In the past decades,Moore’s law drives the semiconductor industry to continuously shrink the critical size of transistors down to 7 nm.As transistors further downscaling to smaller sizes,the law reaches its limitatio...In the past decades,Moore’s law drives the semiconductor industry to continuously shrink the critical size of transistors down to 7 nm.As transistors further downscaling to smaller sizes,the law reaches its limitation,and the increase of transistors density on the chip decelerates.Up to now,extreme ultraviolet lithography has been used in some key steps,and it is facing alignment precision and high costs for high-volume manufacturing.Meanwhile,the introduction of new materials and 3D complex structures brings serious challenges for top-down methods.Thus,bottom-up schemes are believed to be necessary methods combined with the top-down processes.In this article,atomic level deposition methods are reviewed and categorized to extend Moore’s law and beyond.Firstly,the deposition brings lateral angstrom resolution to the vertical direction as well as top-down etching,such as double patterning,transfer of nanowires,deposition of nanotubes,and so on.Secondly,various template-assisted selective deposition methods including dielectric templates,inhibitors and correction steps have been utilized for the alignment of 3D complex structures.Higher resolution can be achieved by inherently selective deposition,and the underlying selective mechanism is discussed.Finally,the requirements for higher precision and efficiency manufacturing are also discussed,including the equipment,integration processes,scale-up issues,etc.The article reviews low dimensional manufacturing and integration of 3D complex structures for the extension of Moore’s law in semiconductor fields,and emerging fields including but not limited to energy,catalysis,sensor and biomedicals.展开更多
We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent bas...We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.展开更多
Chips are the carriers of ICs (integrated circuits). As a result of design, manufacturing, and packaging and testing processes, chips are typically wholly independent entities intended for immediate use. According to ...Chips are the carriers of ICs (integrated circuits). As a result of design, manufacturing, and packaging and testing processes, chips are typically wholly independent entities intended for immediate use. According to known data, one unit of chip output can drive up to ten units of output in the electronic information industry and 100 units of GDP (Gross Domestic Product). The Chip Information Industry is a strategic industry in most developed countries in Europe and North America. The development of the Chip Information Industry is related to national economies and personal livelihoods. Moore discovered a certain trend after analyzing data: in general, every newly produced chip has twice the capacity of the previous generation, and it takes 18 to 24 months for the next generation to be subsequently invented. This trend has come to be known as Moore’s Law. It applies not only to the development of memory chips but also to the evolutionary paths of processor capability and disk drive storage capacity. Moore’s Law has become the basis of performance prediction in several industries. However, since 2011, the size of silicon transistors has been approaching its physical limit at the atomic level. Due to the nature of silicon, additional breakthroughs in the running speed and performance of silicon transistors are severely limited. Elevated temperature and leakage are the two main sources that invalidate Moore’s Law. To counter these issues, This paper analyzes specific problems challenges in the Chip Information Industry, including the development of carbon nanotube chips and fierce competition in the international Chip Information Industry. In addition, this paper undertakes a critical analysis of the Chinese Chip Information Industry and countermeasures to Chinese Chip Information Industry development.展开更多
The matter about some far-going consequences commencing from the replacement of one of the basic principles of the traditional physics that is the principle of locality, with the recently put forward principle of boun...The matter about some far-going consequences commencing from the replacement of one of the basic principles of the traditional physics that is the principle of locality, with the recently put forward principle of boundedness is considered. It is proven that the thermodynamic theory which is explicitly grounded on the principle of locality, suffers inherent contradiction which roots lay down to the principle of locality. The way to overcome it goes via the replacement of the principle of locality with the recently put forward by the author principle of boundedness. In turn, the latter gives rise not only to a fundamentally novel notion for a number of ideas but also it yields replacement of the proportionality between the software and hardware components with a new non-extensive approach to the matter. It is proven that the famous Moore’s law stands in new reading both in its support and the way to overcome its limitations. Apart from its role for the technical applications, the present considerations stand also as a methodological example how the role of the basics of any theory affects practical rules such as the Moore’s law.展开更多
