5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analy...5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis（PCA） is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device（SMD） process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.展开更多
In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can conv...In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can convert electric power into visible light directly the homomorphism of semiconductor devices, with high efficiency and small energy consumption, good light quality, use safety, long service life, green environmental protection, flexible control as this is common lamps and lanterns is incomparable advantage. Therefore, it is considered to be 21 century of a new generation of lighting source. Based on the superiority of LED, it is widely applied in many fields of lighting. To enhance the traditional solar based pure LED system, we enhance it with the combination of the wind power and the optimized controller that holds specific meaning.展开更多
基金This project is supported by National Natural Science Foundation of China (No.70372062)Hi-Tech Program of Tianjin city,China (No.04310881R).
文摘5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis（PCA） is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device（SMD） process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.
文摘In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can convert electric power into visible light directly the homomorphism of semiconductor devices, with high efficiency and small energy consumption, good light quality, use safety, long service life, green environmental protection, flexible control as this is common lamps and lanterns is incomparable advantage. Therefore, it is considered to be 21 century of a new generation of lighting source. Based on the superiority of LED, it is widely applied in many fields of lighting. To enhance the traditional solar based pure LED system, we enhance it with the combination of the wind power and the optimized controller that holds specific meaning.
