A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the ...A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the A1N/A1 composites, and attention was focused on the effects of sintefing parameters on the relative density, microstructure and, in particular, thermal conductivity behavior of the composites. The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure. The composites sintered at 1550℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity, corresponding to 99% and 97.5 W.m-1.K-1, respectively. However, the thermal conductivity of present A1N/A1 composites is still far below the theoretical value. Possible reasons for this deviation were discussed.展开更多
Aluminum oxide(Al_(2)O_(3))ceramics have been widely utilized as circuit substrates owing to their exceptional performance.In this study,boron nitride microribbon(BNMR)/Al_(2)O_(3)composite ceramics are prepared using...Aluminum oxide(Al_(2)O_(3))ceramics have been widely utilized as circuit substrates owing to their exceptional performance.In this study,boron nitride microribbon(BNMR)/Al_(2)O_(3)composite ceramics are prepared using spark plasma sintering(SPS).This study examines the effect of varying the amount of toughened phase BNMR on the density,mechanical properties,dielectric constant,and thermal conductivity of BNMR/Al_(2)O_(3)composite ceramics while also exploring the mechanisms behind the toughening and increased thermal conductivity of the fabricated ceramics.The results showed that for a BNMR content of 5 wt%,BNMR/Al_(2)O_(3)composite ceramics displayed more enhanced characteristics than pure Al_(2)O_(3)ceramics.In particular,the relative density,hardness,fracture toughness,and bending strength were 99.95%±0.025%,34.11±1.5 GPa,5.42±0.21 MPa·m^(1/2),and 375±2.5 MPa,respectively.These values represent increases of 0.76%,70%,35%,and 25%,respectively,compared with the corresponding values for pure Al_(2)O_(3)ceramics.Furthermore,during the SPS process,BNMRs are subjected to high temperatures and pressures,resulting in the bending and deformation of the Al_(2)O_(3)matrix;this leads to the formation of special thermal pathways within it.The dielectric constant of the composite ceramics decreased by 25.6%,whereas the thermal conductivity increased by 45.6%compared with that of the pure Al_(2)O_(3)ceramics.The results of this study provide valuable insights into ways of enhancing the performance of Al_(2)O_(3)-based ceramic substrates by incorporating novel BNMRs as a second phase.These improvements are significant for potential applications in circuit substrates and related fields that require high-performance materials with improved mechanical properties and thermal conductivities.展开更多
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the A1N/A1 composites, and attention was focused on the effects of sintefing parameters on the relative density, microstructure and, in particular, thermal conductivity behavior of the composites. The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure. The composites sintered at 1550℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity, corresponding to 99% and 97.5 W.m-1.K-1, respectively. However, the thermal conductivity of present A1N/A1 composites is still far below the theoretical value. Possible reasons for this deviation were discussed.
基金the financial support from National Natural Science Foundation of China(No.52262010)the Guangxi Natural Science Foundation of China(No.2023GXNSFAA026384)the Guilin Scientific Research and Technology Development Program(No.2020011203-3).
文摘Aluminum oxide(Al_(2)O_(3))ceramics have been widely utilized as circuit substrates owing to their exceptional performance.In this study,boron nitride microribbon(BNMR)/Al_(2)O_(3)composite ceramics are prepared using spark plasma sintering(SPS).This study examines the effect of varying the amount of toughened phase BNMR on the density,mechanical properties,dielectric constant,and thermal conductivity of BNMR/Al_(2)O_(3)composite ceramics while also exploring the mechanisms behind the toughening and increased thermal conductivity of the fabricated ceramics.The results showed that for a BNMR content of 5 wt%,BNMR/Al_(2)O_(3)composite ceramics displayed more enhanced characteristics than pure Al_(2)O_(3)ceramics.In particular,the relative density,hardness,fracture toughness,and bending strength were 99.95%±0.025%,34.11±1.5 GPa,5.42±0.21 MPa·m^(1/2),and 375±2.5 MPa,respectively.These values represent increases of 0.76%,70%,35%,and 25%,respectively,compared with the corresponding values for pure Al_(2)O_(3)ceramics.Furthermore,during the SPS process,BNMRs are subjected to high temperatures and pressures,resulting in the bending and deformation of the Al_(2)O_(3)matrix;this leads to the formation of special thermal pathways within it.The dielectric constant of the composite ceramics decreased by 25.6%,whereas the thermal conductivity increased by 45.6%compared with that of the pure Al_(2)O_(3)ceramics.The results of this study provide valuable insights into ways of enhancing the performance of Al_(2)O_(3)-based ceramic substrates by incorporating novel BNMRs as a second phase.These improvements are significant for potential applications in circuit substrates and related fields that require high-performance materials with improved mechanical properties and thermal conductivities.
