Triggering scheme is a significant factor that may influence the process of vacuum arc initiation. In this work, the characteristics of resistance triggering of a pulsed vacuum arc ion source are investigated and comp...Triggering scheme is a significant factor that may influence the process of vacuum arc initiation. In this work, the characteristics of resistance triggering of a pulsed vacuum arc ion source are investigated and compared with the independent pulse generator triggering. The results show that although the resistance triggering method is capable of triggering a vacuum arc ion source by properly choosing the resistance and electric parameters, it inevitably increases the rise time of the arc current. A high speed multiframe camera is used to reveal the transition process o~ arc initiation during one shot. From the images it is conjectured that the lower voltage between the cathode and the anode may be the reason that leads to the lower transition speed of discharge at the moment of arc initiation.展开更多
The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper（W-Cu） contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy（SEM） and trans...The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper（W-Cu） contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy（SEM） and transmission electron microscopy（TEM） were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.展开更多
TiN films were deposited on stainless steel substrates by arc ion plating. The influence of an axial magnetic field was examined with regard to the microstructure, chemical elemental composition, mechanical properties...TiN films were deposited on stainless steel substrates by arc ion plating. The influence of an axial magnetic field was examined with regard to the microstructure, chemical elemental composition, mechanical properties and wear resistance of the films. The results showed that the magnetic field puts much effect on the preferred orientation, chemical composition, hardness and wear resistance of TiN films. The preferred orientation of the TiN films changed from（111） to（220） and finally to the coexistence of（111） and（220） texture with the increase in the applied magnetic field intensity. The concentration of N atoms in the TiN films increases with the magnetic field intensity, and the concentration of Ti atoms shows an opposite trend. At first, the hardness and elastic modulus of the TiN films increase and reach a maximum value at 5 m T and then decrease with the further increase in the magnetic field intensity. The high hardness was related to the N/Ti atomic ratio and to a well-pronounced preferred orientation of the（111） planes in the crystallites of the film parallel to the substrate surface. The wear resistance of the Ti N films was significantly improved with the application of the magnetic field, and the lowest wear rate was obtained at magnetic field intensity of 5 m T. Moreover, the wear resistance of the films was related to the hardness H and the H3/E＊2 ratio in the manner that a higher H3/E＊2 ratio was conducive to the enhancement of the wear resistance.展开更多
基金Supported by the National Natural Science Foundation of China under Grant Nos 11105130 and 11475156
文摘Triggering scheme is a significant factor that may influence the process of vacuum arc initiation. In this work, the characteristics of resistance triggering of a pulsed vacuum arc ion source are investigated and compared with the independent pulse generator triggering. The results show that although the resistance triggering method is capable of triggering a vacuum arc ion source by properly choosing the resistance and electric parameters, it inevitably increases the rise time of the arc current. A high speed multiframe camera is used to reveal the transition process o~ arc initiation during one shot. From the images it is conjectured that the lower voltage between the cathode and the anode may be the reason that leads to the lower transition speed of discharge at the moment of arc initiation.
文摘The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper（W-Cu） contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy（SEM） and transmission electron microscopy（TEM） were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.
基金financially supported by the National Natural Science Foundation of China (No. 51171197)
文摘TiN films were deposited on stainless steel substrates by arc ion plating. The influence of an axial magnetic field was examined with regard to the microstructure, chemical elemental composition, mechanical properties and wear resistance of the films. The results showed that the magnetic field puts much effect on the preferred orientation, chemical composition, hardness and wear resistance of TiN films. The preferred orientation of the TiN films changed from（111） to（220） and finally to the coexistence of（111） and（220） texture with the increase in the applied magnetic field intensity. The concentration of N atoms in the TiN films increases with the magnetic field intensity, and the concentration of Ti atoms shows an opposite trend. At first, the hardness and elastic modulus of the TiN films increase and reach a maximum value at 5 m T and then decrease with the further increase in the magnetic field intensity. The high hardness was related to the N/Ti atomic ratio and to a well-pronounced preferred orientation of the（111） planes in the crystallites of the film parallel to the substrate surface. The wear resistance of the Ti N films was significantly improved with the application of the magnetic field, and the lowest wear rate was obtained at magnetic field intensity of 5 m T. Moreover, the wear resistance of the films was related to the hardness H and the H3/E＊2 ratio in the manner that a higher H3/E＊2 ratio was conducive to the enhancement of the wear resistance.
