy Film at 300℃

Investigation by using LAS 3000 surface analysis system showed that the oxide of Fe, Cr,Al formed during oxidation were Cr_2O_3,Fe_2O_3 and Al_2O_3,but only small amount of nickel oxide was found. The composition of oxide layers for different oxidation durations varied in a similar way. In all cases,there exists an oxygen concentration peak in the composition profile of oxide layer. There is a transitional zone between oxide layer and alloy film.The thickness of oxide layer increases logarithmically with the time of oxida- tion.The ion plated Ni-Cr alloy film has very dense oxide layer and good oxidation resistance.

Formation and Characterization of Pd,Pt and Pd-Pt Alloy Films on Polyimide by Catalyst-Enhanced Chemical Vapor Deposition

Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition （CVD） in the carrier gas （N2, O2） at 220-300℃ under reduced pressure and normal pressure. The deposition of palladium complexes [ Pd（（η3-allyl）（hfac） and Pd（hfac）2 ] gives pure palladium film, while the deposition of platinum needs the enhancement of palladium complex by mixing precursor platinum complex Pt（COD）Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd/Pt atomic ratios vary under different co-deposition conditions. These metal films were characterized by XPS and SEM, and show a good adhesive property.

THE MAGNETORESISTANT BEHAVIOR OF Ni_(85)Fe_(15) ALLOY FILM IMPLANTED BYCo^+

Implanting 1 ×1016 to1 ×1017 Co+/cm2 into Ni85 Fe15 alloy film anditschangesof mag netoresistantcharacters were researched . The results show that Co+ is very spectacular on modifying Ni85 Fe15 alloyfilm’s magnetoresistancecharacters. Atlower dose,theanisotrop ic magnetoresistivity ratio( AMR) and thesaturated magnetic field didn’tchange almost. ATmedium dose, the saturated magnetic field does not have great change either, butits AMRisraised from 1 % upto 3% . Thisiscomparabletothebest AMRvalueof permalloy based magnetoresistant material prepared by other methods. But the ion implantation tech niqueisrathersimpler. Whentheimplanting doseishigher,its AMRisalsoenhanced notice ably. However,theincreaseof saturated field saysthe material’sstructurecharacters have changed radically.

Electrodeposition of Er-Ni Alloy Film in Dimethylsulfoxide

The cyclic voltammetry and chronoamperometry were used to investigate the electrochemical behaviors of Er(Ⅲ) and Ni(Ⅱ) in LiClO 4 DMSO(dimethylsufoxide) system on Pt and Cu electrodes. Experimental results indicated that the reduction of Er(Ⅲ) to Er and Ni(Ⅱ) to Ni were irreversible in one step on Pt and Cu electrodes. The diffusion coefficient and electron transfer coefficient of Er(Ⅲ) in 0.01 mol·L -1 ErCl 3 -0.1 mol·L -1 LiClO 4 DMSO system at 303K were 1.47×10 -10 m 2·s -1 and 0.108 respectively, and the diffusion coefficient and electron transfer coefficient of Ni(Ⅱ) in 0.01 mol·L -1 NiCl 2-0.1 mol·L -1 LiClO 4 DMSO system at 303K were 3.38×10 -10 m 2·s -1 and 0.160 respectively. The homogeneous, strong adhesive Er Ni alloy films with metallic lu- stre was prepared by potentiostatic electrolysis on Cu electrode in ErCl 3 NiCl 2 LiClO 4 DMSO system at -1.90～ -2.55 V (vs SCE).

Analysis of the current density characteristics in through-mask electrochemical micromachining(TMEMM) for fabrication of micro-hole arrays on invar alloy film

Invar alloy consisting of 64% iron and 36% nickel has been widely used for the production of shadow masks for organic light emitting diodes（OLEDs） because of its low thermal expansion coefficient（1.86 × 10^-6cm/°C）.To fabricate micro-hole arrays on 30 lm invar alloy film,through-mask electrochemical micromachining（TMEMM） was developed and combined with a portion of the photolithography etching process.For precise hole shapes,patterned photoresist（PR） film was applied as an insulating mask.To investigate the relationship between the current density and the material removal rate,the principle of the electrochemical machining was studied with a focus on the equation.The finite element method（FEM） was used to verify the influence of each parameter on the current density on the invar alloy film surface.The parameters considered were the thickness of the PR mask,inter-electrode gap（IEG）,and electrolyte concentration.Design of experiments（DOE） was used to figure out the contribution of each parameter.A simulation was conducted with varying parameters to figure out their relationships with the current density.Optimization was conducted to select the suitable conditions.An experiment was carried out to verify the simulation results.It was possible to fabricate micro-hole arrays on invar alloy film using TMEMM,which is a promising method that can be applied to fabrications of OLEDs shadow masks.