Today we witness the exponential growth of scientific research. This fast growth is possible thanks to the rapid development of computing systems since its first days in 1947 and the invention of transistor till the p...Today we witness the exponential growth of scientific research. This fast growth is possible thanks to the rapid development of computing systems since its first days in 1947 and the invention of transistor till the present days with high performance and scalable distributed computing systems. This fast growth of computing systems was first observed by Gordon E. Moore in 1965 and postulated as Moore’s Law. For the development of the scalable distributed computing systems, the year 2000 was a very special year. The first GHz speed processor, GB size memory and GB/s data transmission through network were achieved. Interestingly, in the same year the usable Grid computing systems emerged, which gave a strong impulse to a rapid development of distributed computing systems. This paper recognizes these facts that occurred in the year 2000, as the G-phenomena, a millennium cornerstone for the rapid development of scalable distributed systems evolved around the Grid and Cloud computing paradigms.展开更多
考虑到目前S-spar平台垂荡板数目是参考Truss Spar平台3块垂荡板的设计,而未结合平台本身特性进行深入研究,因此基于SESAM对S-spar平台进行频域分析,确定S-spar平台采用4块垂荡板更为合适。在4块垂荡板的S-spar平台频域分析的基础上,对...考虑到目前S-spar平台垂荡板数目是参考Truss Spar平台3块垂荡板的设计,而未结合平台本身特性进行深入研究,因此基于SESAM对S-spar平台进行频域分析,确定S-spar平台采用4块垂荡板更为合适。在4块垂荡板的S-spar平台频域分析的基础上,对系泊系统及立管进行耦合分析,对比有无立管情况,发现考虑立管后平台各自由度上运动显著减小。为解决立管张力过大的问题,在立管上安装浮子,讨论浮子位置、浮子浮力对立管张力的影响,确定安装500 k N的浮子在距立管悬垂段距顶端65%处为最优方案。展开更多
Gastric ulcer is a chronic disease featured with unexpected complications, including bleeding, stenosis and perforation, as well as a high incidence of recurrence. Clinical treatments for gastric ulcer have allowed th...Gastric ulcer is a chronic disease featured with unexpected complications, including bleeding, stenosis and perforation, as well as a high incidence of recurrence. Clinical treatments for gastric ulcer have allowed the rapid development of potent anti-ulcer drugs during the last several decades. Gastric ulcer healing is successful with conventional treatments including H2-receptor antagonists, and proton pump inhibitors(PPIs) have been essential for ulcer healing and prevention of complications. Additionally, Helicobacter pylori eradication therapy is effective in reducing ulcer recurrence and leads to physiological changes in the gastric mucosa which affect the ulcer healing process. However, in spite of these advancements, some patients have suf-fered from recurrence or intractability in spite of continuous anti-ulcer therapy. A new concept of the quality of ulcer healing(QOUH) was initiated that considers the reconstruction of the mucosal structure and its function for preventing ulcer recurrence. Although several gastroprotection provided these achievements of the QOUH, which PPI or other acid suppressants did not accomplish, we found that gastroprotection that originated from natural products, such as a newer formulation from either Artemisia or S-allyl cysteine from garlic, were very effective in the QOUH, as well as improving clinical symptoms with fewer side effects. In this review, we will introduce the importance of the QOUH in ulcer healing and the achievements from natural products.展开更多
With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not o...With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.展开更多
Low stress polishing is required for the manufacture of advanced integrated circuits(IC) with node sizes of 45 nm and smaller.However,the CMP community achieved the low stress by reducing the down force that press the...Low stress polishing is required for the manufacture of advanced integrated circuits(IC) with node sizes of 45 nm and smaller.However,the CMP community achieved the low stress by reducing the down force that press the wafer against a rotating pad.The reduced down force also decrease the removal rate of the wafer. As a result,the productivity suffers.In order to cope with this problem,an electrical potential is applied to the copper layer during polishing,in this case,the chemical oxidation is accelearated and hence the removal rate. Alternatively,the rotating pad must be softened to minimize the defects of wafers caused by CMP. In this research,we report a simpler solution to achieve low stress polishing without investing in new equipment and in developing new pad materials.The conventional CMP is proceeded by dressing the pad with a PCD dresser that can form 10×more asperities on the pad surface.The fluffy surface can then polish delicate IC without using the brutal force.As a result,the removal rate of wafers can be maintained without causing defectivity on the IC layer.展开更多
At an accelerating development pace, Hicro-Nano Satellite technology has become one of the most ac- tive research topics in the current aerospace field. Its applications have been extended from engineering education a...At an accelerating development pace, Hicro-Nano Satellite technology has become one of the most ac- tive research topics in the current aerospace field. Its applications have been extended from engineering education and technology demonstration into various other fields, such as communication, remote sensing, navigation and scientific experiments just to name a few, In this paper issues raised on Micro/Nano-Satellites in recent news are reviewed and the opportunities and challenges confronting Micro/Nano-Satellites are analyzed. Then the Plicro/nano-Satellites of Na- tional University of Defense Technology, (NUDT) are briefly introduced. Finally, some suggestions on the development of Micro/Nano-Satellites in the future are proposed.展开更多
