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The Research on Micro Electronic-Magnetic Forming of Sheet Metal
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作者 ZHAO Qing-juan GUO Bin +3 位作者 WANG Chun-ju SHAN De-bin YU Hai-ping LI Chun-feng 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2012年第S1期434-437,共4页
Micro channel of T2 copper were molding through electronic-magnetic forming experiments.Laser scanning confocal microscope and contourgraph were used to measure the section profile and sheet thickness.The effects of v... Micro channel of T2 copper were molding through electronic-magnetic forming experiments.Laser scanning confocal microscope and contourgraph were used to measure the section profile and sheet thickness.The effects of voltage,shape of channel and discharge cycles on laws of metal flow were studied.Results showed that forming depth of micro channel and thinning of sheet thickness increased as the increasing of the voltage.Mold-filling capacity of components formed by two molds with different structures had been increased when the voltage was increased.Mold with semicircle structure facilitate the material flow and the forming depth of parts was relative large.Semicircle structure was better than taper structure in mold-filling capacity.A number of small pulse discharges can improve the forming quality and deformation,but local thinning in sheet metal leads to non-uniform distribution of thickness. 展开更多
关键词 electromagnetic forming array microstructure foil board micro forming micro channel
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