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特高压新松换流站直流场设备抗震设计及能力考核 被引量:20
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作者 孙帮新 曹枚根 《高压电器》 CAS CSCD 北大核心 2018年第12期24-35,共12页
新松换流站是目前世界上海拔最高、抗震设防要求最高的特高压换流站,直流场设备抗震设计与考核是整个换流站抗震设计核心内容。首先介绍了直流场设备抗震解耦设计的基本思路,分析了直流场主要设备的结构特征和抗震薄弱环节,对直流场极... 新松换流站是目前世界上海拔最高、抗震设防要求最高的特高压换流站,直流场设备抗震设计与考核是整个换流站抗震设计核心内容。首先介绍了直流场设备抗震解耦设计的基本思路,分析了直流场主要设备的结构特征和抗震薄弱环节,对直流场极线设备分成了若干较为独立的耦联回路;其次,提出了换流站直流场设备的抗震设防水平及主要的地震动参数。通过采取选用复合材料、优化支架及设备结构、创新设备连接导体及金具、采用隔震减震等抗震新技术,可有效改善换流站直流场主要电气设备的抗震性能。通过开展特高压单体电气设备的抗震计算和地震模拟振动台试验,考核结果表明,新松换流站主要特高压电气设备具备承受峰值为400 Gal确定性场地波强震作用下的抗震能力。相关研究及应用对今后类似地震高烈度地区换流站抗震设计提供了有效的解决方案。 展开更多
关键词 特高压 换流站 直流场 电气设备 抗震设计 能力考核
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Analysis of the interdigitated back contact solar cells:The n-type substrate lifetime and wafer thickness 被引量:1
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作者 张巍 陈晨 +5 位作者 贾锐 孙昀 邢钊 金智 刘新宇 刘晓文 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第10期638-643,共6页
The n-type silicon integrated-back contact(IBC) solar cell has attracted much attention due to its high efficiency,whereas its performance is very sensitive to the wafer of low quality or the contamination during hi... The n-type silicon integrated-back contact(IBC) solar cell has attracted much attention due to its high efficiency,whereas its performance is very sensitive to the wafer of low quality or the contamination during high temperature fabrication processing, which leads to low bulk lifetime τbulk. In order to clarify the influence of bulk lifetime on cell characteristics, two-dimensional(2D) TCAD simulation, combined with our experimental data, is used to simulate the cell performances, with the wafer thickness scaled down under various τbulk conditions. The modeling results show that for the IBC solar cell with high τbulk,(such as 1 ms-2 ms), its open-circuit voltage V oc almost remains unchanged, and the short-circuit current density J sc monotonically decreases as the wafer thickness scales down. In comparison, for the solar cell with low τbulk(for instance, 〈 500 μs) wafer or the wafer contaminated during device processing, the V oc increases monotonically but the J sc first increases to a maximum value and then drops off as the wafer's thickness decreases. A model combing the light absorption and the minority carrier diffusion is used to explain this phenomenon. The research results show that for the wafer with thinner thickness and high bulk lifetime, the good light trapping technology must be developed to offset the decrease in J sc. 展开更多
关键词 LIFETIME wafer thickness interdigitated back contact solar cells technology computer-aided de- sign
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国内小家电市场安全质量的调查及整改思考
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作者 吴昭阳 《电子质量》 2018年第4期51-53,共3页
该文通过小家电市场安全质量的调查,较深刻的剖析了存在的不安全隐患,并提出了整改建议。
关键词 标记 保护接地端子 电源线 抗震性 伪产品
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