Preparation of Er-Fe Alloy Films in Dimethylsulfoxide by Electrodeposition Method

Cyclic voltammetry and chronoamperometry were used to investigate the electrochemical behavior of Fe(Ⅱ) and Er(Ⅲ) in a LiClO 4 DMSO(dimethylsufoxide) system at Pt and Cu electrodes. Experimental results indicate that the reductions of Fe(Ⅱ) to Fe(0) and Er(Ⅲ) to Er(0) were irreversible at Pt and Cu electrodes. The diffusion coefficient and the electron transfer coefficient of Fe(Ⅱ) in a 0 01 mol/L FeCl 2 0 1 mol/L LiClO 4 DMSO system at 303 K were 1 70×10 -10 m 2/s and 0 08 respectively, the diffusion coefficient and the electron transfer coefficient of Er(Ⅲ) in a 0 01 mol/L ErCl 3 0 1mol/L LiClO 4 DMSO system at 303 K were 1 47×10 -10 m 2/s and 0 108 respectively. The homogeneous, strong adhesive Er Fe alloy films containing Er of 31 39%-42 12% in mass fraction with metallic lustre were prepared by potentiostatic electrolysis on a Cu electrode in a ErCl 3 FeCl 2 LiClO 4 DMSO system at -1 75--2 50 V( vs . SCE).

Effect of Ti Content on Properties of Al-Ti Alloy Film for Address Lines of TFT-LCDs

mploying pure aluminum for address lines of TFT-LCDs has a severe problem of hillock formation at elevated temperature. However, in the case of large TFT-LCDs more than 254 mm, it is impossible to use refractory metals for address lines because of their high resistivity. The Al-Ti alloy films for address lines of TFT-LCDs were studied and it was found that Al-Ti alloy film has excellent resistance of Al-Ti alloy to hillocks. The effect of Ti content on properties of Al-Ti alloy film was investigated.

Shape memory alloy film damping for smart miniature systems

This paper presents a dynamic analysis of the free and forced vibration of a free-standing bridge of superelastic shape memory alloy TiNiCuCo film with ultra-low fatigue properties and evaluates its versatility for novel miniature scale damping applications.A thermodynamics-based finite element model is used to simulate the evolution of martensite phase fraction during load-induced martensitic phase transformation.The effects of pre-strain,strain rate and excitation load on the hysteresis of stress-strain characteristics are investigated in order to assess damping energies.The analysis is performed under non-isothermal conditions taking into account heat transfer and rate-dependence of release and absorption of latent heat.We show that damping energy can be maximized by applying an optimum pre-strain.A maximum damping capacity of 0.17 is determined for the case of complete stressstrain hysteresis loop during phase transformation.

Effects of atomic corrugations on electronic structures in Pb_(1-x)Bi_(x) thin films

We carried out experimental investigations of the geometric effect on the electronic behavior in Pb_(1-x)Bi_(x) thin films by scanning tunneling microscopy and spectroscopy.Single crystal monolayer Pb_(0.74)Bi_(0.26) and two-monolayer Pb_(0.75)Bi_(0.25)Pb_(1-x)Bi_(x) thin films were fabricated by molecular beam epitaxy,where large surface corrugations were observed.Combined with tunneling spectroscopic measurements,it is found that atomic corrugations can widely change the electronic behaviors.These findings show that the Pb_(1-x)Bi_(x) system can be a promising platform to further explore geometry-decorated electronic behavior in two-dimensional metallic thin films.

Growth of carbon nanotube arrays on various CtxMey alloy films by chemical vapour deposition method

Carbon nanotube （CNT） arrays were fabricated on Ct-Me-N-（O） alloys with content of Ct in the range of 6-40 at.% by chemical vapour deposition. The Ct was a catalytic metal from the group of the following elements： Ni, Co, Fe, Pd, while Me was a transition metal from the group of IV-VII of the periodic table （where Me=Ti, V, Cr, Zr, Nb, Mo, Ta, W, Re）. Carbon nanotubes were found to grow efficiently on the alloy surface with its composition containing Ti, V, Cr, Zr, Hf, Nb or Ta. The growth of CNTs was not observed when the alloy contained W or Re. Additions of oxygen and nitrogen in the alloy facilitated the formation of oxynitrides and catalyst extrusion on the alloy surface. Replacement of the metals in alloy composition affected the diameter of the resulting CNTs. The obtained results showed that the alloy films of varying thickness （10-500 nm） may be used for the CNTs growth. The resulting CNT material was highly homogenous and its synthesis reproducible.