The objective of this work is to simulate a single quantum well ultraviolet light emitting diode(LED) based on AlGaN/GaN/AlGaN and AlGaN/BGaN/AlGaN, by using TCAD Silvaco simulator. The first structure has a GaN quant...The objective of this work is to simulate a single quantum well ultraviolet light emitting diode(LED) based on AlGaN/GaN/AlGaN and AlGaN/BGaN/AlGaN, by using TCAD Silvaco simulator. The first structure has a GaN quantum well taken between two layers, of n-AlGaN and p-AlGaN. The second one has a BGaN quantum well instead of GaN. We fix the concentration of the boron in BGaN to only 1% and we vary the thickness of GaN and BGaN quantum well layer from 7 to 20 nm, for the two structures. As results, we obtain respectively for GaN-LED and BGaN-LED, a maximum current of 0.52 and 0.27 mA, a maximum power spectral density of 1.935 and 6.7 W cm^(-1) eV^(-1), a maximum spontaneous emission of 3.34 × 10^(28) and 3.43 × 10^(28) s^(-1) cm^(-3) eV^(-1), and a maximum Light output power of 0.56 and 0.89 mW.展开更多
Lattice-matched InAlN/AlN/GaN high electron mobility transistors (HEMTs) grown on sapphire substrate by using low-pressure metallorganic chemical vapor deposition were prepared, and the comprehensive DC characteristic...Lattice-matched InAlN/AlN/GaN high electron mobility transistors (HEMTs) grown on sapphire substrate by using low-pressure metallorganic chemical vapor deposition were prepared, and the comprehensive DC characteristics were implemented by Keithley 4200 Semiconductor Characterization System. The experimental results indicated that a maximum drain current over 400 mA/mm and a peak external transconductance of 215 mS/mm can be achieved in the initial HEMTs. However, after the devices endured a 10-h thermal aging in furnace under nitrogen condition at 300 ℃, the maximum reduction of saturation drain current and external transconductance at high gate-source voltage and drain-source voltage were 30% and 35%, respectively. Additionally, an increased drain-source leakage current was observed at three-terminal off-state. It was inferred that the degradation was mainly related to electron-trapping defects in the InAlN barrier layer.展开更多
Most reports on the fabrication of high-quality Gallium nitride (GaN) are typically based on physical techniques that require very expensive equipment. Therefore, the electrodeposition was adopted and examined to deve...Most reports on the fabrication of high-quality Gallium nitride (GaN) are typically based on physical techniques that require very expensive equipment. Therefore, the electrodeposition was adopted and examined to develop a simple and economical method for GaN synthesis. GaN films are synthesized on aluminum substrates that are heat-treated at various temperatures using a low-cost and low-temperature electrochemical deposition technique. The electrochemical behavior of source ions in aqueous solutions is examined by cyclic voltammetry (CV).?In the solution at pH 1.5 containing 0.1M Ga(NO3)3, 2.5 M NH4NO3 and 0.6 M H3BO3, reduction of gallium and nitrate ions are observed in CV. The presence of hexagonal GaN and gallium oxide (Ga2O3) phases is detected for the films deposited on Al substrates at -3.5 mA•cm-2 for 3 h. The energy dispersive X-ray and mapping results reveal that Ga, O, and N coexist in these films. Raman analysis shows hexagonal GaN formation on Al substrates. The changes in the morphology and preferred orientation of GaN were found, which was caused by the reactivity of aluminum surface and the aluminum oxide layer formed by the heat treatment.展开更多
The effect of a high temperature AlN buffer layer grown by the initially alternating supply of ammonia （IASA） method on AlGaN/GaN heterostructures was studied. The use of AlN by the IASA method can effectively incre...The effect of a high temperature AlN buffer layer grown by the initially alternating supply of ammonia （IASA） method on AlGaN/GaN heterostructures was studied. The use of AlN by the IASA method can effectively increase the crystalline quality and surface morphology of GaN. The mobility and concentration of 2DEG of AlGaN/GaN heterostuctures was also ameliorated.展开更多