基金the National Natural Science Foundation of China(51835005,51702106,51911540476,and 51575217)HUST state key lab project(DMETKF2019003)。
文摘In the past decades,Moore’s law drives the semiconductor industry to continuously shrink the critical size of transistors down to 7 nm.As transistors further downscaling to smaller sizes,the law reaches its limitation,and the increase of transistors density on the chip decelerates.Up to now,extreme ultraviolet lithography has been used in some key steps,and it is facing alignment precision and high costs for high-volume manufacturing.Meanwhile,the introduction of new materials and 3D complex structures brings serious challenges for top-down methods.Thus,bottom-up schemes are believed to be necessary methods combined with the top-down processes.In this article,atomic level deposition methods are reviewed and categorized to extend Moore’s law and beyond.Firstly,the deposition brings lateral angstrom resolution to the vertical direction as well as top-down etching,such as double patterning,transfer of nanowires,deposition of nanotubes,and so on.Secondly,various template-assisted selective deposition methods including dielectric templates,inhibitors and correction steps have been utilized for the alignment of 3D complex structures.Higher resolution can be achieved by inherently selective deposition,and the underlying selective mechanism is discussed.Finally,the requirements for higher precision and efficiency manufacturing are also discussed,including the equipment,integration processes,scale-up issues,etc.The article reviews low dimensional manufacturing and integration of 3D complex structures for the extension of Moore’s law in semiconductor fields,and emerging fields including but not limited to energy,catalysis,sensor and biomedicals.
文摘We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.
文摘Chips are the carriers of ICs (integrated circuits). As a result of design, manufacturing, and packaging and testing processes, chips are typically wholly independent entities intended for immediate use. According to known data, one unit of chip output can drive up to ten units of output in the electronic information industry and 100 units of GDP (Gross Domestic Product). The Chip Information Industry is a strategic industry in most developed countries in Europe and North America. The development of the Chip Information Industry is related to national economies and personal livelihoods. Moore discovered a certain trend after analyzing data: in general, every newly produced chip has twice the capacity of the previous generation, and it takes 18 to 24 months for the next generation to be subsequently invented. This trend has come to be known as Moore’s Law. It applies not only to the development of memory chips but also to the evolutionary paths of processor capability and disk drive storage capacity. Moore’s Law has become the basis of performance prediction in several industries. However, since 2011, the size of silicon transistors has been approaching its physical limit at the atomic level. Due to the nature of silicon, additional breakthroughs in the running speed and performance of silicon transistors are severely limited. Elevated temperature and leakage are the two main sources that invalidate Moore’s Law. To counter these issues, This paper analyzes specific problems challenges in the Chip Information Industry, including the development of carbon nanotube chips and fierce competition in the international Chip Information Industry. In addition, this paper undertakes a critical analysis of the Chinese Chip Information Industry and countermeasures to Chinese Chip Information Industry development.
文摘The matter about some far-going consequences commencing from the replacement of one of the basic principles of the traditional physics that is the principle of locality, with the recently put forward principle of boundedness is considered. It is proven that the thermodynamic theory which is explicitly grounded on the principle of locality, suffers inherent contradiction which roots lay down to the principle of locality. The way to overcome it goes via the replacement of the principle of locality with the recently put forward by the author principle of boundedness. In turn, the latter gives rise not only to a fundamentally novel notion for a number of ideas but also it yields replacement of the proportionality between the software and hardware components with a new non-extensive approach to the matter. It is proven that the famous Moore’s law stands in new reading both in its support and the way to overcome its limitations. Apart from its role for the technical applications, the present considerations stand also as a methodological example how the role of the basics of any theory affects practical rules such as the Moore’s law.
基金in part,supported by the European Commission through the EU FP7 SEE GRID SCI and SCI BUS projectsby the Grant 098-0982562-2567 awarded by the Ministry of Science,Education and Sports of the Republic of Croatia.
