A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transist...A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transistors. The chip is designed to provide standard framing and mapping of 10/100/1000Mbit/s Ethernet, Resilient Packet Ring （RPR） and E1 traffics into protected Synchronous Digital Hierarchy （SDH） STM-1 transport payloads using hitless rate adaptation for optimum bandwidth utilization. It consumes 4W of power on average and utilizes 756 pin enhanced BGA package.展开更多
文摘A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transistors. The chip is designed to provide standard framing and mapping of 10/100/1000Mbit/s Ethernet, Resilient Packet Ring （RPR） and E1 traffics into protected Synchronous Digital Hierarchy （SDH） STM-1 transport payloads using hitless rate adaptation for optimum bandwidth utilization. It consumes 4W of power on average and utilizes 756 pin enhanced BGA package.