基金supported by the University of Abou-Bekr-Belkaid, Materials and Renewable Energy Research Unit, Tlemcen, Algeria
文摘The objective of this work is to simulate a single quantum well ultraviolet light emitting diode(LED) based on AlGaN/GaN/AlGaN and AlGaN/BGaN/AlGaN, by using TCAD Silvaco simulator. The first structure has a GaN quantum well taken between two layers, of n-AlGaN and p-AlGaN. The second one has a BGaN quantum well instead of GaN. We fix the concentration of the boron in BGaN to only 1% and we vary the thickness of GaN and BGaN quantum well layer from 7 to 20 nm, for the two structures. As results, we obtain respectively for GaN-LED and BGaN-LED, a maximum current of 0.52 and 0.27 mA, a maximum power spectral density of 1.935 and 6.7 W cm^(-1) eV^(-1), a maximum spontaneous emission of 3.34 × 10^(28) and 3.43 × 10^(28) s^(-1) cm^(-3) eV^(-1), and a maximum Light output power of 0.56 and 0.89 mW.
基金Supported by National Natural Science Foundation of China(No.60876009)Natural Science Foundation of Tianjin(No.09JCZDJC16600)
文摘Lattice-matched InAlN/AlN/GaN high electron mobility transistors (HEMTs) grown on sapphire substrate by using low-pressure metallorganic chemical vapor deposition were prepared, and the comprehensive DC characteristics were implemented by Keithley 4200 Semiconductor Characterization System. The experimental results indicated that a maximum drain current over 400 mA/mm and a peak external transconductance of 215 mS/mm can be achieved in the initial HEMTs. However, after the devices endured a 10-h thermal aging in furnace under nitrogen condition at 300 ℃, the maximum reduction of saturation drain current and external transconductance at high gate-source voltage and drain-source voltage were 30% and 35%, respectively. Additionally, an increased drain-source leakage current was observed at three-terminal off-state. It was inferred that the degradation was mainly related to electron-trapping defects in the InAlN barrier layer.
文摘Most reports on the fabrication of high-quality Gallium nitride (GaN) are typically based on physical techniques that require very expensive equipment. Therefore, the electrodeposition was adopted and examined to develop a simple and economical method for GaN synthesis. GaN films are synthesized on aluminum substrates that are heat-treated at various temperatures using a low-cost and low-temperature electrochemical deposition technique. The electrochemical behavior of source ions in aqueous solutions is examined by cyclic voltammetry (CV).?In the solution at pH 1.5 containing 0.1M Ga(NO3)3, 2.5 M NH4NO3 and 0.6 M H3BO3, reduction of gallium and nitrate ions are observed in CV. The presence of hexagonal GaN and gallium oxide (Ga2O3) phases is detected for the films deposited on Al substrates at -3.5 mA•cm-2 for 3 h. The energy dispersive X-ray and mapping results reveal that Ga, O, and N coexist in these films. Raman analysis shows hexagonal GaN formation on Al substrates. The changes in the morphology and preferred orientation of GaN were found, which was caused by the reactivity of aluminum surface and the aluminum oxide layer formed by the heat treatment.
基金Project supported by the Key Program of the National Natural Science Foundation of China(No.60736033)the National Key S&T Special Project(No.2008ZX0101002-003)the National Defense Scientific and Technical Pre-Research Program of China(Nos. 51311050112,51308030102,51308040301)
文摘The effect of a high temperature AlN buffer layer grown by the initially alternating supply of ammonia （IASA） method on AlGaN/GaN heterostructures was studied. The use of AlN by the IASA method can effectively increase the crystalline quality and surface morphology of GaN. The mobility and concentration of 2DEG of AlGaN/GaN heterostuctures was also ameliorated.