文摘Today we witness the exponential growth of scientific research. This fast growth is possible thanks to the rapid development of computing systems since its first days in 1947 and the invention of transistor till the present days with high performance and scalable distributed computing systems. This fast growth of computing systems was first observed by Gordon E. Moore in 1965 and postulated as Moore’s Law. For the development of the scalable distributed computing systems, the year 2000 was a very special year. The first GHz speed processor, GB size memory and GB/s data transmission through network were achieved. Interestingly, in the same year the usable Grid computing systems emerged, which gave a strong impulse to a rapid development of distributed computing systems. This paper recognizes these facts that occurred in the year 2000, as the G-phenomena, a millennium cornerstone for the rapid development of scalable distributed systems evolved around the Grid and Cloud computing paradigms.
文摘考虑到目前S-spar平台垂荡板数目是参考Truss Spar平台3块垂荡板的设计,而未结合平台本身特性进行深入研究,因此基于SESAM对S-spar平台进行频域分析,确定S-spar平台采用4块垂荡板更为合适。在4块垂荡板的S-spar平台频域分析的基础上,对系泊系统及立管进行耦合分析,对比有无立管情况,发现考虑立管后平台各自由度上运动显著减小。为解决立管张力过大的问题,在立管上安装浮子,讨论浮子位置、浮子浮力对立管张力的影响,确定安装500 k N的浮子在距立管悬垂段距顶端65%处为最优方案。
基金Supported by The National Center of Efficacy Evaluation for the Development of Health Products Targeting Digestive Disorders (NCEED) Grant (A102063) from the Ministry of Health and Welfare, South Korea
文摘Gastric ulcer is a chronic disease featured with unexpected complications, including bleeding, stenosis and perforation, as well as a high incidence of recurrence. Clinical treatments for gastric ulcer have allowed the rapid development of potent anti-ulcer drugs during the last several decades. Gastric ulcer healing is successful with conventional treatments including H2-receptor antagonists, and proton pump inhibitors(PPIs) have been essential for ulcer healing and prevention of complications. Additionally, Helicobacter pylori eradication therapy is effective in reducing ulcer recurrence and leads to physiological changes in the gastric mucosa which affect the ulcer healing process. However, in spite of these advancements, some patients have suf-fered from recurrence or intractability in spite of continuous anti-ulcer therapy. A new concept of the quality of ulcer healing(QOUH) was initiated that considers the reconstruction of the mucosal structure and its function for preventing ulcer recurrence. Although several gastroprotection provided these achievements of the QOUH, which PPI or other acid suppressants did not accomplish, we found that gastroprotection that originated from natural products, such as a newer formulation from either Artemisia or S-allyl cysteine from garlic, were very effective in the QOUH, as well as improving clinical symptoms with fewer side effects. In this review, we will introduce the importance of the QOUH in ulcer healing and the achievements from natural products.
文摘With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.
文摘Low stress polishing is required for the manufacture of advanced integrated circuits(IC) with node sizes of 45 nm and smaller.However,the CMP community achieved the low stress by reducing the down force that press the wafer against a rotating pad.The reduced down force also decrease the removal rate of the wafer. As a result,the productivity suffers.In order to cope with this problem,an electrical potential is applied to the copper layer during polishing,in this case,the chemical oxidation is accelearated and hence the removal rate. Alternatively,the rotating pad must be softened to minimize the defects of wafers caused by CMP. In this research,we report a simpler solution to achieve low stress polishing without investing in new equipment and in developing new pad materials.The conventional CMP is proceeded by dressing the pad with a PCD dresser that can form 10×more asperities on the pad surface.The fluffy surface can then polish delicate IC without using the brutal force.As a result,the removal rate of wafers can be maintained without causing defectivity on the IC layer.
文摘At an accelerating development pace, Hicro-Nano Satellite technology has become one of the most ac- tive research topics in the current aerospace field. Its applications have been extended from engineering education and technology demonstration into various other fields, such as communication, remote sensing, navigation and scientific experiments just to name a few, In this paper issues raised on Micro/Nano-Satellites in recent news are reviewed and the opportunities and challenges confronting Micro/Nano-Satellites are analyzed. Then the Plicro/nano-Satellites of Na- tional University of Defense Technology, (NUDT) are briefly introduced. Finally, some suggestions on the development of Micro/Nano-Satellites in the future are proposed.